Abrasive Machining of Semiconductor Materials: Equipment, Materials, and Processes

Dear Colleagues,

Semiconductor materials play crucial roles in numerous engineering applications that range from electronics and photonics to renewable energy and biotechnology etc. Achieving the desired levels of dimensional accuracy, geometric precision, and surface quality in the semiconductor manufacturing industry is essential for the successful development of cutting-edge devices and systems. This Special Issue concentrates on precise abrasive machining of semiconductor materials, with a specific emphasis on exploring advancements in equipment, materials, and processes. It serves as a platform via which to explore the latest advances, challenges, and innovations in the abrasive machining of semiconductor materials and aims to bring together academic researchers, scientists, industry engineers and experts to share their insights, exchange knowledge, and present novel approaches in the field.

The research articles featured in this Issue will cover a broad spectrum of topics, including grinding, lapping, polishing, and other related processes such as chemical mechanical planarization (CMP), edge profiling, and wire-sawing, etc., with widespread use in the semiconductor manufacturing industry. Authors will delve into the intricacies of 1) innovative abrasive machining equipment, tool design and development, 2) novel abrasive materials and other related consumables, 3) abrasive machining process analysis, simulation and optimization. Furthermore, the Issue will highlight the application of abrasive machining for extremely hard-to-machine semiconductor materials such as sapphire and silicon carbide.

This Special Issue aligns perfectly with the scope of Machines as it presents research on equipment design, advanced materials, and process optimization in the field of semiconductor manufacturing. By showcasing the application of abrasive machining in the semiconductor industry, this Special Issue will contribute directly to this publications; 'Machines' objective of disseminating knowledge on machine tools, manufacturing processes, and related technologies. We anticipate that this Special Issue will contribute significantly to advancing the understanding and implementation of abrasive machining in semiconductor materials. It is our hope that the research presented herein will inspire new ideas, foster collaborations, and pave the way for further advancements in this rapidly evolving field.

Dr. Zhichao Li
Guest Editor

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