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Next-Generation Convergence Industry and Adhesives

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A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".

Deadline for manuscript submissions: closed (31 March 2021) | Viewed by 17268

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Special Issue Editor

Dr. Ji-Won Park

E-Mail Website
Guest Editor

R&D Center of JB Lab Corporation, Seoul 08826, Korea
Interests: adhesive; coating; biocomposites; UV technology; film; biocompatible materials

Special Issue Information

We are currently living a smart life which is based on the convergence industry, an industry which is changing very rapidly. The boundaries between technologies are breaking down, and many research groups are trying to showcase their own differentiated technologies. Adhesives play a very important role in the convergence of technology, being used for fusion of functions, away from the purpose of speeding up the system. The role of adhesives has been greatly diversified, such as in terms of emotional design, complex functionality, development of lightweight systems, and grafting of eco-friendly technologies. As the importance of adhesives emerges, the scope of the research is also expanding.

This Special Issue is intended to cover research topics on the role of adhesives in the next-generation industry. We will discuss topics such as the analysis of adhesive performance, adhesives with various functionalities, system packaging using adhesives, and reliability evaluation of adhesives. Through these discussions, we would like to look at the role of adhesives in the next-generation industry in the future and predict the direction of future research and development.

Keywords

convergence industry
adhesive
display
semiconductor
automotive
aerospace
basic performance
reliability
composite function
light weight

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Published Papers (4 papers)

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Research

13 pages, 2711 KiB

Open AccessArticle

Characterization of an Experimental Two-Step Self-Etch Adhesive’s Bonding Performance and Resin-Dentin Interfacial Properties

by Abu Faem Mohammad Almas Chowdhury, Arefin Alam, Monica Yamauti, Pedro Álvarez Lloret, Pipop Saikaew, Ricardo Marins Carvalho and Hidehiko Sano

Polymers 2021, 13(7), 1009; https://doi.org/10.3390/polym13071009 - 25 Mar 2021

Cited by 13 | Viewed by 3726

Abstract

This study evaluated an experimental two-step self-etch adhesive (BZF-29, BZF) by comparing it with a reference two-step self-etch adhesive (Clearfil Megabond 2, MB) and a universal adhesive (G-Premio Bond, GP) for microtensile bond strength (μTBS) and resin-dentin interfacial characteristics. Twenty-four human third molars were used for the μTBS test. Bonded peripheral dentin slices were separated to observe the resin-dentin interface and measure the adhesive layer thickness with SEM. μTBS data of the central beams were obtained after 24 h and 6 months of water storage. Fracture modes were determined using a stereomicroscope and SEM. Nine additional third molars were used to determine the elastic modulus (E) employing an ultra microhardness tester. Water storage did not affect μTBS of the tested adhesives (p > 0.05). μTBS of BZF and MB were similar but significantly higher than GP (p < 0.05). BZF achieved the highest adhesive layer thickness, while GP the lowest. E of BZF and MB were comparable but significantly lower than GP (p < 0.05). Except for GP, the predominant fracture mode was nonadhesive. The superior bonding performance of BZF and MB could be attributed to their better mechanical property and increased adhesive thickness imparting better stress relief at the interface. Full article

(This article belongs to the Special Issue Next-Generation Convergence Industry and Adhesives)

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12 pages, 3633 KiB

Open AccessArticle

Transparent Electromagnetic Shielding Film Utilizing Imprinting-Based Micro Patterning Technology

by Hyun-Seok Choi, Su-Jeong Suh, Sang-Woo Kim, Hyun-Joong Kim and Ji-Won Park

Polymers 2021, 13(5), 738; https://doi.org/10.3390/polym13050738 - 27 Feb 2021

Cited by 17 | Viewed by 4172

Abstract

Utilization of methods involving component integration has accelerated, owing to the growth of the smart mobile industry. However, this integration leads to interference issues between the components, thereby elucidating the importance of the electromagnetic interference (EMI) shielding technology to solve such issues. EMI shielding technology has been previously implemented via the reflection or absorption of electromagnetic waves by using conductive materials. Nevertheless, to tackle the recent changes in the industry, a transparent and flexible EMI shielding technology is necessitated. In this study, a transparent and flexible EMI shielding material was fabricated by filling a conductive binder in a film comprising an intaglio pattern; this was achieved by using the ultraviolet (UV) imprinting technology to realize mass production. Subsequently, changes in the aperture ratio and shielding characteristics were analyzed according to the structure of the pattern. Based on this analysis, a square pattern was designed and a film with an intaglio pattern was developed through a UV imprinting process. Furthermore, it was confirmed that the transmittance, conductivity, and EMI shielding rate of the film were altered while changing the coating thickness of the conductive particles in the intaglio pattern. The final film prepared in this study exhibited characteristics that satisfied the required EMI shielding performance for electric and electronic applications, while achieving flexible structural stability and transparency. Full article

