High-Reliability Packaging Manufacturing Processes in Next-Generation Power Electronics
A special issue of Processes (ISSN 2227-9717). This special issue belongs to the section "Manufacturing Processes and Systems".
Deadline for manuscript submissions: 31 August 2026 | Viewed by 22
Special Issue Editors
Interests: module packaging; packaging materials; reliability; thermal management; module design and manufacturing; modelling and simulation; sensor
Special Issue Information
Dear Colleagues,
The rapid evolution of next-generation power electronics, driven by wide-bandgap semiconductors (SiC, GaN), ultra-high-power density demands, and extreme application environments (e.g., electric vehicles, renewable energy, aerospace), has fundamentally shifted the performance bottleneck from devices to packaging. Traditional packaging architectures and manufacturing processes are increasingly inadequate in meeting the simultaneous requirements of electrical efficiency, thermal management, mechanical robustness, and long-term reliability under high-temperature, high-power cycling, and harsh operating conditions. Therefore, dedicated research into ‘High-Reliability Packaging Manufacturing Processes’ is not merely beneficial but imperative. This Special Issue aims to bridge the gap between semiconductor innovation and practical, reliable implementation by focusing on the manufacturing methodologies that ensure long-term operational integrity. Addressing challenges related to thermal management, electrical integrity, mechanical robustness, and long-term material stability under extreme operating conditions through advanced manufacturing processes is crucial for robust power electronic systems.
This Special Issue on ‘High-Reliability Packaging Manufacturing Processes in Next-Generation Power Electronics’ aims to cover the latest advancements in the field of power electronic device packaging and manufacturing.
Topics include, but are not limited to the following:
- Advanced Die-Attach Techniques for High-Power Density Packaging;
- Innovative Substrate and Interconnect Manufacturing;
- Advanced Thermal Management in WBG Device Packaging;
- Thermal Interface Material (TIM) Application and Curing Processes;
- In-Process Monitoring, Control, and Defect Detection;
- Three-dimensional Integration and Heterogeneous Packaging Manufacturing:
- Reliability-Enhanced Bonding Technologies;l
- Long-Term Reliability Assessment and Accelerated Testing Methodologies.
Thank you, and I hope you will consider participating in this Special Issue.
Dr. Bowen Zhang
Dr. Chuantong Chen
Guest Editors
Manuscript Submission Information
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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Processes is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- module packaging
- packaging materials
- reliability
- thermal management
- module design and manufacturing
- modelling and simulation
- sensor
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