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Special Issue "State-of-the-Art Sensors Technology in Portugal 2020-2021"

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "State-of-the-Art Sensors Technologies".

Deadline for manuscript submissions: 31 July 2021.

Special Issue Editors

Prof. Dr. Gaspar Rego
E-Mail Website1 Website2
Guest Editor
1. proMetheus-Research Unit in Materials, Energy and Environment for Sustainability, Polytechnic Institute of Viana do Castelo, Portugal
2. Institute for Systems and Computer Engineering, Technology and Science, Porto, Portugal
Interests: optical fiber sensors; arc-induced long-period fiber gratings; fiber gratings; biosensors; environmental sensors
Special Issues and Collections in MDPI journals
Prof. Dr. Paulo M. Mendes
E-Mail Website
Guest Editor
Center for Microelectromechanical Systems (CMEMS), University of Minho, 4800-058 Guimarães, Portugal
Interests: RF electronics; RF passives; wireless sensor networks; micro/nanosystems integration and miniaturization; on-chip antennas; wireless powered microdevices; biomedical devices
Special Issues and Collections in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Issue will provide a comprehensive overview of the state of the art of sensor technology in Portugal. We invite research articles that consolidate our understanding of this area. The Special Issue will publish full research papers and reviews. Potential topics include, but are not limited to the following:

  • Optical fiber sensors
  • Medical sensors
  • Optical fiber instrumentation
  • Antenna and microwave design for wireless sensor applications
  • Physical sensors
  • Chemical sensors
  • Biosensors
  • Advanced materials for sensing
  • Internet of Things
  • Industrial sensors and IoT protocols
  • Remote sensors
  • Sensor networks
  • Smart/Intelligent sensors
  • Sensor devices
  • Sensor technology and application
  • Sensing principles
  • Optoelectronic and photonic sensors
  • Optomechanical sensors
  • Sensor arrays and chemometrics
  • Micro- and nanosensors
  • Signal processing, data fusion, and deep learning in sensor systems
  • Human–computer Interaction
  • MEMS/NEMS

Prof. Dr. Gaspar Rego
Prof. Dr. Paulo Mendes
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (2 papers)

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Research

Open AccessArticle
Hybrid Multisite Silicon Neural Probe with Integrated Flexible Connector for Interchangeable Packaging
Sensors 2021, 21(8), 2605; https://doi.org/10.3390/s21082605 - 08 Apr 2021
Viewed by 279
Abstract
Multisite neural probes are a fundamental tool to study brain function. Hybrid silicon/polymer neural probes combine rigid silicon and flexible polymer parts into one single device and allow, for example, the precise integration of complex probe geometries, such as multishank designs, with flexible [...] Read more.
Multisite neural probes are a fundamental tool to study brain function. Hybrid silicon/polymer neural probes combine rigid silicon and flexible polymer parts into one single device and allow, for example, the precise integration of complex probe geometries, such as multishank designs, with flexible biocompatible cabling. Despite these advantages and benefiting from highly reproducible fabrication methods on both silicon and polymer substrates, they have not been widely available. This paper presents the development, fabrication, characterization, and in vivo electrophysiological assessment of a hybrid multisite multishank silicon probe with a monolithically integrated polyimide flexible interconnect cable. The fabrication process was optimized at wafer level, and several neural probes with 64 gold electrode sites equally distributed along 8 shanks with an integrated 8 µm thick highly flexible polyimide interconnect cable were produced. The monolithic integration of the polyimide cable in the same fabrication process removed the necessity of the postfabrication bonding of the cable to the probe. This is the highest electrode site density and thinnest flexible cable ever reported for a hybrid silicon/polymer probe. Additionally, to avoid the time-consuming bonding of the probe to definitive packaging, the flexible cable was designed to terminate in a connector pad that can mate with commercial zero-insertion force (ZIF) connectors for electronics interfacing. This allows great experimental flexibility because interchangeable packaging can be used according to experimental demands. High-density distributed in vivo electrophysiological recordings were obtained from the hybrid neural probes with low intrinsic noise and high signal-to-noise ratio (SNR). Full article
(This article belongs to the Special Issue State-of-the-Art Sensors Technology in Portugal 2020-2021)
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Open AccessArticle
Frequency-Spectra-Based High Coding Capacity Chipless RFID Using an UWB-IR Approach
Sensors 2021, 21(7), 2525; https://doi.org/10.3390/s21072525 - 04 Apr 2021
Viewed by 392
Abstract
A novel methodology is proposed to reliably predict the resonant characteristics of a multipatch backscatter-based radio frequency identification (RFID) chipless tag. An ultra-wideband impulsion radio (UWB-IR)-based reader interrogates the chipless tag with a UWB pulse, and analyzes the obtained backscatter in the time [...] Read more.
A novel methodology is proposed to reliably predict the resonant characteristics of a multipatch backscatter-based radio frequency identification (RFID) chipless tag. An ultra-wideband impulsion radio (UWB-IR)-based reader interrogates the chipless tag with a UWB pulse, and analyzes the obtained backscatter in the time domain. The RFID system consists of a radar cross-section (RCS)-based chipless tag containing a square microstrip patch antenna array in which the chipless tag is interrogated with a UWB pulse by an UWB-IR-based reader. The main components of the backscattered signal, the structural mode, and the antenna mode were identified and their spectral quality was evaluated. The study revealed that the antenna-mode backscatter includes signal carrying information, while the structural mode backscatter does not include any tag information. The simulation findings were confirmed by experimental measurements obtained in an anechoic chamber environment using a 6-bit multipatch chipless RFID tag. Finally, the novel technique does not use calibration tags and can freely orient tags with respect to the reader. Full article
(This article belongs to the Special Issue State-of-the-Art Sensors Technology in Portugal 2020-2021)
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