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Selected Papers from the 2nd International Conference on AI Sensors and Transducers

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".

Deadline for manuscript submissions: 31 December 2025 | Viewed by 55

Special Issue Editor


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Guest Editor
Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117576, Singapore
Interests: MEMS; NEMS; nanophotonics; Si photonics; metamaterials; energy harvesting; wearable sensors; flexible electronics; Artificial Intelligence of Things (AIoT); Internet of Things (IoT); electroceuticals and biomedical applications
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Special Issue Information

Dear Colleagues,

This Special Issue was created in collaboration with the 2nd International Conference on AI Sensors and Transducers (AIS 2025, https://sciforum.net/event/AIS2025), which will be held in Kuala Lumpur, Malaysia, from 29 July to 3 August 2025.

It comprises twenty-eight symposia. The conference participants are cordially invited to contribute a full manuscript to this Special Issue and will receive a 20% discount on the Article Processing Charge.

Symposia:

S1. Lab-on-a-chip (LoC) and MicroTAS
S2. Biosensors and Biomedical Devices
S3. In-body IoT Sensing Technology, Electroceuticals and Neural Interfaces
S4. Nanophotonics and Metasurface
S5. Acoustic, RF, THz Metamaterials and AI-Enabled Metamaterials
S6. Neuromorphic Computing, In-Memory Computing and Applications
S7. Photonics Integrated Circuits (PIC) and Novel Materials
S8. Enabling Technology for Photonic Neural Networks (PNN) and Applications
S9. In-Sensor Computing and Enabling Technology for Edge Computing
S10. MEMS/NEMS Sensors
S11. Semiconductor Sensors, Photodetectors and CMOS MEMS
S12. Piezoelectric MEMS and Resonators – FBAR, SAW, pMUT
S13. Piezoelectric Transducers and Energy Harvesters
S14. Ferroelectric / Perovskite / 2D Materials Thin Film and Applications
S15. Gas Sensors and Chemosensors
S16. Triboelectric Nanogenerators and Self-powered Sensors
S17. Energy Harvesting Technology and Applications
S18. Flexible, Stretchable and Wearable Sensors
S19. Wearable AI Sensors
S20. AI-enhanced Tactile Sensors and e-Skin
S21. Haptic Technology and Applications
S22. Advanced Sensors for Robots and Autonomous Systems
S23. Intelligent Sensors and AI-Enhanced Humanoids
S24. Enabling Technology for Digital Twin, Metaverse, and Smart Sensing Systems
S25. AIoT Technology and Applications

Prof. Dr. Chengkuo Lee
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • AI
  • sensors
  • transducers
  • MEMS

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Published Papers

This special issue is now open for submission.
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