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Reliability of Power Electronics Devices and Converter Systems: 2nd Edition

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "F3: Power Electronics".

Deadline for manuscript submissions: 20 January 2026 | Viewed by 301

Special Issue Editors


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Guest Editor
College of Electrical and Information Engineering, Hunan University, Changsha, China
Interests: power semiconductor devices and applications (including design, characterization, modeling, reliability, gate driver, converter control and topology)
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Guest Editor
School of Electrical Engineering, Hohai University, Nanjing, China
Interests: power electronics reliability
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Guest Editor
School of Electrical Engineering and Automation, Anhui University, Hefei, China
Interests: advanced driving; condition monitoring; packaging; characterization of power semiconductor devices
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Guest Editor
College of Mechanical and Electrical Engineering, Hohai University, Changzhou, China
Interests: modeling of PV module and PV system; failure mechanisms of PV module; fault diagnosis; intelligent maintenance of PV systems; PV fed microgrids
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Guest Editor
Electrical and Computer Engineering, The Ohio State University, Columbus, OH, USA
Interests: reliability and ruggedness of advanced semiconductor power devices; health state monitoring technologies; applications in power electronic systems
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Special Issue Information

Dear Colleagues,

Power electronics play a key role in energy conversion and management, being prominent in renewable energy generation systems, electric vehicles, smart grids, etc. However, industrial experience indicates that the power converter is one of the weakest components in the system. Thus, there is a pressing need to improve the reliability of power converters and reduce the system downtime induced by the failure of power converters. The failure mechanism, thermal network model, junction temperature estimation, lifetime prediction, condition monitoring, and thermal control of power electronics systems have become increasingly important. This Special Issue aims to present and disseminate the most recent advances related to the reliability of power electronics system. Topics of interest for publication include, but are not limited to, the following:

1) Failure and degradation mechanism of power devices and converters;
2) Testing methodologies, techniques, and platforms design for power devices and converters;
3) Junction temperature estimation and thermal management of power devices and converters;
4) Packaging and modeling of advanced semiconductor power devices, such as SiC, GaN, Ga2O3, etc;
5) Condition monitoring, fault detection, and diagnosis of power device and converters;
6) Gate drivers and artificial intelligence-driven reliability enhancement methodology of power device and converters;
7) Digital twin modeling of power electronic converters and components.

Prof. Dr. Jun Wang
Dr. Jun Zhang
Dr. Kun Tan
Dr. Jingwei Zhang
Dr. Hengyu Yu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • power device
  • power converter
  • reliability

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Published Papers (1 paper)

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Research

22 pages, 6557 KB  
Article
Modeling of Residual Stress, Plastic Deformation, and Permanent Warpage Induced by the Resin Molding Process in SiC-Based Power Modules
by Giuseppe Mirone, Luca Corallo, Raffaele Barbagallo and Giuseppe Bua
Energies 2025, 18(20), 5364; https://doi.org/10.3390/en18205364 - 11 Oct 2025
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Abstract
A critical aspect in the design of power electronics packages is the prediction of their mechanical response under severe thermomechanical loads and the consequent structural damage. For this purpose, finite element (FE) simulations are used to estimate the mechanical performance and reliability under [...] Read more.
A critical aspect in the design of power electronics packages is the prediction of their mechanical response under severe thermomechanical loads and the consequent structural damage. For this purpose, finite element (FE) simulations are used to estimate the mechanical performance and reliability under operational conditions, typically alternate high voltages/currents resulting in thermal gradients. When simulations are performed, it is common practice to consider the as-received package to be in a stress-free state. Namely, residual stresses and plastic deformation induced by the manufacturing processes are neglected. In this study, an advanced FE modeling approach is proposed to assess the structural consequences of the encapsulating resin curing, typical in the production of silicon carbide (SiC)-based power electronics modules for electric vehicles. This work offers a general modeling framework that can be further employed to simulate the effects of thermal gradients induced by the production process on the effective shape and residual stresses of the as-received package for other manufacturing stages, such as metal brazing, soldering processes joining copper and SiC, and, to lower extents, the application of polyimide on top of passivation layers. The obtained results have been indirectly validated with experimental data from literature. Full article
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