3D Printing of Polymer Composite Materials

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Processing and Engineering".

Deadline for manuscript submissions: 10 August 2024 | Viewed by 155

Special Issue Editors

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Guest Editor
Department of Mechanical and Manufacturing Engineering, Miami University, Oxford, OH, USA
Interests: 3D printing; additive manufacturing; polymer processing; biocompatible polymers; computational modeling

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Guest Editor
School of Engineering, Design and Built Environment, Western Sydney University, Penrith, NSW 2751, Australia
Interests: additive manufacturing; advanced manufacturing; multiscale modelling and simulations of advanced engineering materials and structures; engineering numerical methods and their applications; digital material representation
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Special Issue Information

Dear Colleagues,

Additive manufacturing technologies for polymeric materials are continuing to evolve at a very rapid rate and can be credited for new product functionality, improved performance, reduced cost, and higher levels of sustainability. It can also be said that new additive methods have democratized manufacturing and bolstered generative design processes by enabling the table-top manufacturing of specialized components by companies of any size. A collective examination of the state of the art can, therefore, be extremely beneficial in tracking advances in additive manufacturing across a myriad of industries.

This Special Issue will assemble studies focusing on experimental and computational research pertaining to the 3D printing of polymeric materials. Relevant topics include, but are not limited to, the following:

  • Material development including composites and 4D printing using shape memory polymers;
  • Process optimization in filament, liquid, and powder-based techniques;
  • The design of target properties;
  • Processing-property effects;
  • Creation of functionally graded materials;
  • Machine learning;
  • Novel post-processing methods.

Recognition your contributions to these fields, I would like to invite you to support this Special Issue by submitting a paper. This would serve the scientific and industrial communities by presenting up-to-date research in an area of vital scientific, industrial, and environmental importance.

I look forward to receiving your contributions.

Prof. Dr. Fazeel Khan
Prof. Dr. Richard (Chunhui) Yang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • 3D printing
  • additive manufacturing
  • polymer processing
  • biocompatible polymers
  • computational modeling
  • shape memory polymers

Published Papers

This special issue is now open for submission.
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