materials-logo

Journal Browser

Journal Browser

Recent Advances in Thermoelectric Materials and Devices/Modules

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: 31 December 2024 | Viewed by 571

Special Issue Editors

Department of Materials Science and Engineering, Pennsylvania State University, University Park, PA 16802, USA
Interests: thermoelectric sustainable power generation and thermal management; sustainable materials and devices of energy conversion and storage for decarbonization; high-entropy structural and functional materials for extreme environments; ceramic/alloy synthesis and processing
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Department of Materials Science and Engineering, Hanbat National University, 125 Dongseodaero, Yuseong-gu, Daejeon 305-719, Republic of Korea
Interests: thermoelectric single crystal and polycrystalline bulk materials; thermoelectric modules; first principles and molecular dynamic simulations of thermal properties; combining experiment and theory to design new energy-related materials, such as Li-ion batteries, thermoelectric materials, and photovoltaic cells; transport properties of materials, such as pure metals and III-V semiconductors
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Light Technology Institute, Karlsruhe Institute of Technology, Karlsruhe, Germany
Interests: three-dimensional printing micro thermoelectric devices; exploring environmentally friendly and economical thermoelectric materials and devices; novel materials and concepts for wearable and stretchable electronics

Special Issue Information

Dear Colleagues,

Recent advances in thermoelectric materials and devices/modules have shown promising developments in the field of energy conversion, waste heat recovery, and thermal management. These advancements hold great promise for the development of sustainable and energy-efficient technologies, ultimately contributing to a reduction in greenhouse gas emissions and the establishment of cleaner energy for the future.

To date, significant advancements in thermoelectric materials, including both conventional bulk alloys and thin film-based alloys, have been achieved. However, decoupling electrical and thermal transport properties is still challenging, which further limits breakthroughs in material performance. The development of new characterization methods, a novel synthesis approach, and new phenomena in thermoelectric technology can help the community understand their underlying mechanisms and lead to the next generation of thermoelectric materials. The utilization of cutting-edge approaches, such as data-driven computational science and additive manufacturing, can potentially accelerate this process.

On the other hand, tremendous efforts to bridge the gap between thermoelectric materials and devices, including both conventional rigid devices and flexible and wearable devices, are also needed to drive the evolution of thermoelectric device designs and manufacturing. Along with the dedication to a system integration design, it will ultimately accelerate the development of thermoelectric technology toward practical applications.

Topics of interest include, but are not limited to, the following:

  • Advancements in novel material synthesis techniques;
  • New characterization methods;
  • The computational and data-driven science of thermoelectric technology;
  • Novel device architecture design;
  • The additive manufacturing of thermoelectric materials and devices;
  • Interface engineering in thermoelectric materials and devices;
  • System design and integration of thermoelectric technology;
  • Wearable and stretchable thermoelectric electronics;
  • New phenomenon in thermoelectric technology;
  • Novel polymer and hybrid thermoelectric materials;
  • Ceramic and composite thermoelectric technology;
  • The mechanical and thermal stability of thermoelectric materials and devices.

We invite you to submit original research articles and reviews related to this subject.

Dr. Wenjie Li
Dr. Min-Wook Oh
Dr. Qihao Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thermoelectric materials
  • thermoelectric devices
  • energy harvesting
  • thermoelectric efficiency
  • thermoelectric generators
  • waste heat recovery
  • thermoelectric cooling

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

13 pages, 6873 KiB  
Article
A Waterproof Flexible Paper-Based Thermoelectric Generator for Humidity and Underwater Environments
by Yiduo Huang, Wenfeng Wang, Sijia Chang, Aida Bao, Yuan Liu, Ruirui Li and Jijun Xiong
Materials 2024, 17(10), 2338; https://doi.org/10.3390/ma17102338 - 14 May 2024
Viewed by 354
Abstract
A thermoelectric generator (TEG) is one of the important energy harvesting sources for wearable electronic devices, which converts waste heat into electrical energy without any external stimuli, such as light or mechanical motion. However, the poor flexibility of traditional TEGs (e.g., Si-based TE [...] Read more.
A thermoelectric generator (TEG) is one of the important energy harvesting sources for wearable electronic devices, which converts waste heat into electrical energy without any external stimuli, such as light or mechanical motion. However, the poor flexibility of traditional TEGs (e.g., Si-based TE devices) causes the limitations in practical applications. Flexible paper substrates are becoming increasingly attractive in wearable electronic technology owing to their usability, environmental friendliness (disposable, biodegradable, and renewable materials), and foldability. The high water-absorbing quality of paper restricts its scope of application due to water failure. Therefore, we propose a high-performance flexible waterproof paper-based thermoelectric generator (WPTEG). A modification method that infiltrates TE materials into cellulose paper through vacuum filtration is used to prepare the TE modules. By connecting the TE-modified paper with Al tape, as well as a superhydrophobic layer encapsulation, the WPTEG is fabricated. The WPTEG with three P–N modules can generate an output voltage of up to 235 mV at a temperature difference of 50 K, which can provide power to portable electronic devices such as diodes, clocks, and calculators in hot water. With the waterproof property, the WPTEG paves the way for achieving multi-scenario applications in humid environments on human skin. Full article
(This article belongs to the Special Issue Recent Advances in Thermoelectric Materials and Devices/Modules)
Show Figures

Graphical abstract

Back to TopTop