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Deep Learning Techniques for 3D Vision: From Reconstruction to Recognition

This special issue belongs to the section “Artificial Intelligence“.

Special Issue Information

Dear Colleagues,

This Special Issue aims to compile cutting-edge research on deep learning methodologies applied to 3D vision tasks, spanning from 3D reconstruction to object recognition. As deep learning continues to revolutionize computer vision, extending these techniques to three-dimensional data presents both significant challenges and opportunities. The scope of this Special Issue includes novel neural network architectures for processing 3D data; advancements in 3D reconstruction from single or multiple views; semantic segmentation in 3D spaces; and object detection and recognition within point clouds or volumetric data.

By exploring these diverse yet interconnected topics, this Special Issue seeks to advance the understanding of how deep learning can be leveraged to solve complex problems in 3D vision, bridging the gap between theoretical research and practical applications.

We welcome contributions that address the efficient representation and manipulation of 3D data, the integration of multimodal inputs, real-time processing, and applications in areas such as robotics, autonomous driving, augmented reality, and medical imaging.

Technical Program Committee Member:

Mr. Matteo Basile, Sapienza University

Dr. Marco Raoul Marini
Dr. Goran Oreški
Prof. Luigi Cinque
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • environment analysis
  • few-shot/zero-shot learning
  • point cloud to mesh
  • depth estimation
  • ego-centric view
  • XR

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Electronics - ISSN 2079-9292