materials-logo

Journal Browser

Journal Browser

High-Performance Thermoelectric Materials and Devices for Energy Conversion

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: 30 November 2025 | Viewed by 104

Special Issue Editors


E-Mail Website
Guest Editor
College of Materials Science and Engineering, Fuzhou University, Fuzhou, China
Interests: thermoelectric bulks; thin films and devices

E-Mail Website
Guest Editor
State Key Laboratory of Powder Metallurgy, Central South University, Changsha, China
Interests: thermoelectric ceramics and thin films; dielectrics; 3D printing
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Thermoelectrics could realize heat–electricity conversion, which is important for carbon neutralization. However, the key challenge that researchers face is the electrical–thermal transport decoupling. And for practical use, the device construction and optimization decide the future of the thermoelectric community.

This Special Issue will focus on “High-Performance Thermoelectric Materials and Devices for Energy Conversion”, which includes reports on new transport mechanisms, strategies for carrier–phonon decoupling, methods of constructing high-performance thermoelectric devices, low-dimensional thermoelectrics, and new types of thermoelectrics. New concepts, promising materials, and insightful results are welcome.

It is my pleasure to invite you to submit a manuscript for this Special Issue. Full papers, communications, and reviews are all welcome.

Dr. Yunpeng Zheng
Dr. Zhifang Zhou
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thermoelectric
  • thermoelectric device
  • thermoelectric thin films
  • single crystals
  • decoupling
  • plasticity
  • zT

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.

Further information on MDPI's Special Issue policies can be found here.

Published Papers

This special issue is now open for submission.
Back to TopTop