Multiscale Insights into Dielectric Materials: From Molecular Design to Electrical Performance
A special issue of Molecules (ISSN 1420-3049). This special issue belongs to the section "Materials Chemistry".
Deadline for manuscript submissions: 1 August 2026 | Viewed by 88
Special Issue Editors
Interests: insulating materials; semi-conductive shielding materials; power cables; transformer resin materials; conductive polymers; dielectric breakdown and electrical testing; experimental evaluation of dielectric materials; structure–property characterization; thermo-electrical aging and reliability testing; high-voltage insulation performance measurement
Interests: electrical insulation; epoxy resin; aramid fiber reinforced polymer; dielectric property; electrical tree; dielectric breakdown and electrical testing; experimental evaluation of dielectric materials; structure–property characterization; thermo-electrical aging and reliability testing; high-voltage insulation performance measurement
Interests: insulation; liquids insulation; breakdown voltage; molecular dynamic simulation; DFT; transformer; dielectric breakdown and electrical testing; experimental evaluation of dielectric materials; structure–property characterization; thermo-electrical aging and reliability testing; high-voltage insulation performance measurement
Special Issue Information
Dear Colleagues,
The development of advanced dielectric materials has become increasingly critical for modern electronic and energy storage applications, ranging from high-performance capacitors and insulation systems to emerging flexible electronics and energy harvesting devices. Understanding the intricate relationship between molecular structure, microstructural organization, and macroscopic electrical properties remains a fundamental challenge in materials science and engineering. This Special Issue aims to bridge the gap between molecular-level design principles and device-level electrical performance by exploring multiscale approaches to dielectric materials research. We seek contributions that advance our understanding of structure–property relationships across different length scales, from quantum mechanical effects at the molecular level to mesoscale phenomena and bulk material behavior.
Topics of interest include, but are not limited to, the following:
- Molecular engineering strategies for tailoring dielectric properties;
- Computational modeling and simulation of dielectric behavior across multiple scales;
- Novel synthesis methods for high-performance dielectric polymers and composites;
- Advanced characterization techniques for multiscale property evaluation;
- Structure–property correlations in organic, inorganic, and hybrid dielectric systems;
- Processing–structure–property relationships in dielectric materials;
- Machine learning and data-driven approaches for dielectric material design;
- Applications in energy storage, power electronics, and flexible devices.
We welcome the submission of original research articles, comprehensive reviews, and perspective pieces that provide new insights into the fundamental science and technological applications of dielectric materials. Contributions should demonstrate clear connections between molecular design principles and resulting electrical performance, offering practical guidance for materials’ development and optimization.
Dr. Shangshi Huang
Dr. Xiaoxiao Kong
Dr. Wenyu Ye
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Molecules is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- dielectric materials
- molecular design
- multiscale modeling
- structure–property relationships
- electrical performance
- polymer dielectrics
- energy storage
- computational materials science
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