Advances in Atomic Layer Deposition Process, Applications and Modeling
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".
Deadline for manuscript submissions: 20 April 2026 | Viewed by 312
Special Issue Editor
Special Issue Information
Dear Colleagues,
Atomic Layer Deposition (ALD), with its precise control over the deposition of thin, conformal films at the atomic scale, is widely used for surface and interface modification, as well as for enhancing oxidation resistance in metals and functional materials. This Special Issue will explore the diverse applications of ALD, particularly in the enhancement in lithium (Li) and sodium (Na)-ion batteries, as well as solid-state batteries. Additionally, it will investigate various ALD film deposition processes and their influence on material properties and performance. Furthermore, the Special Issue will examine the failure mechanisms of materials before and after ALD modification, in conjunction with electron microscopy characterization. Advanced modeling approaches will also be discussed, offering a holistic understanding of how ALD can be optimized for next-generation energy storage technologies. This Special Issue is designed to provide a comprehensive overview of the latest advancements in ALD, focusing on its potential to revolutionize various fields.
Dr. Xiaopeng Cheng
Guest Editor
Manuscript Submission Information
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Keywords
- atomic layer deposition
- functional materials
- metals
- next-generation batteries
- electron microscopy characterization
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