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Electronics
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LTCC for Space, Imaging, Telecommunication, and Medical Applications
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LTCC for Space, Imaging, Telecommunication, and Medical Applications

A special issue of Electronics (ISSN 2079-9292).

Deadline for manuscript submissions: closed (31 October 2020) | Viewed by 4575

Special Issue Editor

Dr. Camilla Kärnfelt

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Guest Editor
Microwave Department, IMT Atlantique, Lab-STICC, UMR 6285, F-29238 Brest, France
Interests: LTCC design and manufacturing; microwave and mm-wave MMIC design and packaging

Special Issue Information

Dear Colleagues,

Since the late seventies, low-temperature co-fired ceramics (LTCCs) have proven their functionality in different areas such as electronics, microfluidics, and sensor devices. Even though this type of material is now well known, scientists and research engineers keep elaborating new compositions for specific usages such as high dielectric material for further miniaturization of microwave devices, lower loss material for better high frequency results tending towards the THz range, printable material for 3D integration, ferromagnetic material for circulators and isolators, and others. Manufacturing methods and parameters have been revisited, and techniques such as 3D and ink jet printing, embossing, and laser cutting are elaborated to enhance the scope of LTCC usage.

This Special Issue concerns the latest developments and accomplishments in LTCC on the subjects of preparation of the LTCC material itself, and manufacturing procedures and design strategies for devices intended for, but not limited to, space, imaging, telecommunication, and medical applications.

Topics of interest include but not limited to:

  • LTCC (low-temperature co-fired ceramic);
  • material composition and properties;
  • manufacturing (or fabrication) methods;
  • design strategies; devices—sensors, microsystems, microfluidic, medical, imaging; RF to THz

Dr. Camilla Kärnfelt
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (2 papers)

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Research

11 pages, 3293 KiB  
Article
Functionalized Three-Dimensional Multilayer Ceramic Modules
by Manja Kloska, Heike Bartsch, Jens Müller, Thomas Haas and Christian Zeilmann
Electronics 2021, 10(3), 248; https://doi.org/10.3390/electronics10030248 - 22 Jan 2021
Cited by 1 | Viewed by 2274
Abstract
Three-dimensional interconnect devices are still strongly related to plastic materials. Since the use of these materials is limited in harsh environments, there is an application gap, which could be filled by ceramic circuit carriers. Low-temperature cofired ceramics (LTCC) offer promising solutions to fill [...] Read more.
Three-dimensional interconnect devices are still strongly related to plastic materials. Since the use of these materials is limited in harsh environments, there is an application gap, which could be filled by ceramic circuit carriers. Low-temperature cofired ceramics (LTCC) offer promising solutions to fill this gap. This work provides a feasibility study, including the whole technological chain of ceramic multilayer processing. Targeting a curved multilayer substrate, fully equipped with SMD (Surface-mounted device) components, the particularities of single process steps are investigated. Two shaping methods based on quartz glass molds are compared with regard to shape fidelity and technological effort. The investigation of internal conductor lines and via connections reveals that the metallization should have a minimum width of 200 µm and the via diameter is limited to 150 µm. Further considerations focus on the possible footprint of components and use of cavities to increase the footprint of components. The limits of wire bonding on curved surfaces were inspected. Finally, the work presents a demonstrator of a fully equipped four-layer ceramic circuit, including internal wiring. Hence, the transfer of the 2.5-dimensional multilayer ceramic technology into the third dimension is proven. Full article
(This article belongs to the Special Issue LTCC for Space, Imaging, Telecommunication, and Medical Applications)
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17 pages, 3932 KiB  
Article
Sacrificial Volume Materials for Small Hole Generation in Low-Temperature Cofired Ceramics
by Camilla Kärnfelt, Dmitry Zelenchuk, Maïna Sinou, François Gallée and Paula Douglas
Electronics 2020, 9(12), 2168; https://doi.org/10.3390/electronics9122168 - 17 Dec 2020
Cited by 3 | Viewed by 1803
Abstract
The creation of hole, cavity or channel structures in low-temperature cofired ceramics (LTCCs), using different sacrificial volume materials (SVMs) was tested. The main functionality of the SVMs should be: easy application into the holes; protection of holes during lamination; uninhibited lamination between layers; [...] Read more.
The creation of hole, cavity or channel structures in low-temperature cofired ceramics (LTCCs), using different sacrificial volume materials (SVMs) was tested. The main functionality of the SVMs should be: easy application into the holes; protection of holes during lamination; uninhibited lamination between layers; and, during firing should burn out before the pores of the LTCCs close, to leave the empty holes clear of any residue. Five different materials were tested—hydroxyethyl cellulose (HEC) 2 wt%, HEC 5 wt%, agar-agar, gelatin, and commercial carbon paste—and compared to a reference sample where no SVMs were used. In all cases, lamination parameters were minimised in order to preserve the tested hole structures. Matrixes with holes ranging from 158 to 268 µm, with pitches of 573 µm in a green state, were tested. The agar-agar caused ceramic deformation as a result of thermal burst during firing and the lamination between the layers was compromised. The carbon paste was difficult to handle, requiring extra equipment for hole filling and incomplete filling of the larger holes. Traces of carbon paste were left as a landing pad on top of the holes, inhibiting lamination at these areas. The gelatin and the 2 wt% and 5 wt% hydroxyethylcellulose (HEC 2 wt% and HEC 5 wt%) filled all holes completely, and also worked as adhesive-assisted lamination (AAL) materials with excellent lamination between layers. Excellent lamination was also observed in the no-SVM case. Thermogravimetric analysis (TGA) and scanning electron microscopy (SEM) with energy-dispersive X-ray (EDX) analyses established that, for all SVMs tested, the remaining residue is negligible after firing. As a result, the HEC 2 wt% material was considered ideal for use as an SVM. Full article
(This article belongs to the Special Issue LTCC for Space, Imaging, Telecommunication, and Medical Applications)
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