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15 pages, 4568 KB  
Article
Development of Vacuum-Chamber-Type Capacitive Micro-Pressure Sensors
by Lung-Jieh Yang, De-Yu Jiang, Wei-Chen Wang, Chandrashekhar Tasupalli, Horng-Yuan Shih and Yi-Jen Wang
Micromachines 2025, 16(11), 1290; https://doi.org/10.3390/mi16111290 - 18 Nov 2025
Viewed by 2198
Abstract
This study presents the development of a capacitive pressure sensor tailored for measuring the dynamic pressure of flow fields. The sensor is fabricated using the UMC 0.18 μm CMOS-MEMS process, incorporated with additional post-processing steps such as metal wet etching, supercritical CO2 [...] Read more.
This study presents the development of a capacitive pressure sensor tailored for measuring the dynamic pressure of flow fields. The sensor is fabricated using the UMC 0.18 μm CMOS-MEMS process, incorporated with additional post-processing steps such as metal wet etching, supercritical CO2 drying, and parylene encapsulation. The sensing architecture employs AD7746 as a capacitance-to-voltage converter (CVC), enabling the conversion of capacitance signals into voltage outputs for enhanced measurement fidelity. Structurally, the capacitive pressure sensor features a vacuum-sealed diaphragm capsule design with dual movable circular membranes functioning as sensing electrodes. A contact-mode capacitive configuration with a trapezoidal or Gong-like vacuum-chamber diaphragm is adopted to improve linearity and sensitivity. The output sensitivity was determined to be feasible for measuring dynamic pressure at 1–2 Pa resolution. Full article
(This article belongs to the Special Issue CMOS-MEMS Fabrication Technologies and Devices, 2nd Edition)
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20 pages, 7443 KB  
Article
Sweat-Resistant Parylene-C Encapsulated Conductive Textiles for Active Thermal Management
by Shi Hu, Dan Wang, Mohanapriya Venkataraman, Jiří Militký, Dana Křemenáková and Martin Palušák
Polymers 2025, 17(21), 2952; https://doi.org/10.3390/polym17212952 - 5 Nov 2025
Viewed by 918
Abstract
The development of electro-thermal textiles has attracted growing interest as a promising approach for active thermal management in wearable systems. Metallic-coated fabrics can efficiently generate heat through the Joule effect; however, their long-term performance and safety are severely limited under perspiration due to [...] Read more.
The development of electro-thermal textiles has attracted growing interest as a promising approach for active thermal management in wearable systems. Metallic-coated fabrics can efficiently generate heat through the Joule effect; however, their long-term performance and safety are severely limited under perspiration due to metal ion release and corrosion. To overcome these challenges, this study introduces a Parylene-C encapsulation strategy for copper-coated polyethylene terephthalate nonwovens (CuPET) using a chemical vapor deposition (CVD) process. The conformal, biocompatible Parylene-C films (thickness 4–16 μm) act as effective protective barriers while preserving the porous textile structure. Morphological and comfort analyses demonstrate a controlled reduction in air permeability from 3100 to 1100 L·m−2·s−1, maintaining acceptable breathability. Electro-thermal measurements reveal rapid and uniform heating, reaching 40–45 °C within 2 min at 2 V, and the addition of a thermal insulation layer further enhances the Joule heating efficiency, increasing the steady-state temperature by approximately 6 °C. ICP–OES results show an ≈80% reduction in copper ion release (from 28.34 mg·L−1 to 5.80 mg·L−1) after artificial sweat exposure. This work demonstrates a scalable encapsulation route that effectively balances sweat protection, electrical stability, and thermal performance, paving the way for safe, durable, and actively heated smart textiles for advanced thermal insulation applications. Full article
(This article belongs to the Special Issue Advanced Study on Polymer-Based Textiles)
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37 pages, 36379 KB  
Article
Surface Morphology and Electrochemical Behavior of Microstructured Cu Electrodes in All-Solid-State Sodium Batteries
by Tomás Prior, Joana Figueira, Ângela Freitas, David Carvalho, Beatriz Moura Gomes, Manuela C. Baptista, Hugo Lebre, Rodrigo Martins, Luís Pereira, Joana Vaz Pinto and M. Helena Braga
Molecules 2025, 30(17), 3493; https://doi.org/10.3390/molecules30173493 - 25 Aug 2025
Cited by 1 | Viewed by 1231
Abstract
The integration of microstructured current collectors offers a potential pathway to enhance interface properties in solid-state battery architectures. In this work, we investigate the influence of surface morphology on the electrochemical performance of Zn/Na2.99Ba0.005OCl/Cu electrodeless pouch cells by fabricating [...] Read more.
