Modifications of Polymer Materials for Toughness, Thermal Conductivity
A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".
Deadline for manuscript submissions: 30 June 2026 | Viewed by 1179
Special Issue Editors
Interests: polymer blends; polymer nanocomposites; processing; structure–property relationship (mechanical properties; flame retardancy; thermal conductivity, etc.)
Special Issues, Collections and Topics in MDPI journals
Interests: polymer blends; polymer nanocomposites; processing; polymeric dielectric substance; thermal conductive polymer
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The poor thermal conductivity and flame retardancy of most polymers limit their application in high-power fields such as power and automotive industries. To significantly improve the thermal conductivity or flame retardancy of composites, a large number of functional fillers, such as thermal conductive fillers or flame-retardant fillers, are typically required. This promotes the construction of a functional filler network, which enhances the desired properties. However, this approach can sharply deteriorate the mechanical properties and processing fluidity of the composites while also increasing production costs. Both factors are not conducive to industrial production. Therefore, it remains a great challenge to manufacture composites with outstanding thermal conductivity and flame retardancy, as well as excellent mechanical properties, at low filler content.
In general, this Special Issue focuses on high-performance, thermally conductive, and flame-retardant polymer composites, including innovations in materials, microstructure, and mechanisms of toughening, thermal conductivity, and flame retardancy.
Submitted manuscripts must not have been published previously or be under consideration elsewhere. All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for manuscript submission are available on the journal’s website.
Dr. Dexiang Sun
Dr. Jinghui Yang
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- polymer
- polymer nanocomposites
- structure–property relationship
- mechanical properties
- thermal conductivity
- flame retardancy
- toughening mechanism
- thermal conductive mechanism
- flame retardancy mechanism
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