Towards Next-Gen Superconductors: Thin Film Design, Interface Control, and Integration
A special issue of Processes (ISSN 2227-9717). This special issue belongs to the section "Materials Processes".
Deadline for manuscript submissions: 30 December 2025 | Viewed by 1
Special Issue Editors
Interests: quantum device fabrication; material chemistry; material interface; self-assembled monolayer; molecular/bio-spintronics; photo-induced electron transfer
Interests: synchrotron characterization; thin film fabrication; 2D materials; hard X-ray photoemission spectroscopy; magnetism; ionizing radiation effects; quantum materials; interface properties
Special Issue Information
Dear Colleagues,
Superconducting thin films remain significant in the development of quantum technologies, energy-efficient electronics, next-generation sensing platforms, etc. This Special Issue aims to highlight cutting-edge research on the design, characterization, and application of superconducting thin films, with a particular focus on material interfaces in complex systems.
We welcome contributions that explore innovative approaches in thin film fabrication, including epitaxial growth, interface engineering, functionalization, interface engineering, and novel deposition techniques. We particularly seek studies that address the interplay between the structure, composition, and properties of superconducting thin films and the challenges in attaining high critical current densities and an excellent internal quality factor.
This Special Issue also aims to showcase interdisciplinary advances that integrate superconducting thin films with semiconductors, magnetic materials, or dielectrics, establishing hybrid devices for applications in quantum computing, cryogenic memory, RF filters, and medical imaging technologies.
Topics of interest include, but are not limited to, the following:
- Novel superconducting materials and heterostructures;
- Thin film deposition techniques and patterning strategies;
- Structural, electrical, and magnetic characterization;
- Vortex dynamics and flux pinning in thin films;
- Integration with cryo-CMOS and quantum circuits;
- Superconducting electronics and device applications;
- The modeling and simulation of superconducting interfaces;
- Encapsulation strategies to prevent oxide layer growth.
We encourage the submission of original research articles, reviews, and perspective pieces that contribute to a deeper understanding and superconducting thin films and improve their applicability.
Dr. Senthil Kumar Karuppannan
Dr. Aswin Kumar Anbalagan
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Processes is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- superconducting thin film
- material interface
- quantum device
- thin film deposition
- etching process
- patterning
- dielectric
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