The integration of microstructured current collectors offers a potential pathway to enhance interface properties in solid-state battery architectures. In this work, we investigate the influence of surface morphology on the electrochemical performance of Zn/Na2.99Ba0.005OCl/Cu electrodeless pouch cells by fabricating copper thin films on microstructured parylene-C substrates using a combination of colloidal lithography and reactive ion etching. O2 plasma etching times ranging from 0 to 15 min were used to tune the surface topography, resulting in a systematic increase in root-mean-square roughness and a surface area enhancement of up to ~30% for the longest etching duration, measured via AFM. Kelvin probe force microscopy-analyzed surface potential showed maximum differences of 270 mV between non-etched and 12-minute-etched Cu collectors. The results revealed that the chemical potential is the property that relates the surface of the Cu current collector/electrode with the cell’s ionic transport performance, including the bulk ionic conductivity, while four-point sheet resistance measurements confirmed that the copper layers’ resistivity maintained values close to those of bulk copper (1.96–4.5 µΩ.cm), which are in agreement with electronic mobilities (−6 and −18 cm2V−1s−1). Conversely, the charge carrier concentrations (−1.6 to −2.6 × 1023 cm−3) are indirectly correlated with the performance of the cell, with the samples with lower CCCbulk (fewer free electrons) performing better and showing higher maximum discharge currents, interfacial capacitance, and first-cycle discharge plateau voltage and capacity. The data were further consolidated with Scanning Electron Microscopy and X-ray Photoelectron Spectroscopy analyses. These results highlight that the correlation between the surface morphology and the cell is not straightforward, with the microstructured current collectors’ surface chemical potential and the charge carriers’ concentration being determinant in the performance of all-solid-state electrodeless sodium battery systems. Full article
(This article belongs to the Section Cross-Field Chemistry)
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37 pages, 1520 KB  
Article
Comparative Analysis of Machine and Deep Learning Algorithms for Bragg Peak Estimation in Polymeric Materials for Tissue-Sparing Radiotherapy
by Koray Acici
Polymers 2025, 17(15), 2068; https://doi.org/10.3390/polym17152068 - 29 Jul 2025
Cited by 2 | Viewed by 1256
Abstract
Proton therapy has emerged as a highly precise and tissue-sparing radiotherapy technique, capitalizing on the unique energy deposition pattern of protons characterized by the Bragg peak. Ensuring treatment accuracy relies on calibration phantoms, often composed of tissue-equivalent polymeric materials. This study investigates the [...] Read more.
Proton therapy has emerged as a highly precise and tissue-sparing radiotherapy technique, capitalizing on the unique energy deposition pattern of protons characterized by the Bragg peak. Ensuring treatment accuracy relies on calibration phantoms, often composed of tissue-equivalent polymeric materials. This study investigates the dosimetric behavior of four commonly used polymers—Parylene, Epoxy, Lexan, and Mylar—by analyzing their linear energy transfer (LET) values and Bragg curve characteristics across various proton energies. Experimental LET data were collected and used to train and evaluate the predictive power for Bragg peak of multiple artificial intelligence models, including kNN, SVR, MLP, RF, LWRF, XGBoost, 1D-CNN, LSTM, and BiLSTM. These algorithms were optimized using 10-fold cross-validation and assessed through statistical error and performance metrics including MAE, RAE, RMSE, RRSE, CC, and R2. Results demonstrate that certain AI models, particularly RF and LWRF, accurately (in terms of all evaluation metrics) predict Bragg peaks in Epoxy polymers, reducing the reliance on costly and time-consuming simulations. In terms of CC and R2 metrics, the LWRF model demonstrated superior performance, achieving scores of 0.9969 and 0.9938, respectively. However, when evaluated against MAE, RMSE, RAE, and RRSE metrics, the RF model emerged as the top performer, yielding values of 12.3161, 15.8223, 10.3536, and 11.4389, in the same order. Additionally, the SVR model achieved the highest number of statistically significant differences when compared pairwise with the other eight models, showing significance against six of them. The findings support the use of AI as a robust tool for designing reliable calibration phantoms and optimizing proton therapy planning. This integrative approach enhances the synergy between materials science, medical physics, and data-driven modeling in advanced radiotherapy systems. Full article
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12 pages, 3166 KB  
Article
Impedance Characterization and Modeling of Gold, Silver, and PEDOT:PSS Ultra-Thin Tattoo Electrodes for Wearable Bioelectronics
by Antonello Mascia, Riccardo Collu, Nasreddine Makni, Mattia Concas, Massimo Barbaro and Piero Cosseddu
Sensors 2025, 25(15), 4568; https://doi.org/10.3390/s25154568 - 23 Jul 2025
Cited by 5 | Viewed by 1568
Abstract
This study presents a comprehensive evaluation and an equivalent circuit modeling of the skin–electrode impedance characteristics of three types of ultra-thin tattoo electrodes, all based on Parylene C nanofilms but with different active materials: Gold, Silver, and PEDOT:PSS. Their performance was compared to [...] Read more.
