Multiscale Insights into Dielectric Materials: From Molecular Design to Electrical Performance

Dear Colleagues,

The development of advanced dielectric materials has become increasingly critical for modern electronic and energy storage applications, ranging from high-performance capacitors and insulation systems to emerging flexible electronics and energy harvesting devices. Understanding the intricate relationship between molecular structure, microstructural organization, and macroscopic electrical properties remains a fundamental challenge in materials science and engineering. This Special Issue aims to bridge the gap between molecular-level design principles and device-level electrical performance by exploring multiscale approaches to dielectric materials research. We seek contributions that advance our understanding of structure–property relationships across different length scales, from quantum mechanical effects at the molecular level to mesoscale phenomena and bulk material behavior.

Topics of interest include, but are not limited to, the following:

• Molecular engineering strategies for tailoring dielectric properties;
• Computational modeling and simulation of dielectric behavior across multiple scales;
• Novel synthesis methods for high-performance dielectric polymers and composites;
• Advanced characterization techniques for multiscale property evaluation;
• Structure–property correlations in organic, inorganic, and hybrid dielectric systems;
• Processing–structure–property relationships in dielectric materials;
• Machine learning and data-driven approaches for dielectric material design;
• Applications in energy storage, power electronics, and flexible devices.

We welcome the submission of original research articles, comprehensive reviews, and perspective pieces that provide new insights into the fundamental science and technological applications of dielectric materials. Contributions should demonstrate clear connections between molecular design principles and resulting electrical performance, offering practical guidance for materials’ development and optimization.

Dr. Shangshi Huang
Dr. Xiaoxiao Kong
Dr. Wenyu Ye
Guest Editors

Manuscript Submission Information

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