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Special Issue "Flexible Inorganic Materials for New Sensors"

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Sensor Materials".

Deadline for manuscript submissions: 31 December 2021.

Special Issue Editors

Dr. Tomohiko Nakajima
E-Mail Website
Guest Editor
Advanced Coating Technology Research Center, National Institute of Advanced Industrial Science and Technology, Ibaraki 305-8565, Japan
Interests: Low temperature processing of ceramic films; Photo-crystallization; Laser fabrication of inorganic materials; Wearable sensors
Prof. Dr. Tohru Sugahara
E-Mail Website
Guest Editor
The Institute of Scientific and Industrial Research, Osaka University, Osaka 567-0047, Japan
Interests: Gas sensor; Photovoltaic; Thin film transistor
Dr. Yuki Fujio
E-Mail Website
Guest Editor
Sensing System Research Center, National Institute of Advanced Industrial Science and Technology (AIST), Saga 841-0052, Japan
Interests: Mechanoluminescence material; Liquid-phase synthesis; Optical imaging; Inorganic/Organic composite film; Visualization of strain/stress distribution

Special Issue Information

Dear Colleagues,

Flexible devices have attracted much attention because of their new roles in healthcare monitoring for extending healthy life expectancy and 3D-electronics for next-generation advanced devices. In healthcare monitoring, it is necessary to fabricate various sensors directly onto highly flexible plastic substrates for the accurate diagnosis of pre-symptomatic states through real-time monitoring. In 3D-electronics, sensing devices are very important to realize new functionalities, and they should be incorporated into complex-shaped plastic objects. In either device, inorganic materials such as ceramics and metal alloys for sensors, resistors, capacitors, illuminators, and electric source-related components are highly essential because of their sufficient chemical and physical durability. However, it was not easy to combine high functionality and flexibility due to the high fabrication temperatures of inorganic materials and the low heat resistance of flexible plastic substrates. Nevertheless, recent studies of low-temperature processes and the enhancement of precursor reactivity have achieved the fabrication of inorganic materials on plastic substrates by using new approaches. In this Special Issue, we call for papers presenting advances in flexible inorganic materials for new sensor devices. Topics in general include, but are not limited to, the following:

- Flexible sensor devices using ceramics and metal alloy components

- Low temperature direct-processing of ceramics and metal alloys on plastics

- Packaging technology of ceramics and metal alloys on plastics

- Ceramic and metal alloy films on complex-shaped substrates for 3D-electronics.

Dr. Tomohiko Nakajima
Prof. Dr. Tohru Sugahara
Dr. Yuki Fujio
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • flexible sensors
  • wearable sensors
  • bio-sensing devices
  • flexible ceramics and metal alloys
  • low temperature processing
  • 3D-electronics
  • packaging technology

Published Papers

This special issue is now open for submission.
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