Advancing Semiconductor Technologies: From Materials to Systems
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: 20 September 2026
Special Issue Editor
Interests: semiconductor films and optoelectronic devices; electrochemical energy storage and integrated system; nanoscale materials and smart coatings
Special Issue Information
Dear Colleagues,
The relentless demand for greater computational power, energy efficiency, and novel functionality across all sectors of the global economy is fundamentally driven by progress in semiconductor technologies. This Special Issue aims to capture the forefront of innovation across the entire semiconductor ecosystem, bridging the gap from foundational materials science to complex integrated systems. We seek to provide a comprehensive platform for research that addresses the critical challenges and opportunities in sustaining and surpassing the pace of advancement set by Moore's Law and beyond.
This Special Issue will encompass a broad, interdisciplinary scope, welcoming contributions that explore novel semiconductor materials (e.g., wide-bandgap semiconductors, 2D materials, amorphous semiconductors, and organic semiconductors), transformative device architectures (including advanced CMOS nodes, sensors and detectors, optoelectronic, neuromorphic, and quantum devices), and pioneering fabrication and integration processes (such as heterogeneous integration, advanced packaging, and 3D stacking). Furthermore, we encourage submissions focusing on the co-design of devices, circuits, and systems—particularly for applications in artificial intelligence, edge computing, photonics, sensors, and power electronics. The goal is to highlight work that not only pushes the boundaries of performance, scalability, and reliability but also considers sustainability, security, and new computational paradigms.
We invite original research articles, reviews, and perspectives that present significant advancements, critical insights, and forward-looking roadmaps. By uniting diverse perspectives, this Special Issue aspires to chart a course for the next generation of semiconductor technologies that will underpin future societal and technological progress.
Dr. Jianguo Lu
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- semiconductors
- chip
- package
- system
- artificial intelligence
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