Challenges, Innovation and Future Perspectives of GaN Technology

Deae Colleagues,

GaN devices and applications constitute viable technologies but have also undergone a process of being productized in over the past decade. The superior qualities of GaN technology include high efficiency, fast switching speed, dense physical size, and high tolerance to very high- and low-temperature operations. GaN technology is not only gaining traction in power and RF electronics but is also rapidly expanding into other applications such as radar, space, digital and quantum computing electronics. In power electronics, GaN devices are greatly desirable for use to explore both higher-voltage and ultra-low-voltage power applications. Moving into the RF and audio engineering domains, GaN devices have uses in the implementation of AI-assisted and digitized power amplifier circuits, and further advances are expected using the hardware–software co-design approach. There are also increasing needs for higher integration technology of GaN devices and of other technology like silicon. High-performance p-type GaN technology will be crucial to the realization of high-performance GaN CMOS circuits. Finally, given the increasing cost of hardware prototyping of new devices and circuits, the use of high-fidelity device models and AI- and data-driven modeling approaches for technology-circuit co-design are projected to be the design trends of the future.

This Special Issue is aimed at addressing some of the above challenges. This includes but not limited to:

• Next-generation GaN device architecture with or without new material;
• Good linearity GaN devices;
• High power density GaN devices;
• Ultra-high switching speed GaN devices;
• Terahertz and sub-terahertz GaN devices;
• Ultra-high bandwidth GaN power amplifier;
• AI-assisted GaN fault detection and mitigation;
• AI-assisted and model-based GaN design;
• Device modeling for performance and reliability study;
• AI-assisted GaN RF amplifier for next-level performance;
• Digital GaN power amplifier for audio applications;
• Low-voltage GaN DC to DC converter;
• GaN integration technology including CMOS, logical gates, etc.;
• GaN technology integration with other technologies such as silicon and others;
• GaN in quantum electronics;
• GaN in space applications;
• GaN fabrication challenges and improvement;
• GaN manufacturing challenges and improvement;
• Ultra-high speed digital GaN;
• GaN for 5G and 6G communication networks;
• GaN CMOS;
• Next-generation array for radar.

Dr. Koon Hoo Teo
Guest Editor

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• GaN
• wide-bandgap devices
• AI-assisted design
• AI-assisted operation
• fast switching devices
• power amplifier
• terahertz
• device linearity
• device power density, GaN integration technology
• low-voltage DC converter
• digital power amplifier
• audio amplifier
• quantum electronics
• space electronics
• hybrid GaN/Si integration
• GaN CMOS
• GaN arrays