Micro/Nano Engineering Technology and Nano-Photonic Device
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".
Deadline for manuscript submissions: closed (31 July 2023) | Viewed by 286
Special Issue Editor
Special Issue Information
Dear Colleagues,
Micro/nanoengineering technology is an interdisciplinary fusion of different fields and can be used in many subject areas, such as top-down and bottom-up fabrication technologies, packaging, characterization, and device design technologies. As the prerequisite and foundation of nanoscience, micro/nanoengineering technology has maintained continuous interest over the past sixty years. Its rapid evolution enables the fine control of features during manufacturing, sizing them down to the nanoscale and even to a single atom, while the geometrical morphology can range from two dimensions to three dimensions. Additionally, a tremendous amount of new technologies keep being developed, such as extreme ultraviolet lithography, electron-beam lithography, focused ion beam writing, DNA origami, additive manufacturing (3D printing technology), and chemical vapor deposition technology. These powerful technologies enable the realization of various novel devices, such as the metalens, compact full-Stokes parameter imaging devices, microspectrometer, soliton microcombs, and so on. However, the realization and characterization of structures or devices with small feature sizes, complex geometries, or desired functions is still a challenge. This research topic will focus on state-of-the-art micro/nanoengineering technology and nanophotonic devices, as well as bring together their latest achievements, creating a platform for researchers to exchange their ideas.
For the present research topic, original research, reviews, brief reports, and opinion articles are welcome. Topics covered can include, but are not limited to:
(1) Novel processes in micro/nanofabrication and packing and characterization methods, including lithography, wet and dry etching, chemical synthesis, molecular assembly, 3D printing, microimaging, spectra, packaging technology and reliability, etc.
(2) The fabrication and integration of novel functional structures, devices, and systems, such as metasurfaces, metamaterials, plasmonics, 2D materials, MEMS/NEMS, thermoforming, injection molding, and soft embossing devices, etc.
(3) Engineering novel nanophotonic devices for physical, chemical, and biological applications by involving metalenses, sensors, polarization imaging devices, nanolasers, data storage, displays, catalysis, etc.
Dr. Yidong Hou
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- fabrication technology
- packing technology
- characterization methods
- plasmonics
- metamaterials
- metasurfaces
- sensors
- nanophotonic devices
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