Search Results (112)

This paper presents an online efficiency optimization strategy for a six-phase induction generator (6PIG) operating in both healthy and faulty modes for micro-hydropower applications. The proposed method is based on an extended Loss Model Control (LMC) approach, in which the direct axis stator current Id is dynamically optimized in real time to minimize the total electrical losses. Unlike conventional LMC strategies, this method explicitly incorporates switching losses into the loss model, along with stator and rotor copper losses and iron losses. The optimization problem is solved using a numerical minimization routine, allowing the control system to adapt continuously to variations in torque requests. The proposed approach is validated under both healthy and faulty configurations of the 6PIG. It is implemented and tested through simulation in MATLAB/Simulink^® and experimentally validated on a 24 kW squirrel cage six-phase induction generator (SC6PIG). The results are compared in terms of power losses, energy saving, and efficiency. Full article

This study presents a bioinspired phase-change transparent flexible heater (PTFH) for programmable droplet manipulation under ultralow voltage. By embedding a self-junctioned copper nanowire network into paraffin-infused, porous PVDF-HFP gel matrices, the PTFH achieves rapid, non-contact, and reversible control of microdroplet mobility. The PTFH can be bent or tailored into diverse shapes (e.g., V/X configurations), enabling multidirectional droplet transport. Under ultralow voltage actuation (<1 V), the surface of PTFH melts the phase-change lubricant within 2 s, switching surface wettability from high adhesion (Wenzel state) to low adhesion (SLIPS state). By combining Laplace pressure and temperature gradients (up to 22 °C/mm), drive droplets at ~2.0 mm/s over distances of ~13.9 mm. Programmable droplet coalescence, curved-surface transport, and a microreactor design for batch reactions were also demonstrated. The PTFH exhibits excellent transparency (89% when activated), mechanical flexibility, and cyclic stability, offering a versatile platform for microreactors, microengines, and smart windows. Full article

The development of high-performance electrochromic materials demands innovative approaches to simultaneously control the nanoscale architecture and the electronic structure. We present a dual-modification strategy that synergistically combines copper doping with the Langmuir–Blodgett (LB) assembly to overcome the traditional performance trade-offs in tungsten oxide-based electrochromic systems. Cu-doped W₁₈O₄₉ nanowires with varying Cu concentrations (0–12 mol%) were synthesized hydrothermally and assembled into thin films via the LB technique, with LB precursors characterized by contact angle, surface tension, viscosity, and thermogravimetric-differential scanning calorimetry (TG-DSC) analyses. The films were systematically evaluated using scanning electron microscopy, X-ray photoelectron spectroscopy, chronoamperometry, and transmittance spectroscopy. Experimental results reveal an optimal Cu-doping concentration of 8 mol%, achieving a near-infrared optical modulation amplitude of 76.24% at 1066 nm, rapid switching kinetics (coloring/bleaching: 5.0/3.0 s), and a coloration efficiency of 133.00 cm²/C. This performance is speculated to be a balance between Cu-induced improvements in ion intercalation kinetics and LB-ordering degradation caused by lattice strain and interfacial charge redistribution, while mitigating excessive doping effects such as structural deterioration and thermodynamic instability. The work establishes a dual-modification framework for designing high-performance electrochromic interfaces, emphasizing the critical role of surface chemistry and nanoscale assembly in advancing adaptive optoelectronic devices like smart windows. Full article

