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The Properties of Thin Films Synthesized by Deposition Techniques
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The Properties of Thin Films Synthesized by Deposition Techniques

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".

Deadline for manuscript submissions: closed (20 March 2023) | Viewed by 1753

Special Issue Editor

Dr. Heng Mao

E-Mail Website
Guest Editor
School of Chemistry and Chemical Engineering, Beijing Institute of Technology, Beijing 102488, China
Interests: membrane separation; nanomposite materials; carbon capture; biomass energy
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Thin films are of great interest to scientists and engineers owing to their great potential for a diverse range of properties that have been previously unattainable, such as giant conductivity, giant magnetoresistance effect, giant Hall effect, visible light emission, etc. Deposition techniques and other related strategies possess many remarkable advantages over the traditional methods, including their mild temperature and pressure, low cost, small footprint, compact configuration, and environmental friendliness. In addition, thin film thickness can be finely tuned from several nanometers to thousands of micrometers using deposition techniques, and the entire deposition process is easy to scale up for industrial production.

This Special Issue aims to publish the latest advances in the field, including the processing principles, structure manipulation, and property optimization of thin films synthesized by deposition techniques.

It is my pleasure to invite you to submit a manuscript for this Special Issue. Full papers, communications, and reviews are all welcome.

Prof. Dr. Heng Mao
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thin film
  • deposition technique
  • synthesis method
  • vapor phase deposition
  • liquid phase deposition
  • electrochemical deposition
  • pulsed laser deposition
  • material processing
  • electro-optical devices
  • catalysis and separation

Published Papers (1 paper)

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Research

15 pages, 4700 KiB  
Article
Solid-State Reaction in Cu/a-Si Nanolayers: A Comparative Study of STA and Electron Diffraction Data
by Evgeny T. Moiseenko, Vladimir V. Yumashev, Roman R. Altunin, Galina M. Zeer, Nataliya S. Nikolaeva, Oleg V. Belousov and Sergey M. Zharkov
Materials 2022, 15(23), 8457; https://doi.org/10.3390/ma15238457 - 27 Nov 2022
Cited by 6 | Viewed by 1467
Abstract
The kinetics of the solid-state reaction between nanolayers of polycrystalline copper and amorphous silicon (a-Si) has been studied in a Cu/a-Si thin-film system by the methods of electron diffraction and simultaneous thermal analysis (STA), including the methods of differential scanning calorimetry (DSC) and [...] Read more.
The kinetics of the solid-state reaction between nanolayers of polycrystalline copper and amorphous silicon (a-Si) has been studied in a Cu/a-Si thin-film system by the methods of electron diffraction and simultaneous thermal analysis (STA), including the methods of differential scanning calorimetry (DSC) and thermogravimetry (TG). It has been established that, in the solid-state reaction, two phases are formed in a sequence: Cu + Si → η″-Cu3Si → γ-Cu5Si. It has been shown that the estimated values of the kinetic parameters of the formation processes for the phases η″-Cu3Si and γ-Cu5Si, obtained using electron diffraction, are in good agreement with those obtained by DSC. The formation enthalpy of the phases η″-Cu3Si and γ-Cu5Si has been estimated to be: ΔHη″-Cu3Si = −12.4 ± 0.2 kJ/mol; ΔHγ-Cu5Si = −8.4 ± 0.4 kJ/mol. As a result of the model description of the thermo-analytical data, it has been found that the process of solid-state transformations in the Cu/a-Si thin-film system under study is best described by a four-stage kinetic model R3 → R3 → (Cn-X) → (Cn-X). The kinetic parameters of formation of the η″-Cu3Si phase are the following: Ea = 199.9 kJ/mol, log(A, s−1) = 20.5, n = 1.7; and for the γ-Cu5Si phase: Ea = 149.7 kJ/mol, log(A, s−1) = 10.4, n = 1.3, with the kinetic parameters of formation of the γ-Cu5Si phase being determined for the first time. Full article
(This article belongs to the Special Issue The Properties of Thin Films Synthesized by Deposition Techniques)
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