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Advanced Sensing Systems for Building Inspection, Visualization and Assessment

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".

Deadline for manuscript submissions: 31 August 2026 | Viewed by 11

Special Issue Editors


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Guest Editor
School of Architecture & Urban Planning, Shenzhen University, Shenzhen 518060, China
Interests: sustainable housing; AI-driven building detection; human-centered design; existing building renovation; neighborhood regeneration
Special Issues, Collections and Topics in MDPI journals
School of Architecture & Urban Planning, Shenzhen University, Shenzhen 518060, China
Interests: green building; urban diagnostic; healthy built environment; climate-response design

E-Mail Website
Guest Editor
Guangdong Key Laboratory of Urban Informatics, Shenzhen University, Shenzhen 518060, China
Interests: photogrammetry; image matching; structure from motion; 3D reconstruction; deep learning

Special Issue Information

Dear Colleagues,

This Special Issue focuses on innovative sensing technologies and intelligent systems for building condition assessment, defect detection, and heritage preservation. We invite contributions on multi-modal sensor integration (visible, thermal, LiDAR, hyperspectral, etc.,), AI-enhanced analysis, digital twin visualization, and automated inspection frameworks that advance building maintenance practices and smart city infrastructure development. Core research areas and topics include, but are not limited to, the following:

  • Automated inspection platforms (UAV swarms, robotic systems, mobile mapping system);
  • Multi-modal building sensing (Visible/thermal/ LiDAR/ hyperspectral imaging);
  • AI-driven defect detection (deep learning for crack, moisture, material degradation detection);
  • 3D reconstruction and digital twins for building modeling and envelope assessment;
  • Real-time monitoring systems for ageing infrastructure;
  • Heritage building preservation through advanced imaging;
  • Energy performance assessment via façade thermal analysis;
  • Non-destructive testing technologies (ground-penetrating radar, acoustics, vibration sensors).

Prof. Dr. Yue Fan
Dr. Fei Xue
Dr. San Jiang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • UAV-based building inspection
  • multi-modal sensing for buildings
  • deep learning for defect detection
  • building envelope assessment
  • crack and moisture detection
  • 3D building reconstruction
  • parametric visualization for building diagnostics
  • smart building maintenance systems
  • digital twins for existing buildings
  • heritage conservation technologies

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Published Papers

This special issue is now open for submission.
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