In this paper, we present the analysis of functional alloy samples containing metals aluminum (Al), copper (Cu), lead (Pb), silicon (Si), tin (Sn), and zinc (Zn) using a Q-switched Nd laser operating at a wavelength of 532 nm with a pulse duration of 5 ns. Nine pelletized alloy samples were prepared, each containing varying chemical concentrations (wt.%) of Al, Cu, Pb, Si, Sn, and Zn—elements commonly used in electrotechnical and thermal functional materials. The laser beam is focused on the target surface, and the resulting emission spectrum is captured within the temperature interval of $9.0\times {10}^3$ to $1.1\times {10}^4$ K using a set of compact Avantes spectrometers. Each spectrometer is equipped with a linear charged-coupled device (CCD) array set at a 2 μs gate delay for spectrum recording. The quantitative analysis was performed using calibration-free laser-induced breakdown spectroscopy (CF-LIBS) under the assumptions of optically thin plasma and self-absorption-free conditions, as well as local thermodynamic equilibrium (LTE). The net normalized integrated intensities of the selected emission lines were utilized for the analysis. The intensities were normalized by dividing the net integrated intensity of each line by that of the aluminum emission line (Al II) at 281.62 nm. The results obtained using CF-LIBS were compared with those from the laser ablation time-of-flight mass spectrometer (LA-TOF-MS), showing good agreement between the two techniques. Furthermore, a random forest technique (RFT) was employed using LIBS spectral data for sample classification. The RFT technique achieves the highest accuracy of ~98.89% using out-of-bag (OOB) estimation for grouping, while a 10-fold cross-validation technique, implemented for comparison, yields a mean accuracy of ~99.12%. The integrated use of LIBS, LA-TOF-MS, and machine learning (e.g., RFT) enables fast, preparation-free analysis and classification of functional metallic materials, highlighting the synergy between quantitative techniques and data-driven methods. Full article

W-Cu composites are widely used in the fields of switch contact materials and electronic packages because of their high hardness, high plasticity, and excellent thermal conductivity, while the traditional W-Cu composite preparation process is often accompanied by problems such as a long production cycle, difficulties in the processing of shaped parts, and difficulties in guaranteeing the uniformity. Therefore, this work developed a chemical plating technique to prepare W-20 wt.% Cu composite powder with a core–shell structure and used this powder as a raw material for powder metallurgy to solve the problem of inhomogeneity in the production of W-Cu composite by the conventional solution infiltration method. Moreover, the work also developed a high-temperature-resistant photosensitive resin, which was used as a raw material to prepare injection molds using photocuring to replace traditional steel molds. Compared to steel molds, which take about a month to prepare, 3D printed plastic molds take only a few hours, greatly reducing the production cycle. At the same time, 3D printing also provides the feasibility of the production of shaped parts. The injection molded blanks were degreased and sintered under different sintering conditions. The results show that the resultant chemically plated W-Cu composite powder has a uniform Cu coating on the surface, and the Cu forms a dense and uniform three-dimensional network in the scanning electron microscope images of each subsequent sintered specimen, while the photocuring-prepared molds were used to prepare the W-Cu shaped parts, which greatly shortened the production cycle. This preparation method enables rapid preparation of tungsten–copper composite-shaped parts with good homogeneity. Full article

Colloidal copper-based chalcogenide quantum dots (QDs), particularly lead-free CuInSe₂ systems, have emerged as promising photosensitizers for optoelectronic de-vices due to their high extinction coefficients and solution processability. In this work, we demonstrate a TiO₂ photodetector enhanced through interfacial engineering with the size of 9.88 ± 2.49 nm CuInSe₂ QD_s, synthesized via controlled thermal injection. The optimized device architecture combines a 160 nm TiO₂ active layer with 60 μm horizontal channel electrodes, achieving high performance metrics. The QD-sensitized device demonstrates an impressive switching ratio of approximately 10⁵ in the 405 nm wavelength, a significant 34-times increase in responsivity at a 2 V bias, and a detection rate of 4.17 × 10⁸ Jones. Due to the limitations imposed by the TiO₂ bandgap, the TiO₂ photodetector exhibits a negligible increase in photocurrent at 565 nm. The engineered type-II heterostructure enables responsivity enhancement across an extended spectral range through sensitization while maintaining equivalent performance characteristics at both 405 nm and 565 nm wavelengths. Furthermore, the sensitized architecture demonstrates superior response kinetics, enhanced specific detectivity, and exceptional operational stability, establishing a universal design framework for broadband photodetection systems. Full article

Advancements in electrical components have intensified the challenges for copper alloy wear resistance and high-temperature performance in electrical applications. The surface coating preparation of Cu alloys is crucial for enhancing their lifespan and promoting sustainable resource development. This study explored the microstructure and properties of Cu-Cr-X coatings (X = Mo/W, Al₂O₃/TiO₂) on Cu alloy substrates via laser-cladding to improve wear resistance and hardness, vital for electrical component reliability and switching capacity. The process involved adjusting the power and reinforcing the phase particle size. The results showed hardness > 110 HV for all coatings (vs. 67.4 HV for the substrate). Cu-Cr-W achieved the highest hardness at 179 HV due to W dispersion and WCr precipitate reinforcement. It also maintained a stable CoF and the lowest wear rate (1.87 mg/km), with a fivefold wear resistance compared to the substrate alone. Cu-Cr-W excelled in lifespan extension and material loss reduction due to superior hardness, wear resistance, and conductivity. Full article

