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Polymer-SiO2 Composites II

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Composites and Nanocomposites".

Deadline for manuscript submissions: closed (31 July 2024) | Viewed by 4860

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Guest Editor
University College, Yonsei University, Incheon 21983, Republic of Korea
Interests: silicon chemistry; semiconductor manufacturing material
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Special Issue Information

Dear Colleagues,

Silica is a common, particularly attractive material that is all around us. Silicon and oxygen are the two most abundant elements in the Earth’s crust, and their combination, silica, has been used in various fields. The bond enthalpy of Si–O is much larger than that of the C–O bond, rendering the thermal stability of silica, and its larger bond angle and longer bond length provide bond flexibility. In addition, uncondensed OH groups (silanol) on the silica surface make it easy for silica to connect with other materials, such as organic compounds, metal oxides, and metals. 

Through the hybridization of silica with suitable materials, polymer/SiO2 composites can be customized in many ways to meet the needs of new cutting-edge technologies. For example, investigations on their applications in sensors, photoactive materials, filters, anodes in lithium-ion batteries, drug delivery systems, catalysts, and biocompatible materials have been conducted.

This Special Issue will cover, but will not be limited to, the following aspects of polymer/SiO2 composite chemistry and technology: novel preparation methods for polymer/SiO2 composites; mechanism of formation of polymer/SiO2 composites; novel micro- and macrostructural analysis of polymer/SiO2 composites; novel chemical and physical properties of polymer/SiO2 composites; and applications of polymer/SiO2 composites.

Prof. Dr. Hyeon Mo Cho
Guest Editor

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Keywords

  • silica-based polymer
  • SiO2-based polymer
  • polymer
  • composite
  • sol-gel
  • organic–inorganic composite

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Published Papers (2 papers)

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Research

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15 pages, 4899 KiB  
Article
Mitigation of Silicon Contamination in Fuel Cell Gasket Materials through Silica Surface Treatment
by Yoo Lim Sim, Jaewon Lee, Su Min Oh, Dong Beom Kim, Kijong Kim, Sung-Hyeon Baeck, Sang Eun Shim and Yingjie Qian
Polymers 2024, 16(7), 914; https://doi.org/10.3390/polym16070914 - 26 Mar 2024
Cited by 1 | Viewed by 1561
Abstract
Gaskets and seals are essential components in the operation of proton exchange membrane (PEM) fuel cells and are required for keeping hydrogen and air/oxygen within their individual compartments. The durability of these gaskets and seals is necessary, as it influences not only the [...] Read more.
Gaskets and seals are essential components in the operation of proton exchange membrane (PEM) fuel cells and are required for keeping hydrogen and air/oxygen within their individual compartments. The durability of these gaskets and seals is necessary, as it influences not only the lifespan but also the electrochemical efficiency of the PEM fuel cell. In this study, the cause of silicon leaching from silicone gaskets under simulated fuel cell conditions was investigated. Additionally, to reduce silicon leaching, the silica surface was treated with methyltrimethoxysilane, vinyltriethoxysilane, and (3,3,3-trifluoropropyl)trimethoxysilane. Changes in the silica surface chemistry were investigated by scanning electron microscopy, energy dispersive X-ray spectroscopy, thermogravimetric analysis, elemental analysis, X-ray photoelectron spectroscopy, and Fourier transform infrared spectroscopy. Inductively coupled plasma-optical emission spectroscopy analysis revealed that surface-treated silica was highly effective in reducing silicon leaching. Full article
(This article belongs to the Special Issue Polymer-SiO2 Composites II)
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Review

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47 pages, 16044 KiB  
Review
Comprehensive Review on the Impact of Chemical Composition, Plasma Treatment, and Vacuum Ultraviolet (VUV) Irradiation on the Electrical Properties of Organosilicate Films
by Mikhail R. Baklanov, Andrei A. Gismatulin, Sergej Naumov, Timofey V. Perevalov, Vladimir A. Gritsenko, Alexey S. Vishnevskiy, Tatyana V. Rakhimova and Konstantin A. Vorotilov
Polymers 2024, 16(15), 2230; https://doi.org/10.3390/polym16152230 - 5 Aug 2024
Cited by 3 | Viewed by 2224
Abstract
Organosilicate glass (OSG) films are a critical component in modern electronic devices, with their electrical properties playing a crucial role in device performance. This comprehensive review systematically examines the influence of chemical composition, vacuum ultraviolet (VUV) irradiation, and plasma treatment on the electrical [...] Read more.
Organosilicate glass (OSG) films are a critical component in modern electronic devices, with their electrical properties playing a crucial role in device performance. This comprehensive review systematically examines the influence of chemical composition, vacuum ultraviolet (VUV) irradiation, and plasma treatment on the electrical properties of these films. Through an extensive survey of literature and experimental findings, we elucidate the intricate interplay between these factors and the resulting alterations in electrical conductivity, dielectric constant, and breakdown strength of OSG films. Key focus areas include the impact of diverse organic moieties incorporated into the silica matrix, the effects of VUV irradiation on film properties, and the modifications induced by various plasma treatment techniques. Furthermore, the underlying mechanisms governing these phenomena are discussed, shedding light on the complex molecular interactions and structural rearrangements occurring within OSG films under different environmental conditions. It is shown that phonon-assisted electron tunneling between adjacent neutral traps provides a more accurate description of charge transport in OSG low-k materials compared to the previously reported Fowler–Nordheim mechanism. Additionally, the quality of low-k materials significantly influences the behavior of leakage currents. Materials retaining residual porogens or adsorbed water on pore walls show electrical conductivity directly correlated with pore surface area and porosity. Conversely, porogen-free materials, developed by Urbanowicz, exhibit leakage currents that are independent of porosity. This underscores the critical importance of considering internal defects such as oxygen-deficient centers (ODC) or similar entities in understanding the electrical properties of these materials. Full article
(This article belongs to the Special Issue Polymer-SiO2 Composites II)
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