Power Electronic Devices: Design, Fabrication, Packaging and Reliability Analysis
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Electronic Materials, Devices and Applications".
Deadline for manuscript submissions: 15 October 2026 | Viewed by 74
Special Issue Editor
Interests: advanced power transmission technology; power electronic device thermal state and equilibrium regulation, power electronic device characteristics and reliability testing
Special Issue Information
Dear Colleagues,
Power electronic devices are fundamental building blocks in modern energy-conversion systems, playing a critical role in applications ranging from renewable energy integration and electric vehicles to industrial motor drives and consumer electronics. As the demand for higher efficiency, greater power density and enhanced reliability continues to grow, innovations in the design, fabrication, packaging and reliability assessment of power devices have become increasingly important. Wide-bandgap semiconductors such as silicon carbide (SiC), gallium nitride (GaN), Ga2O3 and diamond are opening new frontiers in high-frequency and high-temperature operation, while advanced packaging technologies are addressing thermal management and parasitic challenges. In this Special Issue, we aim to showcase cutting-edge research and comprehensive reviews that address the latest advancements and emerging trends in power electronic devices. We are particularly interested in contributions that present novel device structures, innovative fabrication processes, advanced packaging solutions and reliability evaluation methodologies that can accelerate the deployment of next-generation power electronics across various economic sectors.
Topics of interest include, but are not limited to, the following:
- Novel device designs and concepts for power semiconductors
- Advanced fabrication techniques for Si, SiC, GaN, Ga2O3, diamond and other wide-bandgap materials
- Packaging technologies including thermal management, interconnection and module integration
- Reliability assessment, failure analysis and lifetime-prediction methodologies
- Characterization techniques and modeling of power devices
- Applications of power electronic devices in renewable energy, automotive, industrial and consumer sectors
Dr. Peng Sun
Guest Editor
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Keywords
- power electronics device
- device fabrication
- packaging
- reliability
- failure analysis
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