(This article belongs to the Special Issue Next-Generation Convergence Industry and Adhesives)

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15 pages, 2697 KiB

Open AccessArticle

Enhanced Heat Resistance of Acrylic Pressure-Sensitive Adhesive by Incorporating Silicone Blocks Using Silicone-Based Macro-Azo-Initiator

by Hee-Woong Park, Hyun-Su Seo, Kiok Kwon, Jung-Hyun Lee and Seunghan Shin

Polymers 2020, 12(10), 2410; https://doi.org/10.3390/polym12102410 - 19 Oct 2020

Cited by 16 | Viewed by 5163

Abstract

To improve the heat resistance of acrylic-based pressure-sensitive adhesive (PSA), silicone-block-containing acrylic PSAs (SPSAs) were synthesized using a polydimethylsiloxane (PDMS)-based macro-azo-initiator (MAI). To evaluate the heat resistance of the PSA films, the probe tack and 90° peel strength were measured at different temperatures. The acrylic PSA showed that its tack curves changed from balanced debonding at 25 °C to cohesive debonding at 50 °C and exhibited a sharp decrease. However, in the case of SPSA containing 20 wt% MAI (MAI20), the balanced debonding was maintained at 75 °C, and its tack value hardly changed with temperature. As the MAI content increased, the peel strength at 25 °C decreased due to the microphase separation between PDMS- and acryl-blocks in SPSA, but the shear adhesion failure temperature (SAFT) increased almost linearly from 41.3 to 122.8 °C. Unlike stainless steel substrate, SPSA showed improved peel strength on a polypropylene substrate due to its low surface energy caused by PDMS block. Owing to the addition of 20 wt% silicone-urethane dimethacrylate oligomer and 200 mJ/cm² UV irradiation dose, MAI20 showed significantly increased 90° peel strength at 25 °C (548.3 vs. 322.4 gf/25 mm for pristine MAI20). Its heat resistance under shear stress assessed by shear adhesion failure test (SAFT) exhibited raising in failure temperature to 177.3 °C when compared to non-irradiated sample. Full article

(This article belongs to the Special Issue Next-Generation Convergence Industry and Adhesives)

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12 pages, 4978 KiB

Open AccessArticle

Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers

by Hyun-Seok Choi, Ji-Won Park, Kyung-Sub Lee, Sang-Woo Kim and Su-Jeong Suh

Polymers 2020, 12(10), 2318; https://doi.org/10.3390/polym12102318 - 10 Oct 2020

Cited by 4 | Viewed by 3503

Abstract

This paper proposes dual-functional sheets (DFSs) that simultaneously have high thermal conductivity (TC) and electromagnetic interference (EMI) absorbing properties, making them suitable for use in mobile electronics. By adopting a simple but highly efficient dry process for manufacturing core–shell structured fillers (CSSFs) and formulating a close-packed filler composition, the DFSs show high performance, TC of 5.1 W m⁻¹ K⁻¹, and a −4 dB inter-decoupling ratio (IDR) at a 1 GHz frequency. Especially, the DFSs show a high dielectric breakdown voltage (BDV) of 3 kV mm⁻¹, which is beneficial for application in most electronic devices. The DFSs consist of two kinds of CSSFs that are blended in accordance with the close-packing rule, Horsfield’s packing model, and with polydimethylsiloxane (PDMS) polymers. The core materials are soft magnetic Fe-12.5%Cr and Fe-6.5%Si alloy powders of different sizes, and Al₂O₃ ceramic powders of a 1-μm diameter are used as the shell material. The high performance of the DFS is supposed to originate from the thick and stable shell layer and the maximized filler loading capability owing to the close-packed structure. Full article

(This article belongs to the Special Issue Next-Generation Convergence Industry and Adhesives)

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