This article compares the antibacterial properties of single-layer (Ag) and two-layer (Ag,Cu) coatings deposited onto a polypropylene mesh (endoprostheses for hernioplasty) in various gaseous environments (argon or nitrogen) via magnetron sputtering. The microstructure and elemental composition of the coatings were studied via SEM and TEM. The antimicrobial activity of sterile samples was investigated using the Staphylococcus aureus strain. To prevent the overheating of the polymer samples during the coating process, it is advisable to carry out pulse processing (the total coating formation time is divided into cycles of switching the magnetron on and off for equal periods). All the samples, with both single- and double-layer coatings, exhibited good antibacterial properties; however, the Cu–Ag coating enhanced the antimicrobial effect, increasing it from 97.00 to 99.97%. The glow-discharge plasma etching of the samples with a double-layer coating led to the mixing of the copper and silver layers and an increase in the surface copper content, though this did not affect the antibacterial properties of the samples. Full article

This study presents the design, analysis, and experimental validation of a 500 W inductive power transfer (IPT) system with a transmission distance of 250 mm for television applications. The proposed system incorporates an innovative wireless pad design featuring a four-teeth magnetic structure and an LCC-S compensation topology to optimize coupling coefficients, reduce copper losses, and improve overall efficiency. The system’s robustness under misalignment and load fluctuations was validated, with experimental results confirming over 80% efficiency for optimal configurations. The findings also highlight the sensitivity of the system to switching frequency variations, emphasizing the need to maintain resonance conditions for maximum power transfer. Compared to existing designs, the proposed system demonstrates superior performance in long-distance wireless power transfer, making it a promising solution for high-power applications in home appliances. Full article

The growing use of electric machines in safety-critical applications, such as electromobility and electrified aviation, underscores the importance of ensuring their reliability. The reliability of electric machines will increasingly depend on the electrical insulation system (EIS), as they face higher voltage levels, faster switching semiconductors, and more demanding environmental conditions. The influence that the dimensioning of the enameled copper wire and the slot insulation material has on the reliability of the EIS and how different impregnation resins and novel high-thermal-conductivity (HTC) configurations of the slot insulation materials affect it will be demonstrated. This is because in addition to increased reliability, the performance of electrical machines is to be improved at the same time. A case study for an aviation application is used to show how the EIS influences the machine design. Depending on the EIS, the copper and iron losses and the conductor temperature have been investigated with the aim of keeping them as low as possible while simultaneously minimizing the risk of PD. Full article

The continuous expansion of wireless communication application scenarios demands the active tuning of electromagnetic (EM) metamaterials, which is essential for their flexible adaptation to complex EM environments. However, EM reconfigurable systems based on intricate designs and smart materials often exhibit limited flexibility and incur high manufacturing costs. Inspired by mechanical metastructures capable of switching between multistable configurations under repeated deformation, we propose a planar kirigami frequency selective surface (FSS) that enables mechanical control of its resonant frequency. This FSS is composed of periodically arranged copper square-ring resonators embedded in a kirigami-structured ecoflex substrate. Through simple tensile deformation, the shapes and positions of the square-ring resonators on the kirigami substrate are altered, resulting in changes to the coupling between capacitance and inductance, thereby achieving active tuning. Combining EM finite element simulations and transmittance measurements, we demonstrate that biaxial mechanical stretching allows for continuous adjustment of the FSS resonant frequency and −10 dB bandwidth. Additionally, the FSS exhibits excellent polarization and incident angle stability. Structural parameterization of the square-ring kirigami FSS was conducted to elucidate the deformation–electromagnetic coupling mechanism underlying the active tuning. These insights provide a foundation for guiding the application of square-ring kirigami FSS in various practical engineering domains. Full article

