Advances in Two-Dimensional Semiconductor Electronic Devices
A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Nanoelectronics, Nanosensors and Devices".
Deadline for manuscript submissions: 15 December 2026 | Viewed by 131
Special Issue Editors
Interests: damage-free transfer technology; two-dimensional circuit design, simulation, and system Integration
Special Issue Information
Dear Colleagues,
Two-dimensional (2D) semiconductor materials, represented by transition metal dichalcogenides (TMDs), have emerged as a transformative platform for next-generation electronics. Their atomically thin single-crystalline lattice, dangling-bond-free surface, excellent electrostatic control, and compatibility with heterogeneous integration make them highly attractive for overcoming the scaling and performance limitations of conventional semiconductor technologies. Over the past decade, substantial progress has been achieved in material synthesis, damage-free transfer, interface engineering, device fabrication, compact modeling, and system-level integration, enabling a broad range of applications, including optoelectronic devices, logic circuits, memory, sensors, flexible electronics, display backplanes, and in-memory computing.
This Special Issue of Nanomaterials, entitled ‘Advances in Two-Dimensional Semiconductor Electronic Devices’, aims to provide a comprehensive forum for researchers to present the latest breakthroughs in the science and technology of 2D semiconductor electronics. The Special Issue will highlight both fundamental studies and practical developments, with a particular emphasis on device physics, performance optimization, reliability, and circuit applications.
We invite the submission of original research articles, communications, and review papers covering, but not limited to, the following topics:
- Growth, transfer, and integration processes;
- Interface engineering, dielectric and metal contact, surface passivation, strains and defects;
- Logic circuits, integrated circuits, and low-power computing systems;
- Optoelectronic devices, light-emitting devices, image sensors;
- Non-volatile memory, floating-gate memory, ferroelectric memory, phase-change memory, synaptic devices;
- 2D spice model, compact model, functional 2D circuit design and simulation;
- Monolithic 3D integration, via and interconnect, and 2D/3D heterogeneous integration;
- Flexible, transparent, and wearable electronics.
Dr. Liwei Liu
Dr. Jingli Wang
Guest Editors
Manuscript Submission Information
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- prototype devices fabrication
- interface engineering
- physical mechanism
- optoelectronic properties
- functional circuits
- monolithic 3D integration
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