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Polymers
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Functional Polymeric Materials for Electrical Insulation Application
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Functional Polymeric Materials for Electrical Insulation Application

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Smart and Functional Polymers".

Deadline for manuscript submissions: closed (10 September 2023) | Viewed by 6480

Special Issue Editors

Dr. Zhikang Yuan

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Guest Editor
Department of Electrical Engineering, College of Electronic and Information Engineering, Tongji University, Shanghai 201804, China
Interests: smart dielectrics; nonlinear composite; outdoor insulation; electric properties
Special Issues, Collections and Topics in MDPI journals
Dr. Geng Chen

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Guest Editor
Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Beijing 102206, China
Interests: dielectrics materials; gas insulation; gas-solid interface charging; high voltage engineering
Dr. Sichen Qin

E-Mail Website
Guest Editor
School of Electrical Engineering, Xi’an University of Technology, Xi’an 710048, China
Interests: extreme environments; space charge; conductivity; dielectric properties; polymer dielectrics

Special Issue Information

Dear Colleagues,

As the keystone of electrical insulation systems, functional polymeric materials play a leading role in the upgrading of electrical and electronic equipment in the field, including new power systems, microelectronics, and aerospace. With the development of electrical equipment towards large capacity, high voltage, and high-power density, the insulation system of electrical and electronic equipment must withstand serious electric-field distortion, higher-temperature operating conditions and great mechanical stress. Functional polymeric materials with high dielectric strength, high thermal conductivity, high electric-corrosion resistance, non-linear conductance, self-healing ability, etc., provide effective solutions to meet these new requirements. This Special Issue intends to discuss the design, preparation, dielectric properties, testing methods, failure mechanism, and application of functional polymeric materials for electrical insulation. It aims to help all potential readers further understand all aspects in this field.

Dr. Zhikang Yuan
Dr. Geng Chen
Dr. Sichen Qin
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • design
  • preparation
  • dielectric properties
  • testing methods
  • failure mechanism
  • application

Published Papers (4 papers)

