Application of Advanced Nanomaterials and Nanofabrication for Electronic Devices

Dear Colleagues,

Electronic devices are fundamental building blocks of modern information technology, enabling computation, communication, sensing, data storage, and intelligent systems. From field-effect transistors, memristors, photodetectors, and sensors to emerging neuromorphic and flexible electronic devices, continuous innovation in electronic device technology is driving the rapid development of integrated circuits, artificial intelligence, the Internet of Things (IoT), wearable electronics, and next-generation computing architectures. As the demand for higher performance, lower power consumption, greater integration density, and enhanced multi-functionality continues to grow, conventional materials and fabrication technologies are approaching their fundamental physical and technological limits.

Advanced nanomaterials have emerged as key enablers for the next generation of electronic devices. Two-dimensional (2D) materials, including graphene, transition-metal dichalcogenides (such as MoS₂ and WS₂), hexagonal boron nitride (hBN), MXenes, black phosphorus, and other layered materials, exhibit exceptional electrical, optical, thermal, and mechanical properties that offer unprecedented opportunities for high-performance electronics. In addition, a wide range of functional nanomaterials—including semiconductor nanowires, quantum dots, carbon nanotubes, perovskites, metal nanoparticles, dielectric nanomaterials, and hybrid nanocomposites—are expanding the design space for novel electronic and optoelectronic devices.

Equally important are advances in nanofabrication and assembly technologies that enable the precise synthesis, integration, and large-scale manufacturing of nanoscale devices. Recent progress in lithography, atomic layer deposition, chemical vapor deposition, self-assembly, transfer printing, additive manufacturing, nanoimprinting, and heterogeneous integration has significantly improved the controllability, scalability, and reproducibility of device fabrication. These techniques facilitate the integration of diverse nanomaterials into complex device architectures while addressing challenges in interface engineering, reliability, and wafer-scale production.

This Special Issue aims to provide a comprehensive forum for recent progress in advanced nanomaterials, nanofabrication technologies, and their applications in electronic devices. We welcome original research articles and comprehensive review papers that present innovative concepts, fundamental investigations, novel fabrication strategies, and practical applications. Topics of interest include, but are not limited to:

• Advanced nanomaterials for electronic and optoelectronic devices;
• Two-dimensional materials, including graphene, transition-metal dichalcogenides, hBN, MXenes, and related heterostructures;
• Semiconductor nanowires, quantum dots, carbon nanotubes, and emerging functional nanomaterials;
• Nanofabrication, nanopatterning, and nanoscale assembly technologies;
• Flexible, stretchable, wearable, and biointegrated electronics;
• Field-effect transistors, memristors, resistive switching devices, and neuromorphic devices;
• Photodetectors, sensors, biosensors, and multifunctional electronic systems;
• Energy-efficient electronic devices and integrated microsystems;
• Interface engineering, device reliability, and heterogeneous integration;
• AI-assisted materials discovery, device design, and intelligent manufacturing for nanoelectronics.

By bringing together interdisciplinary contributions from materials science, nanotechnology, electronics, physics, chemistry, and engineering, this Special Issue seeks to highlight the recent scientific breakthroughs and technological innovations that will shape the future of electronic devices. We hope this collection will provide valuable insights into the development of advanced nanomaterials and scalable nanofabrication techniques while fostering collaborations between academia and industry to accelerate the translation of laboratory discoveries into practical electronic technologies.

Dr. Huan Hu
Dr. Guanyu Liu
Guest Editors

Manuscript Submission Information

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• nanomaterials
• 2D materials
• electronic devices
• optoelectronic devices
• nanofabrication
• sensors and biosensors
• neuromorphic computing
• 2D material heterostructures
• interface engineering
• memristors
• transistors
• sensors