Search Results (44)

This article proposes a compact model for the radiation-sensitive field-effect transistor (RADFET). The model represents the basic I–V characteristics of the MOSFET device and includes the effects of threshold voltage shift as a function of absorbed dose and gate bias, gate tunneling current, gate radiation current, dose accumulation, and fading. It accurately represents high-field effects in the gate dielectric of the RADFET device. Both the Fowler–Nordheim gate tunneling current and the radiation-induced gate current are incorporated into the model. The model enables determination of the radiation-induced charge during RADFET operation under high-field injection conditions, thereby improving the precision of accumulated dose readout. The proposed model is fully compatible with SPICE-based circuit simulators and can represent any type of RADFET device, including those with high-k gate dielectrics. Furthermore, the model was developed entirely using open-source circuit simulation tools. Full article

Multilayer heterostructures of [(BiFeO₃)_m/(SrTiO₃)_n]_p were synthesized on ITO-coated quartz substrates via pulsed laser deposition, with varying thickness ratios (r = n/m) and periodicities (p = 1–3). Structural, electrical, and piezoelectric properties were systematically investigated using X-ray diffraction, AFM, and PFM. The BiFeO₃ layers crystallized in a distorted rhombohedral phase (R3c), free of secondary phases. Compared to single-layer BiFeO₃ films, the multilayers exhibited markedly lower leakage current densities and enhanced piezoelectric response. Electrical conduction transitioned from space-charge-limited current at low fields (E < 100 kV/cm) to Fowler–Nordheim tunneling at high fields (E > 100 kV/cm). Optimal performance was achieved for r = 0.30, p = 1, with minimal leakage (J = 8.64 A/cm² at E = 400 kV/cm) and a peak piezoelectric coefficient (d₃₃ = 55.55 pm/V). The lowest coercive field (Ec = 238 kV/cm) occurred in the configuration r = 0.45, p = 3. Saturated hysteresis loops confirmed stable ferroelectric domains. These findings demonstrate that manipulating layer geometry in [(BiFeO₃)_m/(SrTiO₃)_n]_p stacks significantly enhances functional properties, offering a viable path toward efficient, lead-free piezoelectric nanodevices. Full article

Hexagonal Boron Nitride (h-BN) is an exceptional dielectric material with significant potential for high-performance electronic and optoelectronic devices. While previous studies have explored its role in GaN-based MIS (metal/insulator/semiconductor) structures, the influence of few-layer h-BN on AlGaN MIS devices—particularly with varying Al compositions—remains unexplored. In this work, we systematically investigate the Fowler–Nordheim tunneling effect in few-layer h-BN integrated into AlGaN MIS architectures, focusing on the critical roles h-BN layer count, AlGaN alloy composition, and interfacial properties in determining device performance. Through combined simulations and experiments, we accurately determine key physical parameters, such as the layer-dependent effective mass and band alignment, and analyze their role in optimizing MIS device characteristics. Our findings reveal that the 2D h-BN insulating layer not only enhances breakdown voltage and reduces leakage current but also mitigates interfacial defects and Shockley–Read–Hall recombination, enabling high-performance AlGaN MIS devices under elevated voltage and power conditions. This study provides fundamental insights into h-BN-based AlGaN MIS structures and advances their applications in next-generation high-power and high-frequency electronics. Full article

This paper reports the field emission (FE) current stability of a diamond nanowire (DNW) array. Assembled with a silicon anode with a 1.03 μm gap, the FE properties, as well as the current stability of the DNW cathode, were systematically evaluated in a vacuum test system under different vacuum degrees, current densities, and atmospheres. Experiments demonstrate that lower pressure and current density can improve FE properties and current stability. In addition, compared to air and compressed air, DNWs exhibit higher FE properties and current stability in N₂. DNWs achieve a remarkably low turn-on field of 1.65 V/μm and a high current density of 265.38 mA/cm². Notably, they demonstrate merely 0.70% current fluctuation under test conditions of 1.2 × 10⁻⁴ Pa and 0.1 mA/cm². Additionally, based on the Fowler–Nordheim theory, the change in work function after gas adsorption was analyzed, and the noise generation mechanism was derived from the noise power spectrum. The current exponent is determined as 1.94, while the frequency exponent ranges from 0.92 to 1.32, confirming that the dominant noise mechanism in DNWs arises from surface work function fluctuations due to the adsorption and desorption of residual gas. Full article

