Emerging Trends in On-Chip Photonic Integration

Dear Colleagues,

This Special Issue aims to showcase the latest advancements and emerging trends in on-chip photonic integration, a rapidly evolving field at the intersection of photonics, nanotechnology, and integrated circuits. We invite researchers, engineers, and industry professionals to contribute original research articles, comprehensive reviews, and technical notes that highlight innovative approaches, novel materials, and groundbreaking applications in areas such as silicon photonics, quantum photonic integrated circuits, quantum optics, telecommunication, optical wireless communication, neuromorphic photonic computing, and integrated optical sensors. The scope encompasses novel PIC architectures, advanced materials, heterogeneous integration with electronics, on-chip optical interconnects, and emerging applications in 5G/6G, LiDAR, and quantum technologies. We particularly encourage submissions addressing challenges in scalability, energy efficiency, and manufacturability of photonic integrated devices. This Special Issue seeks to provide an overview of the current state of the art and future directions in on-chip photonic integration, fostering collaboration and knowledge exchange within the community.

We are pleased to invite you to contribute to this Special Issue of Photonics focused on “Emerging Trends in On-Chip Photonic Integration”. The integration of on-chip photonic components has revolutionized various fields, including telecommunications, computing, quantum sensing, and bio-sensing. As we progress towards more compact, efficient, and multifunctional photonic systems, the importance of on-chip integration continues to grow. Recent advancements in materials, fabrication techniques, and novel device architectures have opened up new possibilities for integrated photonics and their applications, making this an exciting and rapidly evolving area of research.

This Special Issue aims to showcase cutting-edge research and developments in on-chip photonic integration. We seek to highlight innovative approaches, emerging materials, novel device concepts, and advanced fabrication techniques that are pushing the boundaries of integrated photonics and various applications. By bringing together diverse perspectives and breakthrough technologies, we hope to provide a comprehensive overview of the current state and future directions of this field. This aligns with the journal’s scope of covering all aspects of optics and photonics, with a particular emphasis on emerging technologies and applications.

In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following:

1. Novel materials for on-chip photonics (e.g., 2D materials, chalcogenides);
2. Advanced fabrication techniques for photonic integrated circuits;
3. Heterogeneous integration of photonic and electronic components;
4. Co-package of photonic and electronic components;
5. On-chip quantum photonic devices and circuits;
6. Nonlinear optical effects in integrated photonics;
7. Neuromorphic photonic computing;
8. Silicon photonics for data communications;
9. On-chip biosensors and lab-on-a-chip devices;
10. Integration of passive components (couplers, multiplexers, polarization controllers);
11. Integration of active components (lasers, modulators, detectors);
12. Emerging applications of integrated photonics on telecom, computing, and others.

I look forward to receiving your contributions.

Dr. Zixian Wei
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• photonic integrated circuits
• integrated photonics
• silicon photonics
• heterogeneous integration
• passive components
• active components
• co-package
• optical communication
• neuromorphic computingphotonic integrated circuits
• integrated photonics
• silicon photonics
• heterogeneous integration
• passive components
• active components
• co-package
• optical communication
• neuromorphic computing