This study presents a comprehensive evaluation and an equivalent circuit modeling of the skin–electrode impedance characteristics of three types of ultra-thin tattoo electrodes, all based on Parylene C nanofilms but with different active materials: Gold, Silver, and PEDOT:PSS. Their performance was compared to standard disposable Ag/AgCl electrodes. Impedance measurements were carried out on six human subjects under controlled conditions, assessing the frequency response in the range of 20 Hz to 1 kHz. For each subject, the impedance was recorded six times over one hour to investigate the stability and the temporal performance. The collected data were subsequently analyzed to model the electrical properties and interface behavior of each electrode type. The findings demonstrate that the tattoo electrodes offer impedance levels comparable to those of Ag/AgCl electrodes (in the order of tens of kΩ at 20 Hz), while providing additional benefits such as enhanced conformability, improved skin adhesion, and reduced skin irritation during use. Furthermore, the modeling of the skin–electrode interface through a more detailed equivalent circuit than the single time constant model enables a more detailed interface analysis and description, with fitting algorithm R2 scores of about 0.999 and 0.979 for the impedance magnitude and impedance phase, respectively. The proposed equivalent circuit offers valuable insights for optimizing electrode design, supporting the potential of Parylene C-based tattoo electrodes as promising alternatives for next-generation wearable bioelectronic applications. Full article
(This article belongs to the Special Issue Bioimpedance Measurements and Microelectrodes)
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24 pages, 7263 KB  
Article
Biocompatible and Hermetic Encapsulation of PMUTs: Effects of Parylene F-VT4 and ALD Stacks on Membrane Vibration and Acoustic Performance
by Esmaeil Afshari, Samer Houri, Rik Verplancke, Veronique Rochus, Maarten Cauwe, Pieter Gijsenbergh and Maaike Op de Beeck
Sensors 2025, 25(13), 4074; https://doi.org/10.3390/s25134074 - 30 Jun 2025
Viewed by 3704
Abstract
The motivation of this work is to enable the use of piezoelectric micromachined ultrasonic transducer (PMUT)-based implants within the human body for biomedical applications, particularly for power and data transfer for implanted medical devices. To protect surrounding tissue and ensure PMUT functionality over [...] Read more.
The motivation of this work is to enable the use of piezoelectric micromachined ultrasonic transducer (PMUT)-based implants within the human body for biomedical applications, particularly for power and data transfer for implanted medical devices. To protect surrounding tissue and ensure PMUT functionality over time, biocompatible and hermetic encapsulation is essential. This study investigates the impact of Parylene F-VT4 layers of various thicknesses as well as the effect of multilayer stacks of Parylene F-VT4 combined with atomic layer-deposited nanolayers of Al2O3 and HfO2 on the mechanical and acoustic properties of PMUTs. PMUTs with various diameters (40 µm, 60 µm, and 80 µm) are fabricated and tested both as stand-alone devices and as arrays. The mechanical behavior of single stand-alone PMUT devices is characterized in air and in water using laser Doppler vibrometry (LDV), while the acoustic output of arrays is evaluated by pressure measurements in water. Experimental results reveal a non-monotonic change in resonance frequency as a function of increasing encapsulation thickness due to the competing effects of added mass and increased stiffness. The performance of PMUT arrays is clearly influenced by the encapsulation. For certain array designs, the encapsulation significantly improved the arrays’ pressure output, a change that is attributed to the change in the acoustic wavelength and inter-element coupling. These findings highlight the impact of encapsulation in modifying and potentially enhancing PMUT performance. Full article
(This article belongs to the Section Physical Sensors)
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11 pages, 2741 KB  
Article
Double-Sided Fabrication of Low-Leakage-Current Through-Silicon Vias (TSVs) with High-Step-Coverage Liner/Barrier Layers
by Baoyan Yang, Houjun Sun, Kaiqiang Zhu and Xinghua Wang
Micromachines 2025, 16(7), 750; https://doi.org/10.3390/mi16070750 - 25 Jun 2025
Cited by 1 | Viewed by 2099
Abstract
In this paper, a novel through-silicon via (TSV) fabrication strategy based on through-hole structures is proposed for low-cost and low-complexity manufacturing. Compared to conventional TSV fabrication processes, this method significantly simplifies the process flow by employing double-sided liner deposition, double-sided barrier layer/seed layer [...] Read more.
