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Advanced Thin Films: Structural, Optical, and Electrical Properties
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Advanced Thin Films: Structural, Optical, and Electrical Properties

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".

Deadline for manuscript submissions: 20 November 2025 | Viewed by 518

Special Issue Editor

Prof. Dr. Dongsheng Li

grade E-Mail Website
Guest Editor
State Key Laboratory of Silicon and Advanced Semiconductor Materials, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China
Interests: materials science; plasmonics; light–matter interaction; silicon photonics; solar cells; spectroscopy

Special Issue Information

Dear Colleagues,

The Special Issue titled "Advanced Thin Films: Structural, Optical, and Electrical Properties" aims to highlight the recent advancements and research methodologies related to thin films, which are increasingly essential in modern technologies. With applications spanning from electronics and optoelectronics to energy harvesting and storage, understanding the interplay between the structural, optical, and electrical properties of these materials is crucial for their optimization and integration into devices.

This issue seeks to gather innovative research contributions that delve into various aspects of advanced thin films, including, but not limited to, the synthesis techniques, characterization methods, and the influence of film morphology on their functional properties. We encourage submissions that explore new materials—such as nanostructured films, 2D materials, and multifunctional composites—as well as studies focusing on the effects of processing conditions, doping, and interface engineering.

By fostering a multidisciplinary dialogue among researchers, this Special Issue aims to lay the groundwork for future investigations that can enhance the performance and applicability of thin films in next-generation technological solutions, ultimately driving innovation across multiple scientific and industrial fields.

Prof. Dr. Dongsheng Li
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced thin films
  • optical properties
  • electrical properties
  • synthesis and characterization techniques
  • interface engineering
  • energy harvesting
  • optoelectronics

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Published Papers (1 paper)

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Research

19 pages, 5487 KB  
Article
Effect of Addition of Cr on the Structural Properties of Copper Films on BaTiO3 Ceramic Substrates
by Fengtian Shi, Heda Bai, Yuanhao Liao, Jin Li and Xiangli Liu
Materials 2025, 18(21), 4851; https://doi.org/10.3390/ma18214851 - 23 Oct 2025
Viewed by 312
Abstract
In the application of ceramic dielectric filters, to achieve electromagnetic shielding of signals and subsequent integrated applications, it is necessary to carry out metallization treatment on their surfaces. The quality of metallization directly affects the performance of the filter. However, when in use, [...] Read more.
In the application of ceramic dielectric filters, to achieve electromagnetic shielding of signals and subsequent integrated applications, it is necessary to carry out metallization treatment on their surfaces. The quality of metallization directly affects the performance of the filter. However, when in use, the filter may encounter harsh environmental conditions. Therefore, the surface-metallized film needs to have strong corrosion resistance to ensure its long-term stability during use. In this paper, Cu films and copper–chromium alloy films were fabricated on Si (100) substrates and BaTiO3 ceramic substrates by HiPIMS technology. The effects of different added amounts of Cr on the microstructure, electrical conductivity, and corrosion resistance of the Cu films were studied. The results show that with an increase in Cr content, the preferred orientation of the (111) crystal plane gradually weakens, and the grains of the Cu-Cr alloy film gradually decrease. The particles on the film surface are relatively coarse, increasing the surface roughness of the film. However, after doping, the film still maintains a relatively low surface roughness. After doping with Cr, the resistivity of the film increases with the increase in Cr content. The film–substrate bonding force shows a trend of first increasing and then decreasing with the increase in Cr content. Among them, when the Cr content is 2 at.%, the film–substrate bonding force is the greatest. The Cu-Cr alloy film has good corrosion resistance in static corrosion. With the increase in Cr content, the Tafel slope of the cathode increases, and the polarization resistance Rp also increases with the increase in Cr content. After the addition of Cr, both the oxide film resistance and the charge transfer resistance of the electrode reaction of the Cu-Cr alloy film are greater than those of the Cu film. This indicates that the addition of Cr reduces the corrosion rate of the alloy film and enhances its corrosion resistance in a NaCl solution. 2 at.% Cr represents a balanced trade-off in composition. While ensuring the film is dense, uniform, and has good electrical conductivity, the adhesion between the film and the substrate is maximized, and the corrosion resistance of the Cu film is also improved. Full article
(This article belongs to the Special Issue Advanced Thin Films: Structural, Optical, and Electrical Properties)
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