Interface-passivated graphene/silicon Schottky junction solar cells have demonstrated promising features with improved stability and power conversion efficiency (PCE). However, there are some misunderstandings in the literature regarding some of the working mechanisms and the impacts of the silicon/insulator interface. Specifically, attributing performance improvement to oxygen vacancies and characterizing performance using Schottky barrier height and ideality factor might not be the most accurate or appropriate. This work uses Al₂O₃ as an example to provide a detailed discussion on the interface ALD growth of Al₂O₃ on silicon and its impact on graphene electrode metal–insulator–semiconductor (MIS) solar cells. We further suggest that the current conduction in MIS solar cells with an insulating layer of 2 to 3 nm thickness is better described by direct tunneling, Poole–Frenkel emission, and Fowler–Nordheim tunneling, as the junction voltage sweeps from negative to a larger forward bias. The dielectric film thickness, its band offset with Si, and the interface roughness, are key factors to consider for process optimization. Full article

The obtention of luminescent SiO_xC_y:H thin films deposited by the HW-CVD technique is reported here. We study the effect of different monomethyl-silane (MMS) flow rates on the films properties. An increase in the emission bandwidth and a red-shift was observed when the MMS flow increased. The luminescence was related to optical transitions in band tail states and with less contribution from quantum confinement effects. After, the films were annealed at 750 °C in nitrogen. The annealed film deposited at the highest MMS flow showed an emission spectrum like the as-deposited film, suggesting the same emission mechanisms. By contrast, the annealed film deposited at the lowest MMS flow showed two emission bands. These bands are due to the activation of radiative defects related to oxygen-deficient centers. MOS-like structures were fabricated as electroluminescent devices using the annealed films. Only the structure of the film with the highest carbon content showed light emission in a broad band in the visible spectrum region in forward bias, with a maximum centered close to 850 nm. The light emission mechanism was related to electron thermalization in the band tail states and a direct hole injection into deep states. The trap-assisted tunneling, Poole–Frenkel emissions and Fowler–Nordheim tunneling were proposed as the charge transport mechanism. Full article

This work investigates the gate oxide reliability of commercial 1.2 kV silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs) with planar and trench gate structures. The performance of threshold voltage $\left({\mathrm{V}}_{\mathrm{t}\mathrm{h}}\right)$ and gate leakage current $\left({\mathrm{I}}_{\mathrm{g}\mathrm{s}\mathrm{s}}\right)$ in SiC MOSFETs is evaluated under positive and negative gate voltage stress. The oxide lifetimes of SiC planar and trench MOSFETs at 150 °C are measured using constant voltage Time-Dependent Dielectric Breakdown (TDDB) testing. From the test results, it is found that electron trapping and hole trapping in ${\mathrm{S}\mathrm{i}\mathrm{O}}_2$ caused by oxide electric field $\left({\mathrm{E}}_{\mathrm{o}\mathrm{x}}\right)$ stress affect the ${\mathrm{V}}_{\mathrm{t}\mathrm{h}}$ of SiC MOSFETs. The saturation and turnaround behavior of the ${\mathrm{V}}_{\mathrm{t}\mathrm{h}}$ shift during positive and negative gate voltage stresses indicates that the influence of charge trapping in the gate oxide varies with stress time. The ${\mathrm{I}}_{\mathrm{g}\mathrm{s}\mathrm{s}}$ under positive and negative gate voltages depends on the tunneling barrier height for electrons and holes, respectively, which can be calculated using the Fowler–Nordheim (FN) tunneling mechanism. Moreover, the presence of near-interface traps (NITs) affects the barrier height for holes under negative gate voltages. The behavior of ${\mathrm{V}}_{\mathrm{t}\mathrm{h}}$ shift and ${\mathrm{I}}_{\mathrm{g}\mathrm{s}\mathrm{s}}$ under high-temperature gate bias reflects the charge trapping occurring in different regions of the gate oxide. In addition, compared to SiC planar MOSFETs, SiC trench MOSFETs with thicker gate oxide tend to exhibit higher lifetimes in TDDB tests. Full article