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Research

12 pages, 3111 KiB  
Article
Non-Coplanar Diphenyl Fluorene and Weakly Polarized Cyclohexyl Can Effectively Improve the Solubility and Reduce the Dielectric Constant of Poly (Aryl Ether Ketone) Resin
by Feng Bao, Yanxing Liu, Ludi Shi, Jinze Cui, Muwei Ji, Huichao Liu, Jiali Yu, Caizhen Zhu and Jian Xu
Polymers 2023, 15(4), 962; https://doi.org/10.3390/polym15040962 - 15 Feb 2023
Cited by 8 | Viewed by 1640
Abstract
With the rapid development of high-frequency communication and large-scale integrated circuits, insulating dielectric materials require a low dielectric constant and dielectric loss. Poly (aryl ether ketone) resins (PAEK) have garnered considerable attention as an intriguing class of engineering thermoplastics possessing excellent chemical and [...] Read more.
With the rapid development of high-frequency communication and large-scale integrated circuits, insulating dielectric materials require a low dielectric constant and dielectric loss. Poly (aryl ether ketone) resins (PAEK) have garnered considerable attention as an intriguing class of engineering thermoplastics possessing excellent chemical and thermal properties. However, the high permittivity of PAEK becomes an obstacle to its application in the field of high-frequency communication and large-scale integrated circuits. Therefore, reducing the dielectric constant and dielectric loss of PAEK while maintaining its excellent performance is critical to expanding the PAEK applications mentioned above. This study synthesized a series of poly (aryl ether ketone) resins that are low dielectric, highly thermally resistant, and soluble, containing cyclohexyl and diphenyl fluorene. The effects of cyclohexyl contents on the properties of a PAEK resin were studied systematically. The results showed that weakly-polarized cyclohexyl could reduce the molecular polarization of PAEK, resulting in low permittivity and high transmittance. The permittivity of PAEK is 2.95–3.26@10GHz, and the transmittance is 65–85%. In addition, the resin has excellent solubility and can be dissolved in NMP, DMF, DMAc, and other solvents at room temperature. Furthermore, cyclohexyl provided PAEK with excellent thermal properties, including a glass transition temperature of 239–245 °C and a 5% thermogravimetric temperature, under a nitrogen atmosphere of 469–534 °C. This makes it a promising candidate for use in high-frequency communications and large-scale integrated circuits. Full article
(This article belongs to the Special Issue Functional Polymeric Materials for Electrical Insulation Application)
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18 pages, 4360 KiB  
Article
Study of a Mixed Conductive Layer Fabricated by Ion Implantation and Distribution Theory
by Xuerui Fan, Huiyan Zhang, Yi Wei, Yao Huang, Huimei He, Yun Wang, Qingyun Meng and Wenjie Wu
Polymers 2023, 15(2), 270; https://doi.org/10.3390/polym15020270 - 5 Jan 2023
Viewed by 1127
Abstract
Electrodes are essential parts of capacitors that can consist of a variety of materials depending on the application. In dielectric elastomer transducers (DETs)—a type of special variable capacitor—the electrode needs to deform with a soft base. However, the current carbon-based electrodes are not [...] Read more.
Electrodes are essential parts of capacitors that can consist of a variety of materials depending on the application. In dielectric elastomer transducers (DETs)—a type of special variable capacitor—the electrode needs to deform with a soft base. However, the current carbon-based electrodes are not stable, and the metal-based ones are not flexible for use in DETs. Thus, the need to fabricate an electrode which can meet both the stability and flexibility requirements is extremely important. In this work, silver ions with energy levels of 40 keV were implanted into the surface of polydimethylsiloxane (PDMS) to explore the effect of ion implantation on surface conductivity. The experimental results showed that the surface resistivity of PDMS reached 251.85 kΩ per square and dropped by 10 orders of magnitude after ion implantation. This indicates that the surface conductivity was significantly improved. EDS characterization results showed that the maximum penetration depth that ions could reach was about 2.5 μm. The surface resistivity of the sample coated with carbon black was further reduced by an order of magnitude after ion implantation and changed more stably with time. A quasi-melting-collision model was established to investigate the distribution of carbon black particles. The concentration of carbon black particles at a distance from the PDMS surface followed a Gaussian-like distribution. Full article
(This article belongs to the Special Issue Functional Polymeric Materials for Electrical Insulation Application)
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18 pages, 3262 KiB  
Article
Residual Life Prediction of XLPE Distribution Cables Based on Time-Temperature Superposition Principle by Non-Destructive BIS Measuring on Site
by Bingliang Shan, Chengqian Du, Junhua Cheng, Wei Wang and Chengrong Li
Polymers 2022, 14(24), 5478; https://doi.org/10.3390/polym14245478 - 14 Dec 2022
Cited by 2 | Viewed by 1767
Abstract
Crosslinked polyethylene (XLPE) distribution cables are prone to segmented thermal aging after long-term operation owing to the large spatial spans and complex operating environments, and accurate residual life prediction of each aging cable segment could provide a theoretical basis and reference for performance [...] Read more.
Crosslinked polyethylene (XLPE) distribution cables are prone to segmented thermal aging after long-term operation owing to the large spatial spans and complex operating environments, and accurate residual life prediction of each aging cable segment could provide a theoretical basis and reference for performance monitoring, maintenance and the replacement of cables. Existing studies mainly focus on the residual life prediction methods for uniform aging cables, which are not suitable for segmented-aging cables. In this paper, a residual life prediction method for segmented-aging XLPE distribution cables based on the time-temperature superposition principle (TTSP) by non-destructive BIS measuring on site was proposed. Firstly, the applicability of the TTSP in the transformation of the changing process of elongation at break (EAB) of XLPE at different thermal aging temperatures was verified based on the Arrhenius equation. Secondly, to better simulate the thermal aging process under working conditions, XLPE cables were subjected to accelerated external stress aging at 140 °C for different aging times, and the corresponding changing process of EAB along with aging time was further measured. The relationship between the EAB of XLPE cables and aging time was well fitted by an equation, which could be used as a reference curve to predict the thermal aging trends and residual life of service-aged XLPE cables. After that, a calculation method for the transformation of the changing process of EAB of XLPE at different thermal aging temperatures was proposed, in which the corresponding multiplicative shift factor could be obtained based on the TTSP instead of the Arrhenius equation extrapolation. Moreover, the availability of the above calculation method was further proved by accelerated thermal aging experiments at 154 °C; the results show that the prediction error for the cable’s EAB is no more than 3.15% and the prediction error for residual life is within 10% in this case. Finally, the realization of non-destructive residual life prediction combined with BIS measuring on site was explained briefly. Full article
(This article belongs to the Special Issue Functional Polymeric Materials for Electrical Insulation Application)
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13 pages, 3254 KiB  
Article
Preparation of a Crosslinked Poly(imide-siloxane) for Application to Transistor Insulation
by Hyeong-Joo Park, Ju-Young Choi, Seung-Won Jin, Seung-Hyun Lee, Yun-Je Choi, Dam-Bi Kim and Chan-Moon Chung
Polymers 2022, 14(24), 5392; https://doi.org/10.3390/polym14245392 - 9 Dec 2022
Viewed by 1468
Abstract
Insulated gate bipolar transistor (IGBT) is an important power device for the conversion, control, and transmission of semiconductor power, and is used in various industrial fields. The IGBT module currently uses silicone gel as an insulating layer. Since higher power density and more [...] Read more.
Insulated gate bipolar transistor (IGBT) is an important power device for the conversion, control, and transmission of semiconductor power, and is used in various industrial fields. The IGBT module currently uses silicone gel as an insulating layer. Since higher power density and more severe temperature applications have become the trend according to the development of electronic device industry, insulating materials with improved heat resistance and insulation performances should be developed. In this study, we intended to synthesize a new insulating material with enhanced thermal stability and reduced thermal conductivity. Poly(imide-siloxane) (PIS) was prepared and crosslinked through a hydrosilylation reaction to obtain a semi-solid Crosslinked PIS. Thermal decomposition temperature, thermal conductivity, optical transparency, dielectric constant, and rheological property of the Crosslinked PIS were investigated and compared to those of a commercial silicone gel. The Crosslinked PIS showed high thermal stability and low thermal conductivity, along with other desirable properties, and so could be useful as an IGBT-insulating material. Full article
(This article belongs to the Special Issue Functional Polymeric Materials for Electrical Insulation Application)
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