Special Issue "Flexible Electronics and Sensors"
Deadline for manuscript submissions: closed (30 June 2017)
Many of real world problems that require flexible electronics and sensor systems demand an installation on or in mechanically soft, or topologically irregular, or constantly moving, objects. One good example is in vivo physiological sensors on skin or inside of the body. The problem is that most conventional sensors have rigid form factors. The field of “Flexible Electronics and Sensors”, which addresses the solutions to these problems, is an interdisciplinary engineering field that requires a comprehensive understanding of materials science, mechanical engineering, electrical engineering, chemistry, and physics at practical levels.
The aim of this Special Issue is to bring together innovative developments in a broad spectrum of flexible electronics and sensor research. Papers addressing the wide range of aspects of this technology are sought, including, but not limited to, recent developments in new active and passive material components for flexible electronics and sensors, fundamental and applied science issues underlying flexible systems and their fabrication, technologies for process integration of flexible electronics and sensors, and studies on real-life applications, including clinical healthcare applications.
Both review articles and original research papers are solicited. There is particular interest in papers envisioning innovative sensor applications that have not been possible with conventional rigid materials and form factors.
Prof. Dr. Hyun-Joong Chung
Prof. Dr. Tae-il Kim
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Flexible electronics and Sensors
- Stretchable electronics and Sensors
- Smart materials
- System integration
- Device fabrication
- Application of flexible sensors