In this work, the DC performance and RF characteristics of GaN-based high-electron-mobility transistors (HEMTs) using the SiN_x stress-engineered technique were systematically investigated. It was observed that a significant reduction in the peak electric field and an increase in the effective barrier thickness in the devices with compressive SiN_x passivation contributed to the suppression of Fowler–Nordheim (FN) tunneling. As a result, the gate leakage decreased by more than an order of magnitude, and the breakdown voltage (BV) increased from 44 V to 84 V. Moreover, benefiting from enhanced gate control capability, the devices with compressive stress SiN_x passivation showed improved peak transconductance from 315 mS/mm to 366 mS/mm, along with a higher cutoff frequency (f_t) and maximum oscillation frequency (f_max) of 21.15 GHz and 35.66 GHz, respectively. Due to its enhanced frequency performance and improved pinch-off characteristics, the power performance of the devices with compressive stress SiN_x passivation was markedly superior to that of the devices with stress-free SiN_x passivation. These results confirm the substantial potential of the SiN_x stress-engineered technique for high-frequency and high-output power applications, which are crucial for future communication systems. Full article

Organosilicate glass (OSG) films are a critical component in modern electronic devices, with their electrical properties playing a crucial role in device performance. This comprehensive review systematically examines the influence of chemical composition, vacuum ultraviolet (VUV) irradiation, and plasma treatment on the electrical properties of these films. Through an extensive survey of literature and experimental findings, we elucidate the intricate interplay between these factors and the resulting alterations in electrical conductivity, dielectric constant, and breakdown strength of OSG films. Key focus areas include the impact of diverse organic moieties incorporated into the silica matrix, the effects of VUV irradiation on film properties, and the modifications induced by various plasma treatment techniques. Furthermore, the underlying mechanisms governing these phenomena are discussed, shedding light on the complex molecular interactions and structural rearrangements occurring within OSG films under different environmental conditions. It is shown that phonon-assisted electron tunneling between adjacent neutral traps provides a more accurate description of charge transport in OSG low-k materials compared to the previously reported Fowler–Nordheim mechanism. Additionally, the quality of low-k materials significantly influences the behavior of leakage currents. Materials retaining residual porogens or adsorbed water on pore walls show electrical conductivity directly correlated with pore surface area and porosity. Conversely, porogen-free materials, developed by Urbanowicz, exhibit leakage currents that are independent of porosity. This underscores the critical importance of considering internal defects such as oxygen-deficient centers (ODC) or similar entities in understanding the electrical properties of these materials. Full article

Carbon nanotube (CNT) is an excellent field emission material. However, uniformity and stability are the key issues hampering its device application. In this work, a bimetallic W-Co alloy was adopted as the catalyst of CNT in chemical vapor deposition process. The high melting point and stable crystal structure of W-Co helps to increase the grown CNT diameter uniformity and homogeneous crystal structure. High-crystallinity CNTs were grown on the W-Co bimetallic catalyst. Its field emission characteristics demonstrated a low turn-on field, high current density, stable current stability, and uniform emission distribution. The Fowler–Nordheim (FN) and Seppen–Katamuki (SK) analyses revealed that the CNT grown on the W-Co catalyst has a relatively low work function and high field enhancement factor. The high crystallinity and homogeneous crystal structure of CNT also reduce the body resistance and increase the emission current stability and maximum current. The result provides a way to synthesis a high-quality CNT field emitter, which will accelerate the development of cold cathode vacuum electronic device application. Full article

This paper presents a reliability study of a conventional 650 V SiC planar MOSFET subjected to pulsed HTRB (High-Temperature Reverse Bias) stress and negative HTGB (High-Temperature Gate Bias) stress defined by a TCAD static simulation showing the electric field distribution across the SiC/SiO₂ interface. The instability of several electrical parameters was monitored and their drift analyses were investigated. Moreover, the shift of the onset of the Fowler–Nordheim gate injection current under stress conditions provided a reliable method to quantify the trapped charge inside the gate oxide bulk, and it allowed us to determine the real stress conditions. Moreover, it has been demonstrated from the cross-correlation, the TCAD simulation, and the experimental ΔV_th and ΔV_FN variation that HTGB stress is more severe compared to HTRB. In fact, HTGB showed a 15% variation in both ΔV_th and ΔV_FN, while HTRB showed only a 4% variation in both ΔV_th and ΔV_FN. The physical explanation was attributed to the accelerated degradation of the gate insulator in proximity to the source region under HTGB configuration. Full article

