Advanced Sensors in MEMS: 2nd Edition
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".
Deadline for manuscript submissions: 10 January 2025 | Viewed by 37
Special Issue Editors
Interests: MEMS; inertial sensors; microsystems; signal processing and control; microtechnologies; ultrasound; CMUT
Special Issues, Collections and Topics in MDPI journals
Interests: MEMS; polymer MEMS; laser micromachining; additive manufacturing; polymer micromachining; tactile sensors
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Microelectromechanical systems (MEMS) are microstructures able to couple the mechanical and electrical energy domains at micro- or nanoscales, often involving other energy domains in these interactions. Their micrometre-scale dimensions generate both specific advantages (e.g., electromechanical feedback control, fast time response and better efficiency for some specific sensing mechanisms) and challenges (e.g., lower energy generation yield for thermal micromachines), allowing researchers to rethink the design and analysis methods for customized macroengineering at microscale solutions. Technological advances in MEMS initially took advantage of the existing microelectronics industry, and they have gradually spurred specific microfabrication methods, moving beyond silicon. In this context, an increasing amount of research and number of applications have emerged for MEMS transducers.
This Special Issue will encompass high-quality research contributions focusing on the advances in MEMS sensors. Topics to be covered include (but are not limited to) the following:
- Suitable mechanisms for enhanced sensing in microsystems: weakly coupled resonators, stochastic resonance, parametric amplification, operation on the stability border, etc.;
- Modern techniques for interfacing transducers to electronic systems for advanced signal processing and data fusion (sigma-delta, sliding mode control, etc.), including hybrid integration techniques between MEMS devices and electronic subsystems;
- Modern trends, e.g., polymer CMUT transducer arrays for ultrasound imaging (from Si to alternative technologies);
- Sensor arrays and sensor networks, including data fusion aspects;
- The stimulated coupling between clusters of MEMS sensors and present advances in intelligent signal processing, including machine learning aspects integrated with high-performance sensing.
Prof. Dr. Edmond Cretu
Dr. Chang Ge
Guest Editors
Manuscript Submission Information
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- microsystems
- MEMS
- microsensors
- microfabrication
- sensor networks
- intelligent sensors
Related Special Issue
- Advanced Sensors in MEMS in Sensors (10 articles)