In this paper, a novel through-silicon via (TSV) fabrication strategy based on through-hole structures is proposed for low-cost and low-complexity manufacturing. Compared to conventional TSV fabrication processes, this method significantly simplifies the process flow by employing double-sided liner deposition, double-sided barrier layer/seed layer formation, and double-sided Cu electroplating. This method enhances the TSV stability by eliminating Cu contamination issues during chemical–mechanical polishing (CMP), which are a common challenge in traditional blind via fabrication processes. Additionally, the liner and barrier layer/seed layer achieve a high step coverage exceeding 80%, ensuring excellent conformality and structural integrity. For electroplating, a multi-stage bi-directional electroplating technique is introduced to enable void-free Cu filling in TSVs. The fabricated TSVs exhibit an ultra-low leakage current of 135 fA at 20 V, demonstrating their potential for advancing 3D integration technologies in heterogeneous integration. Full article
(This article belongs to the Special Issue Advanced Interconnect and Packaging, 3rd Edition)
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18 pages, 2667 KB  
Communication
Parylene-C Modified OSTE Molds for PDMS Microfluidic Chip Fabrication and Applications in Plasma Separation and Polymorphic Crystallization
by Muyang Zhang, Haonan Li, Xionghui Li, Zitong Ye, Qinghao He, Jie Zhou, Jiahua Zhong, Hao Chen, Xinyi Chen, Yixi Shi, Huiru Zhang, Lok Ting Chu and Weijin Guo
Biosensors 2025, 15(6), 388; https://doi.org/10.3390/bios15060388 - 16 Jun 2025
Cited by 1 | Viewed by 1659
Abstract
This work presents a novel microfabrication process that addresses the interference of thiol groups on off-stoichiometry thiolene (OSTE) surfaces with the curing of polydimethylsiloxane (PDMS) by integrating the high-performance polymer Parylene-C. The process utilizes a Parylene-C coating to encapsulate the active thiol groups [...] Read more.
This work presents a novel microfabrication process that addresses the interference of thiol groups on off-stoichiometry thiolene (OSTE) surfaces with the curing of polydimethylsiloxane (PDMS) by integrating the high-performance polymer Parylene-C. The process utilizes a Parylene-C coating to encapsulate the active thiol groups on the OSTE surface, enabling precise replication of PDMS microstructures. Based on this method, PDMS micropillar arrays and microwell arrays were successfully fabricated and applied in passive plasma separation and polymorphic crystal formation, respectively. The experimental results demonstrate that the plasma-separation chip efficiently isolates plasma from whole-blood samples with varying hematocrit (HCT) levels, achieving a separation efficiency of up to 57.5%. Additionally, the microwell array chip exhibits excellent stability and controllability in the growth of salt and protein crystals. This study not only provides a new approach for microfabricating microfluidic chips, but also highlights its potential applications in biomedical diagnostics and materials science. Full article
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21 pages, 4466 KB  
Article
Quality and Lifetime of Thin Parylene F-VT4 Coatings for Hermetic Encapsulation of Implantable Medical Devices
by Esmaeil Afshari, Rik Verplancke, Maarten Cauwe and Maaike Op de Beeck
Coatings 2025, 15(6), 648; https://doi.org/10.3390/coatings15060648 - 28 May 2025
Cited by 3 | Viewed by 4668
Abstract
This study comprehensively examines the barrier properties, aging behavior, and failure mechanisms of Parylene F-VT4 films, applied at four distinct thicknesses (0.3 µm, 0.6 µm, 0.9 µm, and 1.2 µm), as encapsulation layers for implantable medical devices. Parylene F-VT4, a fluorinated polymer known [...] Read more.
