Recent Advancements and Functional Applications of Aerogels
A special issue of Gels (ISSN 2310-2861). This special issue belongs to the section "Gel Processing and Engineering".
Deadline for manuscript submissions: 31 May 2026 | Viewed by 2182
Special Issue Editors
Interests: microfluidics; soft materials; flexible electronics; sensors and probes
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Aerogel is composed of colloidal particles or polymer molecules that aggregate to form a porous network structure in pores, among which a highly dispersed solid material is filled with a gaseous dispersing medium. Due to its distinctive advantages, such as ultra-low density, high porosity, low thermal conductivity, and high specific surface area, aerogel is widely used in thermal insulation, sound insulation, electromagnetic shielding, and other fields.
Recent advances in aerogels—such as the development of wearable aerogels for personal thermal management, aerogels with controllable porous microstructures for super-thermal insulation under extreme environments, and radiative cooling aerogels for building energy saving—broaden their functional applications.
This Special Issue aims to provide an opportunity for researchers to contribute their most recent research and development in functional aerogels. Topics of interest include, but are not limited to, the following:
- Aerogels for flame retardant;
- Aerogels for thermal insulation;
- Stimuli-responsive aerogels;
- Additive manufacturing of aerogels;
- Aerogels for solar-thermal regulatory cooling;
- Aerogels for thermal energy storage;
- Aerogels fiber;
- Aerogels for catalysis.
Dr. Ye Tian
Dr. Qiaoran Zhang
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Gels is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- aerogels
- multifunctional applications
- thermal insulation
- stimuli-responsive
- flame retardant
- wearable aerogels
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.
