Flexible Thin Films and Nanomaterials in Electronic Materials

Dear Colleagues,

We are excited to announce that the Flexible Thin Films and Nanomaterials in Electronic Materials Section is now inviting submissions for this Special Issue of Electronics. This call extends to the Editorial Board Members (EBMs) of our section and distinguished scholars in this domain. We encourage contributions and recommendations from our EBMs.

The aim of this Special Issue is to compile a comprehensive set of papers that represent the most insightful and impactful original research or reviews in the field, with discussions led by our Section’s EBMs on pivotal topics. These contributions are anticipated to be highly regarded and influential within the community. Following the submission deadline, all accepted papers will be gathered into a printed book, which will receive extensive promotion.

We invite submissions that cover a broad range of topics within, but not limited to, the following scope:

• Fabrication and application of flexible thin films in electronics;
• Innovations in nanomaterials for flexible and wearable devices;
• Advances in flexible electronic interfaces and sensors;
• Development and integration of flexible solar cells and energy storage devices;
• Flexible system-on-chip (SoC) designs and applications;
• Novel processes and materials for flexible integrated circuits;
• Durability, reliability, and performance optimization of flexible electronic materials;
• Theoretical and computational models of flexible electronic materials;
• Environmental impact and sustainability of flexible electronic material production.

We believe that this Special Issue will serve as an essential resource for researchers, engineers, and professionals engaged in advancing the field of flexible electronic materials. Your contributions will play a crucial role in shaping the future of electronics technology.

Please feel free to submit your manuscript or recommend potential contributors to this timely Special Issue. We look forward to receiving your innovative research and insights into the realm of flexible thin films and nanomaterials in electronic materials.

Dr. Yongfa Cheng
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• flexible thin films
• nanomaterials
• electronic materials
• wearable devices
• flexible electronics
• integrated circuits
• solar cells
• energy storage devices
• electronic interfaces
• system-on-chip (SoC)