This study comprehensively examines the barrier properties, aging behavior, and failure mechanisms of Parylene F-VT4 films, applied at four distinct thicknesses (0.3 µm, 0.6 µm, 0.9 µm, and 1.2 µm), as encapsulation layers for implantable medical devices. Parylene F-VT4, a fluorinated polymer known for its mechanical flexibility, thermal stability, and chemical inertness, is a promising candidate for long-term hermetic encapsulation. Parylene F-VT4 was uniformly deposited via a dedicated chemical vapor deposition (CVD) process typically used for Parylene depositions. The investigation of the Parylene F-VT4 films included pinhole density characterization, electrochemical impedance spectroscopy (EIS), and testing of coating lifetime based on the resistance of Cu meanders protected by Parylene F-VT4 when immersed in phosphate-buffered saline (PBS) under accelerated aging conditions (PBS at 60 °C) over 550 days. The EIS results demonstrated that thicker coatings (1.2 µm) exhibited excellent barrier properties and resistance to electrolyte penetration, whereas thinner coatings (0.3 µm and 0.6 µm) showed more rapid degradation due to microvoids and pinholes. The temporal evaluation of EIS spectra highlighted the gradual decrease in impedance magnitude, indicating the ingress of ions and water into the coating. The lifetime in PBS at 60 °C was determined by resistance-based lifetime measurements on Cu meander structures coated with Parylene F-VT4 coatings. The lifetime at 37 °C was calculated, assuming an acceleration factor of 2 per 10 °C increase in temperature, yielding lifetimes of approximately 25 days, 6.4 months, 2.3 years, and 4.5 years for 0.3 µm, 0.6 µm, 0.9 µm, and 1.2 µm coatings, respectively. These findings highlight the critical relationship between thickness and durability, providing valuable insights into the long-term performance of thin Parylene F-VT4 films for implantable devices. Full article
(This article belongs to the Special Issue Thin Film Coatings for Medical Biosensing Applications)
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14 pages, 4835 KB  
Article
Development and Evaluation of Multi-Module Retinal Devices for Artificial Vision Applications
by Kuang-Chih Tso, Yoshinori Sunaga, Yuki Nakanishi, Yasuo Terasawa, Makito Haruta, Kiyotaka Sasagawa and Jun Ohta
Micromachines 2025, 16(5), 580; https://doi.org/10.3390/mi16050580 - 15 May 2025
Viewed by 1290
Abstract
Artificial retinal devices require a high-density electrode array and mechanical flexibility to effectively stimulate retinal cells. However, designing such devices presents significant challenges, including the need to conform to the curvature of the eyeball and cover a large area using a single platform. [...] Read more.
Artificial retinal devices require a high-density electrode array and mechanical flexibility to effectively stimulate retinal cells. However, designing such devices presents significant challenges, including the need to conform to the curvature of the eyeball and cover a large area using a single platform. To address these issues, we developed a parylene-based multi-module retinal device (MMRD) integrating a complementary metal-oxide semiconductor (CMOS) system. The proposed device is designed for suprachoroidal transretinal stimulation, with each module comprising a parylene-C thin-film substrate, a CMOS chip, and a ceramic substrate housing seven platinum electrodes. The smart CMOS system significantly reduces wiring complexity, enhancing the device’s practicality. To improve fabrication reliability, we optimized the encapsulation process, introduced multiple silane coupling modifications, and utilized polyvinyl alcohol (PVA) for easier detachment in flip-chip bonding. This study demonstrates the fabrication and evaluation of the MMRD through in vitro and in vivo experiments. The device successfully generated the expected current stimulation waveforms in both settings, highlighting its potential as a promising candidate for future artificial vision applications. Full article
(This article belongs to the Section E:Engineering and Technology)
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15 pages, 7264 KB  
Article
High-Frequency 64-Element Ring-Annular Array Transducer: Development and Preclinical Validation for Intravascular Ultrasound Imaging
by Xi Liu, Yuanlong Li, Haiguo Qin and Chang Peng
Biosensors 2025, 15(3), 169; https://doi.org/10.3390/bios15030169 - 5 Mar 2025
Cited by 2 | Viewed by 3195
Abstract
Intravascular ultrasound (IVUS) imaging has become an essential method for diagnosing coronary artery disease. However, traditional mechanically rotational IVUS catheters encounter issues such as mechanical wear and imaging distortions in curved vessels. The ring-annular IVUS array has gained attention because it offers superior [...] Read more.