Busbars are critical components that connect high-current and high-voltage subcomponents in high-power converters. This paper reviews the latest busbar design methodologies and offers design recommendations for both laminated and PCB-based busbars. Silicon Carbide (SiC) power devices switch at much higher speeds compared to traditional silicon devices, making them more susceptible to parasitic elements within the busbar. In high-frequency SiC converters, using thicker copper offers limited improvement in high-frequency current handling due to the reduced skin depth at such frequencies. PCB busbars, however, provide several advantages, including reduced loop inductance, enhanced high-frequency current capacity, simplified assembly, and lower costs. Additionally, they enable the integration of components such as sensors, capacitors, and resistors, which can further optimize overall system performance. This paper also presents optimized busbar designs for both module-based and discrete device-based SiC high-power converters, comparing various SiC power module packages and offering design insights. Finally, this paper showcases a 75 kW three-phase inverter utilizing a PCB busbar, demonstrating its potential for achieving high power density and cost-effectiveness in discrete SiC device-based high-power converters. Full article

Multi-chip parallel power modules are highly favored in applications requiring high capacity and high switching frequency. However, the dynamic current imbalance between parallel chips caused by asymmetric layouts limits the available capacity. This paper presents a method to optimize dynamic current distribution by adjusting the lengths and connection points of bond wires. For the first time, a response surface model and nonlinear constraint optimization algorithm are introduced, along with parameter analysis based on finite element methods, to establish the response surface models for the parasitic inductance of bond wires and DBC (direct bonded copper). By leveraging the optimization goals for parasitic inductance and the analytical expressions of all response surfaces, the dynamic current sharing issue was transformed into a nonlinear constrained optimization problem. The solution to this optimization problem identified the optimal connection points for the bond wires, enhancing dynamic current sharing performance. Simulations and experiments were conducted, revealing that the optimized automotive-grade module exhibited a significant reduction in current differences between parallel branches, from 41.7% to 5.03% compared with the original design. This indicated that the proposed optimization scheme for adjusting bond wire connection points could significantly mitigate current disparities, thereby markedly improving current distribution uniformity. Full article

Current-carrying friction affects electrical contact systems like switches, motors, and slip rings, which determines their performance and lifespan. Researchers have found that current-carrying friction is influenced by various factors, including material type, contact form, and operating environment. This article first reviews commonly used materials, such as graphite, copper, silver, gold, and their composites. Then different contact forms like reciprocating, rotational, sliding, rolling, vibration, and their composite contact form are also summarized. Finally, their environmental conditions are also analyzed, such as air, vacuum, and humidity, on frictional force and contact resistance. Additionally, through experimental testing and theoretical analysis, it is found that factors such as arcing, thermal effects, material properties, contact pressure, and lubrication significantly influence current-carrying friction. The key mechanisms of current-carrying friction are revealed under different current conditions, including no current, low current, and high current, thereby highlighting the roles of frictional force, material migration, and electroerosion. The findings suggest that material selection, surface treatment, and lubrication techniques are effective in enhancing current-carrying friction performance. Future research should focus on developing new materials, intelligent lubrication systems, stronger adaptability in extreme environments, and low friction at the microscale. Moreover, exploring stability and durability in extreme environments and further refining theoretical models are essential to providing a scientific basis for designing efficient and long-lasting current-carrying friction systems. Full article

Metal–oxide–semiconductor field-effect transistors (MOSFETs) are critical in power electronic modules due to their high-power density and rapid switching capabilities. Therefore, effective thermal management is crucial for ensuring reliability and superior performance. This study used finite element analysis (FEA) to evaluate the electro-thermal behavior of MOSFETs with copper clip bonding, showing a significant improvement over aluminum wire bonding. The aluminum wire model reached a maximum temperature of 102.8 °C, while the copper clip reduced this to 74.6 °C. To further optimize the thermal performance, Latin Hypercube Sampling (LHS) generated diverse design points. The FEA results were used to select the Kriging regression model, chosen for its superior accuracy (MSE = 0.036, R² = 0.997, adjusted R² = 0.997). The Kriging model was integrated with a Genetic Algorithm (GA), further reducing the maximum temperature to 71.5 °C, a 4.20% improvement over the original copper clip design and a 43.8% reduction compared to aluminum wire bonding. This integration of Kriging and the GA to the MOSFET copper clip package led to a significant improvement in the heat dissipation and overall thermal performance of the MOSFET package, while also reducing the computational power requirements, providing a reliable and efficient solution for the optimization of MOSFET copper clip packages. Full article