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Electrodeposition as a Convenient Route for the Production of Advanced Materials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: closed (20 October 2023) | Viewed by 470

Special Issue Editor

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Guest Editor
School of Chemical Engineering, National Technical University of Athens, 15780 Athens, Greece
Interests: electroplating; pulse electrolysis; metal matrix composites; electroless plating; vapor phase deposition techniques; nanomaterials; microstructure; mechanical properties; surface corrosion; semiconductive materials; thin films; hybrid semiconductors; multilayered semiconductive systems; photosensivity; photovoltaic cells; sensors

Special Issue Information

Dear Colleagues,

The importance of electrodeposition techniques in the development of materials with advanced properties has been widely acknowledged in recent decades. This must be attributed mainly to the fact that, in comparison with other techniques, electrodeposition can provide a simple, flexible, convenient, affordable, and not highly energy-demanding production route. Moreover, electrodeposition offers the ability of process optimization via the control of the several electrolytic deposition parameters.

This Special Issue will provide readers with up-to-date information on the recent progress in the electrodeposition field for the production of different advanced materials, such as metal or alloy coatings, metal or alloy matrix composite coatings, and their nanocrystalline counterparts, several nanoparticles, metal oxide and semiconductive thin films, etc. According to the type of the electrodeposited material, the final product can exhibit improved mechanical, physicochemical, semiconductive, electrocatalytic, photocatalytic, antimicrobial, magnetic, hydrophobic or hydrophilic properties, among others.

Contributing papers are solicited in the following areas:

  • Investigation of the microstructural and morphological characteristics of the electrodeposited materials as a function of electrodeposition process parameters;
  • Correlation of the investigated properties to the microstructural and morphological characteristics of electrodeposited materials;
  • Optimization of the electrodeposition process in relation to the investigated properties of the produced materials.

Prof. Dr. Constantina Kollia
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • electrodeposited materials
  • electrodeposition parameters
  • microstructural characteristics
  • advanced properties
  • process optimization

Published Papers

There is no accepted submissions to this special issue at this moment.
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