Artificial Intelligence in Mechanical Engineering: From Statistical Learning to Generative Models

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Artificial Intelligence".

Deadline for manuscript submissions: 15 August 2025 | Viewed by 3671

Special Issue Editors


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Guest Editor
Department of Mechanical and Aerospace Engineering (DIMEAS), Politecnico di Torino, Corso Duca Degli Abruzzi 24, 10129 Torino, Italy
Interests: intelligent fault diagnosis; condition monitoring; predictive maintenance; rolling bearings; generative AI; machine learning; deep learning; transfer learning; rotating machinery; generative adversarial networks; explainable AI; machine design; artificial intelligence; image processing

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Guest Editor
Department of Mechanical and Aerospace Engineering (DIMEAS), Politecnico di Torino, Corso Duca Degli Abruzzi 24, 10129 Torino, Italy
Interests: rotordynamics; fatigue; damage estimation
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Special Issue Information

Dear Colleagues,

The Special Issue “Artificial Intelligence in Mechanical Engineering: From Statistical Learning to Generative Models” covers the advancements in artificial intelligence in the field of mechanical engineering, tracing its development from statistical learning through discriminative and regression models to generative models. This Special Issue encompasses a broad spectrum of AI applications, such as robotics, automation, predictive maintenance, optimization of manufacturing processes, advanced materials design, machine design, structural integrity, damage identification, and evolution and fatigue life estimation. The broad array of subjects exemplifies the far-reaching influence of AI in various aspects of the field, showcasing its adaptability in addressing a wide range of multifaceted problems.

We welcome submissions that explore the application and development of machine learning, deep learning, transfer learning, and generative artificial intelligence approaches. Articles should address algorithmic approaches that are based on data, improving our comprehension in the given domains.

We also encourage papers that analyze scenarios with limited, missing, or heavily contaminated data that necessitate extensive cleaning and preprocessing. We highly appreciate entries that showcase innovative AI solutions for addressing these prevalent data-related obstacles, showcasing the adaptability and robustness of AI technology in practical applications.

We welcome scholars and professionals to submit their most recent research discoveries and assessments, which not only advance the boundaries of current technology but also provide practical solutions and insights into the future trajectory of artificial intelligence in mechanical engineering. Review papers are welcome as well.

Dr. Luigi Gianpio Di Maggio
Prof. Dr. Cristiana Delprete
Guest Editors

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

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Keywords

artificial intelligence

mechanical engineering

statistical learning

intelligent fault diagnosis

robotics

machine learning

machine design

material design

fatigue damage

deep learning

generative AI

manufacturing

structural health monitoring

structural integrity

industry

rotating machinery

feature extraction

data-driven mechanics

vibration

sensors

data analysis

classification

regression

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Published Papers (1 paper)

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Research

24 pages, 3834 KiB  
Article
Digital Twins in 3D Printing Processes Using Artificial Intelligence
by Izabela Rojek, Tomasz Marciniak and Dariusz Mikołajewski
Electronics 2024, 13(17), 3550; https://doi.org/10.3390/electronics13173550 - 6 Sep 2024
Cited by 4 | Viewed by 2922
Abstract
Digital twins (DTs) provide accurate, data-driven, real-time modeling to create a digital representation of the physical world. The integration of new technologies, such as virtual/mixed reality, artificial intelligence, and DTs, enables modeling and research into ways to achieve better sustainability, greater efficiency, and [...] Read more.
Digital twins (DTs) provide accurate, data-driven, real-time modeling to create a digital representation of the physical world. The integration of new technologies, such as virtual/mixed reality, artificial intelligence, and DTs, enables modeling and research into ways to achieve better sustainability, greater efficiency, and improved safety in Industry 4.0/5.0 technologies. This paper discusses concepts, limitations, future trends, and potential research directions to provide the infrastructure and underlying intelligence for large-scale semi-automated DT building environments. Grouping these technologies along these lines allows for a better consideration of their individual risk factors and use of available data, resulting in an approach to generate holistic virtual representations (DTs) to facilitate predictive analyses in industrial practices. Artificial intelligence-based DTs are becoming a new tool for monitoring, simulating, and optimizing systems, and the widespread implementation and mastery of this technology will lead to significant improvements in performance, reliability, and profitability. Despite advances, the aforementioned technology still requires research, improvement, and investment. This article’s contribution is a concept that, if adopted instead of the traditional approach, can become standard practice rather than an advanced operation and can accelerate this development. Full article
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