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Additive Manufacturing of Ceramic Components on the Leap to Industrial Use

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced and Functional Ceramics and Glasses".

Deadline for manuscript submissions: 20 December 2025 | Viewed by 499

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Guest Editor
Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Dresden, Germany
Interests: additive manufacturing and shaping technologies for ceramics; hybrid manufacturing
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Special Issue Information

Dear Colleagues,

Ceramic additive manufacturing (AM) is something different to the AM of polymers or metals because the printed components are still in a green, unfinished state and need a subsequent sintering step to attain their final material properties, as known from conventional powder-technological shaping methods for ceramics. In the recent past, a wide variety of direct and indirect processes with dot-wise, line-wise or layer-wise deposition of the material have been developed for the AM of ceramics, including hard metals, cermets and sintered glasses. Some of these processes have already reached a productive level and are in industrial use. Granules, suspensions, filaments or feedstocks are often used as semi-finished products for the additive building processes, which are subject to special requirements in terms of processability and reproducibility. The current main objectives of development are to achieve the component properties of additively manufactured components at a level comparable to conventional shaping methods and to increase reliability and repeatability. Non-destructive in-line testing methods and surface finishing steps will be indispensable for achieving these goals in the future.

Contributions that address current developments in the additive manufacturing of ceramics along the whole processing chain, focusing on component design, AM building processes, debinding, consolidation/sintering, post-treatment, and characterization, are welcome.

Dr. Tassilo Moritz
Guest Editor

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Keywords

  • additive manufacturing
  • ceramics
  • glass
  • cermets
  • hard metals
  • hybrid processing
  • multi-material
  • rapid prototyping
  • in-line inspection
  • thermal treatment
  • post-processing
  • numerical simulation

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Published Papers (1 paper)

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Research

14 pages, 3150 KiB  
Article
Research on the Influence Mechanism of Thermal Load on the Au-Sn Sealing Weld State on Three-Dimensional DPC Substrates
by Heran Zhao, Lihua Cao, ShiZhao Wang, He Zhang and Mingxiang Chen
Materials 2025, 18(15), 3678; https://doi.org/10.3390/ma18153678 - 5 Aug 2025
Viewed by 253
Abstract
Direct copper-plated ceramic (DPC) substrates have emerged as a favored solution for power device packaging due to their unique technical advantages. AuSn, characterized by its high hermeticity and environmental adaptability, represents the optimal sealing technology for DPC substrates. Through the application of vacuum [...] Read more.
Direct copper-plated ceramic (DPC) substrates have emerged as a favored solution for power device packaging due to their unique technical advantages. AuSn, characterized by its high hermeticity and environmental adaptability, represents the optimal sealing technology for DPC substrates. Through the application of vacuum sintering techniques and adjustment of peak temperatures (325 °C, 340 °C, and 355 °C), the morphology and composition of interfacial compounds were systematically investigated, along with an analysis of their formation mechanisms. A gradient aging experiment was designed (125 °C/150 °C/175 °C × oxygen/argon dual atmosphere × 600 h) to elucidate the synergistic effects of environmental temperature and atmosphere on the growth of intermetallic compounds (IMCs). The results indicate that the primary reaction in the sealing weld seam involves Ni interacting with Au-Sn to form (Ni, Au)3Sn2 and Au5Sn. However, upon completion of the sealing process, this reaction remains incomplete, leading to a coexistence state of (Ni, Au)3Sn2, Au5Sn, and AuSn. Additionally, Ni diffuses into the weld seam center via dendritic fracture and locally forms secondary phases such as δ(Ni) and ζ’(Ni). These findings suggest that the weld seam interface exhibits a complex, irregular, and asymmetric microstructure comprising multiple coexisting compounds. It was determined that Tpeak = 325 °C to 340 °C represents the ideal welding temperature range, where the weld seam morphology, width, and Ni diffusion degree achieve optimal states, ensuring excellent device hermeticity. Aging studies further demonstrate that IMC growth remains within controllable limits. These findings address critical gaps in the understanding of the microstructural evolution and interface characteristics of asymmetric welded joints formed by multi-material systems. Full article
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