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Heat and Mass Transfer Processes in the Different Scales and Fields Applications

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "J1: Heat and Mass Transfer".

Deadline for manuscript submissions: 25 September 2025 | Viewed by 26

Special Issue Editor


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Guest Editor
School of Power and Mechanical Engineering, Wuhan University, Wuhan, China
Interests: nanoscale; thermal and mass transport

Special Issue Information

Dear Colleagues,

Understanding the thermal and mass transport phenomena that occur at interfaces enables the advancement of technologies related to energy conversion, the processing of materials, microfluidics, the cooling of electronics, and biomedical applications. Recent developments have significantly enhanced our ability to characterize, simulate, and manipulate interfacial transport mechanisms at the micro- and nano-scales. The insights emerging from theoretical models, numerical simulations, and experimental techniques have enabled the more precise control of energy and mass transport across interfaces, providing new opportunities for innovation in multiple areas of science and engineering. This Special Issue aims to highlight recent theoretical, computational, and experimental advances in interfacial thermal and mass transport. We welcome original contributions and comprehensive reviews that address methodological developments and innovative applications related to interfacial phenomena.

The scope of this Special Issue includes, but is not limited to, the following topics:

  • Molecular-scale interfacial transport phenomena;
  • Heat and mass transfer in micro/nano-fluidic systems;
  • Surface plasmon resonance-driven transport processes;
  • Thermodynamics and kinetics of interfacial phase changes;
  • Photothermal and plasmonic interfacial phenomena;
  • Interfacial transport mechanisms in energy storage and conversion systems;
  • Enhanced heat and mass transfer by micro/nano-structured interfaces;
  • Computational methods for interfacial thermal and mass transport;
  • Experimental characterization techniques for interface transport phenomena;
  • Multiphase transport at solid-liquid and liquid-vapor interfaces;
  • Interfacial phenomena in microelectronics and semiconductor cooling.

We look forward to receiving your contributions, which will provide deeper insights and foster further advancements in this critical field of research.

Dr. Dezhao Huang 
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • interfacial transport
  • thermal transport
  • mass transfer
  • micro/nanofluidics
  • surface plasmon resonance

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Published Papers

This special issue is now open for submission.
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