The program disturbance characteristics of three-dimensional (3D) vertical NAND flash cell array architecture pose a critical reliability challenge due to the lower unselected word line (WL) pass bias (Vpass) window. In other words, the key contradiction of program disturbance is that the operational Vpass during the program’s performance cannot be too high or too low. For instance, the 3D NAND program’s operation string needs a lower Vpass bias to suppress unselected WL Vpass bias-induced Fowler–Nordheim tunneling (FN tunneling), but for the inhibited string, the unselected WL needs a higher Vpass bias to suppress selected WL program bias (Vpgm)-induced FN tunneling. In this paper, a systematical insight into the relationship between the channel potential and channel electron density is given. Based on this intensive investigation, we studied a novel channel preparation scheme using “Gate-induced drain leakage (GIDL) pre-charge”. Our methodology does not require the introduction of any new structures in 3D NAND, or changes in the operational Vpass bias. Instead, the potential on the unselected channel is enhanced by exploiting the holes generated by the GIDL operation effectively, leading to significantly suppressed program disturbance and a larger pass disturb window. To validate the effectiveness of the “GIDL pre-charge” method, TCAD simulation and real silicon data are used. Full article

The structure and phenomena arising from charge transfer in cold field emission mode in a single closed carbon nanotube (CNT) under cold field emission conditions are studied. Inhomogeneities of the structure of CNT in the form of two types of superlattices are found by studying microphotographs obtained by AFM, SEM, and TEM. The features of charge transfer in a quasi-one-dimensional carbon nanotube emitter with a small gap between the anode and cathode are studied under conditions of low-voltage field emission. It is established that the $\mathrm{I}\text{-}\mathrm{V}$ characteristics reveal voltage thresholds and resonant peaks, which are associated with the opening of conduction channels in the region of van Hove singularities. In the region of peaks in the $\mathrm{I}\text{-}\mathrm{V}$ characteristics, the emission current exceeds the one calculated using the Fowler–Nordheim ($\mathrm{F}\text{-}\mathrm{N}$) function by one to three orders of magnitude. The $\mathrm{I}\text{-}\mathrm{V}$ characteristic is not that the curve straightens in F-N coordinates. It is found that the peaks in the $\mathrm{I}\text{-}\mathrm{V}$ characteristics have distinct regions of negative differential conductivity. Full article

Field electron emission, or electron tunneling through a potential energy (PE) barrier under the influence of a strong electrostatic (ES) or radio frequency (RF) field, is of broad interest to the accelerator physics community. For example, it is the source of undesirable dark currents in resonant cavities, providing a limit to high-field operation. Field electron emission can also be applied to quasi-statically model electron emission induced by the electric field in a laser pulse. The classical approach to field electron emission is the Fowler–Nordheim (FN) framework, which incorporates a simplified PE profile and various assumptions. Here, we build a more realistic model using the PE and charge densities derived from a density-functional theory (DFT) calculation. We examine the correction factors associated with each model assumption. Compared to the FN framework, our results can be extended up to 80 GV/m, a limit that has been reached in laser-induced strong field emission scenarios. Full article

Computing-in-memory (CIM) has attracted great attention due to the need for breaking through the “memory wall”. Programmable linear random-access memory (PLRAM) for high-precision weight control is proposed to tear down the wall. However, the slow programming algorithm to tune cells limits its application in multi-level memory. Herein, a fast weight control strategy for PLRAM based on the self-calibrating erase operation is presented. The unique sidewall tunneling oxide utilized in PLRAM for bi-directional Fowler–Nordheim tunneling results in the corner-enhanced poly-to-poly tunneling effect and the self-calibrating capability during the erase process. By adopting this strategy, the efficiency of weight tuning in the PLRAM array is improved by 51% compared with the current method. The worst case is 4.9 ms for erasure, which only needs to be verified 10 times. The improvement of weight tuning efficiency means further development in CIM for PLRAM and also shows the significant prospect of PLRAM used in multi-level memory. Full article