Abrasive Machining of Semiconductor Materials: Equipment, Materials, and Processes

A special issue of Machines (ISSN 2075-1702). This special issue belongs to the section "Micro/Nano Electromechanical Systems (MEMS/NEMS)".

Deadline for manuscript submissions: closed (20 January 2024) | Viewed by 1631

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Industrial & Systems Engineering Department, NCA&T State University, Greensboro, NC, USA
Interests: modeling; simulation and optimization of advanced manufacturing/production processes

Special Issue Information

Dear Colleagues,

Semiconductor materials play crucial roles in numerous engineering applications that range from electronics and photonics to renewable energy and biotechnology etc. Achieving the desired levels of dimensional accuracy, geometric precision, and surface quality in the semiconductor manufacturing industry is essential for the successful development of cutting-edge devices and systems. This Special Issue concentrates on precise abrasive machining of semiconductor materials, with a specific emphasis on exploring advancements in equipment, materials, and processes. It serves as a platform via which to explore the latest advances, challenges, and innovations in the abrasive machining of semiconductor materials and aims to bring together academic researchers, scientists, industry engineers and experts to share their insights, exchange knowledge, and present novel approaches in the field.

The research articles featured in this Issue will cover a broad spectrum of topics, including grinding, lapping, polishing, and other related processes such as chemical mechanical planarization (CMP), edge profiling, and wire-sawing, etc., with widespread use in the semiconductor manufacturing industry. Authors will delve into the intricacies of 1) innovative abrasive machining equipment, tool design and development, 2) novel abrasive materials and other related consumables, 3) abrasive machining process analysis, simulation and optimization. Furthermore, the Issue will highlight the application of abrasive machining for extremely hard-to-machine semiconductor materials such as sapphire and silicon carbide.

This Special Issue aligns perfectly with the scope of Machines as it presents research on equipment design, advanced materials, and process optimization in the field of semiconductor manufacturing. By showcasing the application of abrasive machining in the semiconductor industry, this Special Issue will contribute directly to this publications; 'Machines' objective of disseminating knowledge on machine tools, manufacturing processes, and related technologies. We anticipate that this Special Issue will contribute significantly to advancing the understanding and implementation of abrasive machining in semiconductor materials. It is our hope that the research presented herein will inspire new ideas, foster collaborations, and pave the way for further advancements in this rapidly evolving field.

Dr. Zhichao Li
Guest Editor

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Published Papers (1 paper)

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Research

20 pages, 17150 KiB  
Article
Microwave Frequency Offset Induced by Subsurface Damage in Abrasive-Machined Semiconductor Ceramic Waveguide
by Haoji Wang, Jinhua Wei, Bin Lin, Xiaoqi Cui, Hetian Hou, Zhiyuan Fu, Jianchun Ding and Tianyi Sui
Machines 2023, 11(12), 1057; https://doi.org/10.3390/machines11121057 - 28 Nov 2023
Viewed by 1288
Abstract
Ceramic waveguide components play a critical role in modern microwave semiconductor systems. For the first time, this work reports experimental results obtained when dielectric ceramics are abrasive-machined into waveguide components. This process will cause subsurface damage (SSD), resulting in a deviation in their [...] Read more.
Ceramic waveguide components play a critical role in modern microwave semiconductor systems. For the first time, this work reports experimental results obtained when dielectric ceramics are abrasive-machined into waveguide components. This process will cause subsurface damage (SSD), resulting in a deviation in their working frequency which can degrade the performance of the system. For a substrate-integrated waveguide (SIW) resonator working at 10.1 GHz, SSD with a depth of 89 um can cause a maximum frequency offset of 20.2%. For a mm wave component working at 70 GHz, the corresponding frequency offset could increase to 169%. Three resonator SIW filters with SSD are studied, and the results demonstrate that the frequency offset induced by SSD can reduce the pass rate of the filters from 95.4% to 0%. A theoretical analysis is performed to reveal the mechanism and to offer a quantitative estimation of the limiting range of the offset caused by SSD. Feasible methods for reducing the offset caused by SSD, such as structure design, processing optimization, and material reinforcement, are discussed. Full article
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