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Crystals
Special Issues
Deformation and Microstructural Evolution of Copper Alloy
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Deformation and Microstructural Evolution of Copper Alloy

A special issue of Crystals (ISSN 2073-4352). This special issue belongs to the section "Crystalline Metals and Alloys".

Deadline for manuscript submissions: closed (20 December 2021)

Special Issue Editor

Dr. Keunho Lee

E-Mail Website
Guest Editor
The 4th Research and Development Institute, Agency for Defense Development, Daejeon, Korea
Interests: structure / property / deformation behavior of metals and alloys under high pressure state; dynamic properties and constitutive modelling for defense applications; advanced materials manufacturing based on powder metallurgy, severe plastic deformation, etc.; grain / boundary / interface characteristics and texture analysis in crystalline materials

Special Issue Information

Dear Colleagues,

Microstructures and alloying chemistry are the principal factors influencing the material properties and deformation behaviours of metallic materials: for example, the grain size, sub-structure density, and precipitates are well-known parameters for designing mechanical strengths and ductility. Copper and copper alloys are typical examples of diversifying both deformation behaviour and microstructural evolution based on initial microstructure and texture, which are two essential factors that significantly influence the mechanical properties. Therefore, optimization of microstructure and texture of Cu alloys through advanced processing techniques such as severe plastic deformation or powder metallurgy is the key to achieve better combination of mechanical strength and ductility. Hence, the present Special Issue aims to provide more detailed insights into the deformation behaviour and microstructural evolution of copper and copper alloys, which contribute to improved mechanical properties and relate to texture and anisotropy.

In addition, I believe that this Special Issue will make a great contribution to the research community to develop advanced concepts and technologies of high-performance Cu alloys.

Dr. Keunho Lee
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Crystals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • copper and copper alloy
  • deformation
  • microstructure
  • crystal orientation/texture
  • mechanical properties
  • precipitates and phase(s)
  • severe plastic deformation
  • powder metallurgy
  • ultrafine grains
  • performance optimization

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Published Papers (2 papers)

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Research

12 pages, 4353 KiB  
Article
Dynamic Tensile Extrusion Behavior of Fine-Grained Copper Fabricated by Powder Injection Molding
by Keunho Lee, Sanghyun Woo and Leeju Park
Crystals 2022, 12(2), 147; https://doi.org/10.3390/cryst12020147 - 20 Jan 2022
Cited by 2 | Viewed by 2522
Abstract
The dynamic tensile extrusion (DTE) behavior and microstructural evolution of fine-grained (FG, ~1 μm < d < ~10 μm) Cu fabricated by powder injection molding (PIM) were investigated. The FGM Cu was fabricated by PIM with commercial micro-sized Cu powder sintering at 850 [...] Read more.
The dynamic tensile extrusion (DTE) behavior and microstructural evolution of fine-grained (FG, ~1 μm < d < ~10 μm) Cu fabricated by powder injection molding (PIM) were investigated. The FGM Cu was fabricated by PIM with commercial micro-sized Cu powder sintering at 850 °C for 2 h, while the FGH Cu was developed by the hot isostatic pressing (HIP) of the FGM at 780 °C for 2 h under a pressure of 1000 bar. In order to compare the DTE behavior of the FG Cu manufactured using different methods, the ultrafine-grained-B (UFG, d < ~1 μm) Cu was developed by performing 16 passes of equal-channel angular pressing with route Bc, and the FG-150 Cu was fabricated by annealing the UFG-B Cu bar at 150 °C for 1 h. The DTE tests were performed with identical flyer velocities using an all-vacuum gas gun. The fragments and remnants were carefully recovered after the DTE tests and examined by electron backscattered diffraction measurement and a micro-Vickers hardness test. A strong dual <001> + <111> texture was developed during the DTE for both FGM and FGH Cu. In contrast to the outcome of the UFG-B and FG-150, little evidence of dynamic recrystallization taking place during the DTE in the FGM and FGH was found during analysis of the grain morphology and grain orientation spread. Premature failure based on void coalescence was induced at the vertex region of the FGM fragments due to pre-existing pores. The HIP treatment on the FGM Cu increased the relative density by reducing the pre-existing pores and, as a result, increased the DTE ductility of the FGH Cu. Full article
(This article belongs to the Special Issue Deformation and Microstructural Evolution of Copper Alloy)
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15 pages, 10429 KiB  
Article
Wear Behavior of Commercial Copper-Based Aircraft Brake Pads Fabricated under Different SPS Conditions
by Kyung Il Kim, Hyunjong Lee, Jongbeom Kim, Kyu Hwan Oh and Kyung Taek Kim
Crystals 2021, 11(11), 1298; https://doi.org/10.3390/cryst11111298 - 26 Oct 2021
Cited by 10 | Viewed by 3348
Abstract
Understanding the wear behavior of Cu-based brake pads, which are used in high-speed railway trains and aircraft, is essential for improving their design and safety. Therefore, the wear mechanism of these pads has been studied extensively. However, most studies have focused on the [...] Read more.
Understanding the wear behavior of Cu-based brake pads, which are used in high-speed railway trains and aircraft, is essential for improving their design and safety. Therefore, the wear mechanism of these pads has been studied extensively. However, most studies have focused on the changes in their composition and not the effects of their manufacturing conditions. In this study, we fabricated commercial Cu-based brake pads containing Fe, graphite, Al2O3, and SiO2 using spark plasma sintering under different conditions. The microstructures and mechanical properties of the pads were investigated. The pads were tribo-evaluated using the ball-on-disc test under various load conditions. Their worn surfaces were analyzed using X-ray diffraction analysis, scanning electron microscopy, energy-dispersive X-ray spectroscopy, and confocal microscopy in order to elucidate their wear mechanism. In addition, the dynamometer test was performed to confirm whether their wear behavior would be similar under actual conditions. Finally, a comparative analysis was performed using the ball-on-disc test. The results indicated that the brake pads with the same composition but fabricated under different sintering conditions exhibited different wear characteristics. We believe that this research is of great significance for understanding the wear mechanism of Cu-based brake pads and improving their design and hence their performance. Full article
(This article belongs to the Special Issue Deformation and Microstructural Evolution of Copper Alloy)
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