Intravascular ultrasound (IVUS) imaging has become an essential method for diagnosing coronary artery disease. However, traditional mechanically rotational IVUS catheters encounter issues such as mechanical wear and imaging distortions in curved vessels. The ring-annular IVUS array has gained attention because it offers superior imaging performance without the need for mechanical rotational parts, thereby avoiding rotational imaging distortion. An optimized mechanical micromachining process employing precision dicing technology is proposed in this study, with the objective of achieving higher operating frequencies and minimized outer diameters for a 64-element ring-annular array. This method broadens the range of fabrication options and improves the imaging sensitivity of ring-annular IVUS arrays, as well as eliminating imaging distortion in rotational IVUS catheters, particularly in curved vessels. The probe has a 7.5 Fr (2.5 mm) outer diameter, with key fabrication steps including precision dicing, flexible circuit integration, and Parylene C encapsulation. The ring-annular array has a center frequency of 21.51 MHz with 67.87% bandwidth, with a 56 µm axial resolution and a 276 µm lateral resolution. The imaging performance is further validated by in vitro phantom imaging and ex vivo imaging. Full article
(This article belongs to the Special Issue Biosensors for Biomedical Diagnostics)
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17 pages, 808 KB  
Article
Repackaging and Performance Analysis of Implantable Pressure Sensor
by Liu Cui, Shuangkui Wang, Kai Zhao and Zhisen Si
Sensors 2025, 25(3), 651; https://doi.org/10.3390/s25030651 - 22 Jan 2025
Cited by 1 | Viewed by 2401
Abstract
In recent years, repackaging technology has been widely used in miniaturized implantable pressure sensors. However, the current packaging structure still has significant problems regarding biocompatibility, environmental adaptability, and measurement accuracy, which greatly limits its application in vivo measurement systems. In this paper, we [...] Read more.
In recent years, repackaging technology has been widely used in miniaturized implantable pressure sensors. However, the current packaging structure still has significant problems regarding biocompatibility, environmental adaptability, and measurement accuracy, which greatly limits its application in vivo measurement systems. In this paper, we report a method for implantable pressure sensor repackaging based on silicone oil, polydimethylsiloxane (PDMS) film, and polymer (parylene) coating. A systematic investigation using finite element analysis is conducted to assess the impact of packaging components on sensor performance, providing a solid theoretical foundation for packaging optimization. Experimental results demonstrate that when the parylene coating thickness is below 30 µm, the sensors exhibit superior linearity, repeatability, and reliability, along with exceptional stability and dynamic response across clinically relevant pressure ranges. This research provides valuable insights into the packaging design of implantable pressure sensors, facilitating the development of more stable, reliable, and cost-effective sensors for in vivo measurement systems. Full article
(This article belongs to the Section Biomedical Sensors)
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14 pages, 9714 KB  
Article
Micro-Electromechanical System-Based Parasitic Patch Antenna on Quartz Substrate for High Gain
by Haoran Zhao, Qi Wang, Jianyu Du, Lang Chen, Wen Yue and Wei Wang
Sensors 2025, 25(3), 607; https://doi.org/10.3390/s25030607 - 21 Jan 2025
Cited by 1 | Viewed by 3828
Abstract
This paper presents a novel Ku-band parasitic patch antenna based on MEMS technology. The antenna consists of two substrates that are bonded together. The lower substrate houses the main patch and the ground layer, while the upper substrate supports the parasitic patch. To [...] Read more.
