polymers-logo

Journal Browser

Journal Browser

Advances in Polymer Materials for Sensors and Flexible Electronics

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".

Deadline for manuscript submissions: 2 October 2026 | Viewed by 903

Special Issue Editors


E-Mail Website
Guest Editor
The National Institute for Laser, Plasma & Radiation Physics (INFLPR), Măgurele, Romania
Interests: bio-sensors; bio-nanotechnology; plasmonics and advanced polymers
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
The National Institute for Laser, Plasma & Radiation Physics (INFLPR), Măgurele, Romania
Interests: synthesis of thin films by different pulsed laser techniques; biomaterials; polymeric coatings; drug delivery applications; transparent and flexible electronic materials
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The growing demand for intelligent, lightweight, and mechanically compliant electronic systems has positioned advanced polymer materials at the forefront of research in sensors and flexible electronics. This Special Issue on “Advances in Polymer Materials for Sensors and Flexible Electronics” aims to highlight recent scientific and technological advances in polymer-based materials that enable high-performance, flexible, and stretchable sensing and electronic platforms. Owing to their structural versatility, processability, and intrinsic mechanical flexibility, polymers offer unique opportunities to overcome the limitations of conventional rigid materials and to realize next-generation devices that can seamlessly interface with complex surfaces and dynamic environments. Recent advances in conductive polymers, polymer composites, hydrogels, and elastomers have significantly improved device sensitivity, reliability, and durability. These materials enable sensors that can detect pressure, strain, temperature, chemical species, and biological signals, supporting applications such as wearable health monitoring, electronic skin, soft robotics, and smart textiles.

The editors of this Special Issue welcome contributions from academia and industry in the form of original research articles, communications, and comprehensive reviews that address fundamental material design, fabrication strategies, device architectures, and emerging applications. We anticipate that this collection will foster interdisciplinary collaboration and provide valuable insights into the future development of advanced polymer materials for sensors and flexible electronics.

We look forward to receiving your valuable contribution

Dr. Iulia Antohe
Dr. Gianina Popescu-Pelin
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced polymers
  • flexible electronics
  • polymer sensors
  • wearable technology
  • conductive polymers
  • stretchable devices
  • smart materials

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.

Further information on MDPI's Special Issue policies can be found here.

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

22 pages, 4667 KB  
Article
Self-Assembly of Curved Photonic Heterostructures by the Hanging Drop Method
by Ion Sandu, Claudiu Teodor Fleaca, Florian Dumitrache, Iuliana Urzica, Iulia Antohe and Marius Dumitru
Polymers 2026, 18(8), 924; https://doi.org/10.3390/polym18080924 - 9 Apr 2026
Viewed by 598
Abstract
By combining hanging-drop self-assembly with melt infiltration and selective inversion, we fabricate millimetric and free-standing curved photonic heterostructures that integrate infiltrated-opal, inverse-opal, embossed, and white-scattering 2.5D metasurface domains within a single continuous body. These architectures enable configurations inaccessible to planar fabrication, including naturally [...] Read more.
By combining hanging-drop self-assembly with melt infiltration and selective inversion, we fabricate millimetric and free-standing curved photonic heterostructures that integrate infiltrated-opal, inverse-opal, embossed, and white-scattering 2.5D metasurface domains within a single continuous body. These architectures enable configurations inaccessible to planar fabrication, including naturally formed concavities within convex inverse-opal films and alternating ordered/single-layer regions that preserve local coherence while introducing disorder at larger scales. Across these heterogeneous curved landscapes, we observe optical phenomena absent in flat photonic structures—spectrally selected lateral collimation, geometry-shifted ghost images, and transmission-derived valleys shaped by curvature-mediated Bragg extraction. Their origin lies in the geometric constraints inherent to curved assemblies, where spatially varying normals, non-parallel lattice orientations, and topologically required defects couple order and disorder into a distributed-coherence regime. This coupling expands the accessible photonic state space, establishing curvature as an active functional degree of freedom rather than a geometric constraint, positioning the self-assembled photonic heterostructures as a scalable route toward multifunctional 3D metasurfaces and new regimes of light–matter interaction. Full article
(This article belongs to the Special Issue Advances in Polymer Materials for Sensors and Flexible Electronics)
Show Figures

Graphical abstract

Back to TopTop