Special Issue "Flexible Inorganic Materials for New Sensors"
Deadline for manuscript submissions: 31 December 2021.
Interests: Low temperature processing of ceramic films; Photo-crystallization; Laser fabrication of inorganic materials; Wearable sensors
Interests: Gas sensor; Photovoltaic; Thin film transistor
Interests: Mechanoluminescence material; Liquid-phase synthesis; Optical imaging; Inorganic/Organic composite film; Visualization of strain/stress distribution
Flexible devices have attracted much attention because of their new roles in healthcare monitoring for extending healthy life expectancy and 3D-electronics for next-generation advanced devices. In healthcare monitoring, it is necessary to fabricate various sensors directly onto highly flexible plastic substrates for the accurate diagnosis of pre-symptomatic states through real-time monitoring. In 3D-electronics, sensing devices are very important to realize new functionalities, and they should be incorporated into complex-shaped plastic objects. In either device, inorganic materials such as ceramics and metal alloys for sensors, resistors, capacitors, illuminators, and electric source-related components are highly essential because of their sufficient chemical and physical durability. However, it was not easy to combine high functionality and flexibility due to the high fabrication temperatures of inorganic materials and the low heat resistance of flexible plastic substrates. Nevertheless, recent studies of low-temperature processes and the enhancement of precursor reactivity have achieved the fabrication of inorganic materials on plastic substrates by using new approaches. In this Special Issue, we call for papers presenting advances in flexible inorganic materials for new sensor devices. Topics in general include, but are not limited to, the following:
- Flexible sensor devices using ceramics and metal alloy components
- Low temperature direct-processing of ceramics and metal alloys on plastics
- Packaging technology of ceramics and metal alloys on plastics
- Ceramic and metal alloy films on complex-shaped substrates for 3D-electronics.
Dr. Tomohiko Nakajima
Prof. Dr. Tohru Sugahara
Dr. Yuki Fujio
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- flexible sensors
- wearable sensors
- bio-sensing devices
- flexible ceramics and metal alloys
- low temperature processing
- packaging technology