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Advanced Materials for Flexible Sensors and Actuators

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Smart Materials".

Deadline for manuscript submissions: 30 June 2026

Special Issue Editors


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Guest Editor
School of Aeronautics and Astronautics, Zhejiang University, Hangzhou 310027, China
Interests: smart structures; active vibration control
Special Issues, Collections and Topics in MDPI journals
School of Aeronautics, Nanjing University of Aeronautics and Astronautics, Nanjing, China
Interests: Smart materials and structures; sensing; actuating and control; thin-shell structures

Special Issue Information

Dear Colleagues,

Smart materials and structures usually exhibit multi-field electro-/magneto-/photo-/elastic coupling behavior. For example, flexoelectricity describes the contribution of the linear couplings between electric polarization and the strain gradient and between the polarization gradient and strain to the thermodynamics of a solid. Based on the multi-field coupling mechanism, smart materials can accomplish energy exchange between electrical energy, potential energy, kinetic energy, etc.; sensors and actuators made of smart materials provide a novel solution to real-time distributed sensing, diagnosis, static/dynamic control and energy harvesting. They satisfy the stringent requirements for weight, space and reliability in mechanical, civil, aeronautic and astronautic systems, and even MEMS and nano structures. This Special Issue focuses on the multi-field coupling of smart structures encompassing theoretical research and applications.

The aim of this Special Issue of Materials is to cover recent research in advanced materials for flexible sensors and actuators. The scope includes, but is not limited to, general multi-field coupling theory of novel smart materials; electric modeling of multi-field coupling structures; sensing, energy generation and active control of structures with multi-field coupling effects; and fabrication, testing and analysis of multi-field coupling systems with sensors and actuators.

In this Special Issue, we aim to circulate the latest knowledge in the performance of advanced materials for flexible sensors and actuators. Excellent contributions will form the basis for new research for both young researchers, as well as leading experts in the field.

Dr. Hua Li
Dr. Mu Fan
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced materials
  • smart materials and structures
  • multi-field coupling and control
  • sensor and actuators
  • dynamic modeling
  • optimization

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Published Papers

This special issue is now open for submission.
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