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Electronics
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Advancements in High-Performance RF Transceiver Technology: Innovations and Applications
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Advancements in High-Performance RF Transceiver Technology: Innovations and Applications

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: 15 February 2026 | Viewed by 898

Special Issue Editors

Dr. Pei Qin

E-Mail Website
Guest Editor
School of Microelectronics, South China University of Technology, Guangzhou 511442, China
Interests: radio frequency transceiver- and PLL- integrated circuit design
Dr. Haoshen Zhu

E-Mail Website
Guest Editor
School of Microelectronics, South China University of Technology, Guangzhou 511442, China
Interests: radio-frequency (RF) integrated circuits; RF microelectromechanical systems; micro/nano fabrication
Dr. Shuyan Zhu

E-Mail Website
Guest Editor
School of Microelectronics Science and Technology, Sun Yat-sen University, Zhuhai 519082, China
Interests: millimeter wave-/radio frequency-integrated circuit; integrated micro- and nano-optical chips

Special Issue Information

Dear Colleagues,

This Special Issue aims to present the latest research, breakthroughs, and future directions in the field of radio frequency (RF) transceiver design and applications. With the exponential growth in wireless communication systems, Internet of Things networks, satellite communication, and next-generation standards like 5G and 6G, RF transceivers play a pivotal role in enabling seamless connectivity, higher data rates, and enhanced spectrum utilization. This Special Issue seeks to highlight advancements in both theoretical research and practical implementations that push the boundaries of RF transceiver technology.

The purpose of this Special Issue is threefold:

  1. Innovate and inform: To showcase novel methodologies, architectures, and materials that significantly improve the performance of RF transceivers in terms of efficiency, linearity, bandwidth, and integration.
  2. Bridge gaps: To connect academic research with industrial applications, providing solutions to real-world challenges.
  3. Encourage collaboration: To foster collaboration among researchers, engineers, and industry professionals in addressing complex design issues and exploring emerging trends.

Dr. Pei Qin
Dr. Haoshen Zhu
Dr. Shuyan Zhu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • high-performance radio frequency transceivers
  • radio frequency front-end design
  • low-power and energy-efficient radio frequency circuits
  • wideband and multi-band transceivers
  • amplifiers
  • mixers
  • oscillators
  • on-chip anttenae

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Further information on MDPI's Special Issue policies can be found here.

Published Papers (2 papers)

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Research

10 pages, 2053 KB  
Article
A Terahertz Dual-Band Transmitter in 40 nm CMOS for a Wideband Sparse Synthetic Bandwidth Radar
by Aguan Hong, Lina Su, Yanjun Wang and Xiang Yi
Electronics 2025, 14(22), 4392; https://doi.org/10.3390/electronics14224392 - 11 Nov 2025
Viewed by 276
Abstract
This paper presents a terahertz (THz) dual-band transmitter for a wideband sparse synthetic bandwidth radar. The transmitter employs an innovative single-path-reuse dual-band architecture. This architecture utilizes a proposed quad-transformer-coupled voltage-controlled oscillator (VCO) as an on-chip local oscillator source. It also incorporates an innovative [...] Read more.
This paper presents a terahertz (THz) dual-band transmitter for a wideband sparse synthetic bandwidth radar. The transmitter employs an innovative single-path-reuse dual-band architecture. This architecture utilizes a proposed quad-transformer-coupled voltage-controlled oscillator (VCO) as an on-chip local oscillator source. It also incorporates an innovative dual-harmonic generator and a dual-band antenna, which work together within the single signal path to generate both the fundamental frequency and its second harmonic, thereby creating the dual bands required for a sparse synthetic bandwidth radar. Fabricated in a TSMC 40 nm CMOS technology, measurement results show that the transmitter achieves a peak equivalent isotropically radiated power (EIRP) of −7.95 dBm in the low-frequency band (121.34∼126.85 GHz) and −7.86 dBm in the high-frequency band (242.68∼253.7 GHz), validating the proposed architecture’s capability to generate dual-band signals simultaneously. The entire chip occupies a compact area of only 0.54 × 0.62 mm2 and consumes 136 mW of DC power. Full article
(This article belongs to the Special Issue Advancements in High-Performance RF Transceiver Technology: Innovations and Applications)
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15 pages, 3031 KB  
Article
Dielectrically Loaded Circularly Polarized Antennas with Shaped Patterns from Flat-Top to Isoflux
by Xue Ren, Qinghua Liu, Ruihua Liu, Lifeng Tang, Kai Cheng Wang and Pei Qin
Electronics 2025, 14(22), 4363; https://doi.org/10.3390/electronics14224363 - 7 Nov 2025
Viewed by 314
Abstract
This paper introduces a novel design of a circularly polarized (CP) beamforming antenna that is capable of shaping the original beam into a flat-top configuration. Upon loading a metallic ring, the beamforming pattern can transition into an isoflux pattern. The proposed compact lens [...] Read more.
This paper introduces a novel design of a circularly polarized (CP) beamforming antenna that is capable of shaping the original beam into a flat-top configuration. Upon loading a metallic ring, the beamforming pattern can transition into an isoflux pattern. The proposed compact lens antenna comprises a multi-layer honeycomb-like unit lens structure, with a patch and support platform situated beneath the lens. Positioned above the lens, a loadable metallic ring is employed to assist in beamforming. Through a specially designed dielectric lens structure, the lens can control the radiation of electromagnetic waves to achieve the desired beam pattern, while the loadable metallic ring plays a role in optimizing the field across the aperture plane of the lens. This work utilizes a multi-port feed network to drive the patch. To validate the proposed antenna design method, a prototype is fabricated for measurement. The measured result is nearly identical to the simulated result. Within the frequency range spanning from 4.8 GHz to 5.2 GHz (which represents a 10% bandwidth), the antenna demonstrates effective beamforming ability and achieves effective pattern switching. This renders it a promising candidate for scenarios where uniform signal strength coverage is required. Full article
(This article belongs to the Special Issue Advancements in High-Performance RF Transceiver Technology: Innovations and Applications)
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