This paper presents a novel Ku-band parasitic patch antenna based on MEMS technology. The antenna consists of two substrates that are bonded together. The lower substrate houses the main patch and the ground layer, while the upper substrate supports the parasitic patch. To minimize the dielectric loss, the parasitic patch is fabricated using a double-layer suspended film process, combining parylene C and Spin-on-glass (SOG) materials. The two substrates are also bonded using SOG. The proposed antenna achieves a measured bandwidth of 30% (11.1~15.01 GHz), a peak gain of 8.57 dBi, and a compact size of 0.87 × 0.87 × 0.09 λ03. Full article
(This article belongs to the Collection Modeling, Testing and Reliability Issues in MEMS Engineering)
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14 pages, 5546 KB  
Article
Sensors on Flapping Wings (SOFWs) Using Complementary Metal–Oxide–Semiconductor (CMOS) MEMS Technology
by Lung-Jieh Yang, Wei-Cheng Wang, Chandrashekhar Tasupalli, Balasubramanian Esakki and Mahammed Inthiyaz Shaik
Eng 2025, 6(1), 15; https://doi.org/10.3390/eng6010015 - 14 Jan 2025
Cited by 1 | Viewed by 3412
Abstract
This article presents a framework of using MEMS sensors to investigate unsteady flow speeds of a flapping wing or the new concept of sensors on flapping wings (SOFWs). Based on the implemented self-heating flow sensor using U18 complementary metal–oxide–semiconductor (CMOS) MEMS foundry provided [...] Read more.
This article presents a framework of using MEMS sensors to investigate unsteady flow speeds of a flapping wing or the new concept of sensors on flapping wings (SOFWs). Based on the implemented self-heating flow sensor using U18 complementary metal–oxide–semiconductor (CMOS) MEMS foundry provided by the Taiwan Semiconductor Research Institute (TSRI), the compact sensing region of the flow sensor was incorporated for in situ diagnostics of biomimetic flapping issues. The sensitivity of the CMOS MEMS flow sensor, packaged with a parylene coating of 10 μm thick to prolong the lifetime, was observed as −3.24 mV/V/(m/s), which was below the flow speed of 6 m/s. A comprehensive investigation was conducted on integrating CMOS MEMS flow sensors on the leading edge of the mean aerodynamic chord (m.a.c.) of the flexible 70-cm-span flapping wings. The interpreted flow speed signals were checked and demonstrated similar behavior with the (net) thrust force exerted on the flapping wing, as measured in the wind tunnel experiments using the force gauge. The experimental results confirm that the in situ measurements using the concept of SOFWs can be useful for measuring the aerodynamic forces of flapping wings effectively, and it can also serve for future potential applications. Full article
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15 pages, 4711 KB  
Article
Biocompatible Heterogeneous Packaging and Laser-Assisted Fluid Interface Control for In Situ Sensor in Organ-on-a-Chip
by Yu-Hsuan Lin, Shing-Fung Lau, Yen-Pei Lu, Kuo-Cheng Huang, Chien-Fang Ding, Yu-Hsiang Tang and Hsin-Yi Tsai
Micromachines 2025, 16(1), 46; https://doi.org/10.3390/mi16010046 - 30 Dec 2024
Viewed by 1722
Abstract
The development of bionic organ-on-a-chip technology relies heavily on advancements in in situ sensors and biochip packaging. By integrating precise biological and fluid condition sensing with microfluidics and electronic components, long-term dynamic closed-loop culture systems can be achieved. This study aims to develop [...] Read more.
The development of bionic organ-on-a-chip technology relies heavily on advancements in in situ sensors and biochip packaging. By integrating precise biological and fluid condition sensing with microfluidics and electronic components, long-term dynamic closed-loop culture systems can be achieved. This study aims to develop biocompatible heterogeneous packaging and laser surface modification techniques to enable the encapsulation of electronic components while minimizing their impact on fluid dynamics. Using a kidney-on-a-chip as a case study, a non-toxic packaging process and fluid interface control methods have been successfully developed. Experimentally, miniature pressure sensors and control circuit boards were encapsulated using parylene-C, a biocompatible material, to isolate biochemical fluids from electronic components. Ultraviolet laser processing was employed to fabricate structures on parylene-C. The results demonstrate that through precise control of processing parameters, the wettability of the material can be tuned freely within a contact angle range of 60° to 110°. Morphological observations and MTT assays confirmed that the material and the processing methods do not induce cytotoxicity. This technology will facilitate the packaging of various miniature electronic components and biochips in the future. Furthermore, laser processing enables rapid and precise control of interface conditions across different regions within the chip, demonstrating a high potential for customized mass production of biochips. The proposed innovations provide a solution for in situ sensing in organ-on-a-chip systems and advanced biochip packaging. We believe that the development of this technology is a critical step toward realizing the concept of “organ twin”. Full article
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