Conferences

Dear Colleagues,

We are pleased to welcome you to the 11th International Symposium on Sensor Science (I3S 2025), taking place in Barcelona, Spain, from 17 to 19 November 2025. The latest edition of the historied conference series, this meeting aims to bring together top researchers, industry professionals, and leading experts from around the world to share the latest advancements, exchange ideas, and foster collaborations in the field of sensors.

Core domains of research will be covered by the following tracks:

• Session 1. Nanomaterials for sensors
• Session 2. Fluorescent and colorimetric sensors for chemical and biological detection
• Session 3. Emerging trends in electrochemical sensors: From fundamentals to implantable technologies
• Session 4. Plasmonic and SERS gas sensing and applications
• Session 5. Lab-on-a-Chip devices and applications
• Session 6. Electronic skin, flexible sensors, and wearables
• Session 7. Sensor technologies for environmental and smart agriculture applications
• Session 8. AI and sensors: From material discovery to modeling and data processing

We look forward to welcoming you to the venue Casa Convalescència, a modernist gem located in the monumental center of Barcelona, which will offer a vibrant backdrop to connect with thought leaders in the field while enjoying the city’s rich culture and history.

Sincerely,

Dr. Edgar Muñoz, Institute of Carbochemistry (ICB)-CSIC
Dr. Eduard Llobet, Universitat Rovira i Virgili
I3S 2025 Chairs

Click here for submission instructions: https://bit.ly/4kZ0nc1
Click here to submit your abstract: https://bit.ly/4l4W1jt
Click here to register for the conference: https://bit.ly/4hI4ar3

For all inquiries, please contact i3s2025@mdpi.com.

https://sciforum.net/event/I3S2025

We are pleased to announce that the 2nd International Conference on AI Sensors and Transducers (AIS 2025) will be held in Kuala Lumpur, Malaysia, from 29 July to 3 August 2025. This conference is organized by the following MDPI journals: Sensors, AI Sensor, Micromachines, Chemosensors, and Robotics. Building on the success of our previous conference in Singapore, this event promises to be an exciting platform for exploring cutting-edge advances and fostering collaboration in the rapidly evolving field of AI, sensors, and transducers. We expect that AIS 2025 will host over 600 participants from around the world.

Conference Chairs
Prof. Dr. Toshihiro Itoh, Department of Precision Engineering, University of Tokyo, Japan.
Prof. Dr. Sang-Woo Kim, Department of Materials Science and Engineering, Yonsei University, Korea.
Prof. Dr. Chengkuo Lee, Director of Center for Intelligent Sensors and MEMS, Electrical and Computer Engineering, National University of Singapore, Singapore.

Topics of Interest
S1. Lab-on-a-chip (LoC) and microTAS;
S2. Biosensors and biomedical devices;
S3. In-body IoT sensing technology, electroceuticals, and neural interfaces;
S4. Nanophotonics and metasurface;
S5. Acoustic, RF, THz metamaterials, and AI-enabled metamaterials;
S6. Neuromorphic computing, in-memory computing, and applications;
S7. Photonics-integrated circuits (PICs) and novel materials;
S8. Enabling technology for photonic neural networks (PNNs) and applications;
S9. In-sensor computing and enabling technology for edge computing;
S10. MEMS/NEMS sensors;
S11. Semiconductor sensors and CMOS MEMS;
S12. Piezoelectric MEMS and resonators—FBAR, SAW, and pMUT;
S13. Piezoelectric transducers and energy harvesters;
S14. Ferroelectric/perovskite/2D materials, thin film, and applications;
S15. Gas sensors and chemosensors;
S16. Triboelectric nanogenerators and self-powered sensors;
S17. Energy harvesting technology and applications;
S18. Flexible, stretchable, and wearable sensors;
S19. Wearable AI sensors;
S20. AI-enhanced tactile sensors and e-ekin;
S21. Haptic technology and applications;
S22. Advanced sensors for robots and autonomous systems;
S23. Intelligent sensors and AI-enhanced humanoids;
S24. Enabling technology for digital twin, metaverse, and smart sensing systems;
S25. AIoT technology and applications;
S26. Sensors for applications in agriculture, aquaculture, food technology (A2FT), and harsh environments;
S27. Industry forum and commercialization of sensors and transducers;
S28. Regular symposium.

Guide for Authors
Please click the button to submit your abstract before 10 May 2025. 

Please click the button to register for this event.  

For any enquiries regarding the event, please contact ais2025@mdpi.com.

We look forward to seeing you at AIS 2025.

https://sciforum.net/event/AIS2025?utm_source=journal&utm_medium=post

We would like to cordially invite you to attend the 3rd International Electronic Conference on Machines and Applications, organized by the MDPI journal Machines (ISSN: 2075-1702, Impact Factor: 2.1), which will take place online from 12 to 14 May 2026. 

Conference Chair
Prof. Dr. Antonio J. Marques Cardoso  
CISE—Electromechatronic Systems Research Centre,
Department of Electromechanical Engineering, University of Beira Interior, Calçada Fonte do Lameiro, Covilhã, Portugal 

The Topics of Interest
S1. Automation and Control Systems
S2. Condition Monitoring and Fault Diagnosis
S3. Machines Design and Additive Manufacturing
S4. Electrical Machines and Drives
S5. Electromechanical Energy Conversion Systems
S6. Mechatronics/Electromechatronics 

Important Dates
Deadline for abstract submission: 9 January 2026
Notification of acceptance: 9 February 2026
Registration deadline: 6 May 2026 

Guide for Authors
To submit your abstract, please visit the following website:
https://sciforum.net/user/submission/create/1402
To register for this event, please visit the following website:
https://sciforum.net/event/IECMA2026?section=#registration
For more information about abstract submission, poster and slide submission, and publication opportunities, please refer to the “Instructions for Authors” section on the conference website:https://sciforum.net/event/IECMA2026?section=#instructions
For any inquiries regarding this event, please contact iecma2026@mdpi.com. 

https://sciforum.net/event/IECMA2026