Special Issue "Optimization and Simulation of Solid State Manufacturing Processes"
A special issue of Journal of Manufacturing and Materials Processing (ISSN 2504-4494).
Deadline for manuscript submissions: 31 December 2020.
Interests: optimization and simulation of manufacturing processes; sustainable manufacturing processes; application of nanotechnologies to manufacturing processes; process/microstructure/in-service behavior relationships
Interests: optimization and simulation of manufacturing processes; sustainable manufacturing processes; process/microstructure/in-service behavior relationships
The ever-increasing emphasis on sustainable growth has affected mechanical engineering tremendously. Nowadays, components and products must be efficient, durable, and lightweight. Manufacturing is often only seen as a step in creating a product as efficiently as possible without “too many negative effects” on the component. This is usually the driving factor of design for manufacture. Innovative solutions to reduce costs and weight without compromising performance require mastery of the entire manufacturing process. Each manufacturing part is the result of the cumulative effect of the various processes encountered along the entire manufacturing chain. The usual process simulation method has to evolve to innovative multiscale (from microscopic to macroscopic scales), multiphysical (strong thermomechanical and microstructural couplings), and multilevel advanced simulation. This advance will lead to the development of new tools that are better-suited to production (reduced premature wear, increased service life, improved tools, etc.) and will reduce production time and thereby production costs. The importance of modeling and simulation will be increased with the progressive introduction of Industry 4.0 concepts. They will disrupt the way we use modeling and simulation, increasing its use and value ,since product design and development will take place in simulated laboratories and utilize digital fabrication models. In the same way that physical product evolves to the Internet of the Things, its digital model will need to evolve to an Internet of the Simulations (IoS), in which heterogeneous simulations of the diverse physical and cyber subsystems of the smart product can interoperate without restrictions. For that, process simulation is a key point of this concept.
Manufacturers must optimize their production processes to meet the high demand for new products of greater value in terms of accessibility, quality, productivity, and profitability. The presence of complex phenomena related to fields such as continuum mechanics, thermomechanics, metallurgy, and chemistry complicates attempts to control these processes. These phenomena are even more complex in high strain, strain rates, and temperature gradients. The scientific barriers to overcome concern the constitutive laws of engineered materials, the tribology of the processes, the development of fast and accurate numerical simulation methods, and experimental validation through local strain and temperature field measurements.
In this Special Issue of JMMP, current research findings are going to be reported which focus on individual or subsequent simulation of manufacturing processes or steps throughout the manufacturing sequence. The range of considered processes covers solid-state processes focusing on metals. Papers will be considered that show significant improvements with clear regard to innovative aspects achieved by the below mentioned processes and process combinations.
We are interested in contributions that focus on topics such as:
- Characterization techniques for the determination of constitutive laws of metallic alloys for manufacturing process simulation, for the determination of local strain, strain rate and thermal fields measurements, for modeling the tribology of the processes, etc.
- Different approaches for process simulation: FEM, DEM, high performance computing (HPC), molecular dynamics, in 2D, 3D, etc.
- Process simulation applications and validation for solid-state metal transformation: cutting, friction stir welding, forging, stamping, magnetic pulse forming and welding, etc. in terms of chip geometry, deformation and temperature fields, residual stresses, loads, etc.
Prof. Dr. Frank Girot Mata
Prof. Dr. Olivier Cahuc
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Manufacturing and Materials Processing is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Manufacturing Processes
- Machining, forming, friction stir welding, magnetic pulse forming and welding, etc.
- Behavior law
- 3D simulation of manufacturing processes
The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.
Professor Philippe VIOT, Arts et Métiers Sciences and Technology, France
Professor Samuel FOREST, Mines ParisTech, France
Professor Ivan IORDANOFF, Arts et Métiers Sciences and Technology, France
Professor Paul AKERSTROM, Lulea University of Technology, Sweden
Dr. Madalina CALAMAZ, Arts et Métiers Sciences and Technology, France, for strain field measurement during chip formation
Professor Johan JANSSON, KTH, Sweden and BCAM, Spain, for High Performance Computing and its use in manufacturing processes simulation
Dr. Mamzi Afrasiabi, ETH Zürich, Switzerland, for 3D Particle-Based Simulations of a Simplified Laser Drilling Process