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Solid State Physics in Advanced Power Semiconductors and Other Devices

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: closed (31 December 2020) | Viewed by 2835

Special Issue Editor


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Guest Editor
Department of Electrical Engineering, Myongji University, Yongin, Gyeonggi 17058, Republic of Korea
Interests: semiconductor-based energy devices; compound materials for power devices
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Power semiconductors can handle the power flow and convert its form in the system. An ideal power device has zero resistance in the on-state and infinite resistance in the off-state. However, real power devices consume power in the on and off states. To save energy on the Earth, we need to reduce the power loss of the power semiconductors. Automotive applications also demand high-energy conversion efficiency of the power semiconductors. The reliability should be improved even at high temperatures.

Silicon-based power devices have been enhanced by reducing cell density and power loss. Silicon superjunction MOSFETs and field-stop IGBTs have been developed, but the material limits have been an obstacle. Wide band gap materials such as III-V, 4H-SiC, and diamond have begun to be investigated with power switches. These can improve the on-resistance at identical breakdown voltage by decreasing the thickness of the drift layer with low doping concentration. However, solid-state physics and fabrication of wide band gap materials need to be studied further. In addition, the electrical characteristics and formation method of the gate oxide in the MOS-controlled devices are important.

This Special Issue is a timely approach to survey recent progress in the area of advanced power semiconductors and other devices. The articles presented in this Special Issue will cover various topics from silicon to wide band gap materials, device design, numerical simulation, fabrication process, measurement, analysis, electrical characteristics at high temperature, and reliability. The scope is not just about the wide band gap devices. This also includes the silicon-based advanced power semiconductors, energy devices, solar cells, and nanoelectronics.

The Special Issue will cover (but not be limited to) the following topics:

  • Advanced power semiconductors
  • Solid state physics
  • Numerical simulation
  • Fabrication
  • High voltage switch
  • High current switch
  • Wide band gap devices including III-V, 4H-SiC, and diamond
  • Energy devices
  • Solar cells
  • Nanoelectronics, etc.

It is our pleasure to invite you to submit review articles, original papers and communications for this Special Issue “Solid State Physics in Advanced Power Semiconductors and Other Devices”.

Prof. Dr. Min-Woo Ha
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced power semiconductors
  • solid state physics
  • numerical simulation
  • fabrication
  • high voltage
  • high current
  • wide band gap devices
  • energy devices
  • solar cells
  • nanoelectronics

Published Papers (1 paper)

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Research

9 pages, 2797 KiB  
Article
Theoretical and Experimental Study of 13.4 kV/55 A SiC PiN Diodes with an Improved Trade-Off between Blocking Voltage and Differential On-Resistance
by Yuewei Liu, Ruixia Yang, Yongwei Wang, Zhiguo Zhang and Xiaochuan Deng
Materials 2019, 12(24), 4186; https://doi.org/10.3390/ma12244186 - 12 Dec 2019
Viewed by 2531
Abstract
In this paper, a 13.4 kV/55 A 4H-silicon carbide (SiC) PiN diode with a better trade-off between blocking voltage, differential on-resistance, and technological process complexity has been successfully developed. A multiple zone gradient modulation field limiting ring (MGM-FLR) for extremely high-power handling applications [...] Read more.
In this paper, a 13.4 kV/55 A 4H-silicon carbide (SiC) PiN diode with a better trade-off between blocking voltage, differential on-resistance, and technological process complexity has been successfully developed. A multiple zone gradient modulation field limiting ring (MGM-FLR) for extremely high-power handling applications was applied and investigated. The reverse blocking voltage of 13.4 kV, close to 95% of the theoretical value of parallel plane breakdown voltage, was obtained at a leakage current of 10 μA for a 100 μm thick, lightly doped, 5 × 1014 cm−3 n-type SiC epitaxial layer. Meanwhile, a fairly low differential on-resistance of 2.5 mΩ·cm2 at 55 A forward current (4.1 mΩ·cm2 at a current density of 100 A/cm2) was calculated for the fabricated SiC PiN with 0.1 cm2 active area. The highest Baliga’s figure-of-merit (BFOM) of 72 GW/cm2 was obtained for the fabricated SiC PiN diode. Additionally, the dependence of the breakdown voltage on transition region width, number of rings in each zone, as well as the junction-to-ring spacing of SiC PiN diodes is also discussed. Our findings indicate that this proposed device structure is one potential candidate for an ultra-high voltage power system, and it represents an option to maximize power density and reduce system complexity. Full article
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