Special Issue "System-Integrated Intelligence and Intelligent Systems 2020"

A special issue of Computers (ISSN 2073-431X).

Deadline for manuscript submissions: closed (31 March 2021).

Special Issue Editor

Dr. Stefan Bosse
E-Mail Website
Guest Editor
1. Department of Computer Science, University of Bremen, 28359 Bremen, Germany
2. Faculty Computer Science, University of Koblenz-Landau, 55118 Mainz, Germany
Interests: self-* and intelligent systems; agents; distributed machine learning; multidomain simulation; distributed sensor networks; material informatics; crowd sensing; social data mining
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Special Issue Information

Dear Colleagues,

The Special Issue, SI3S (Short Title: “System-Integrated Intelligence and Intelligent Systems”), will be linked to the 5th International Conference on System-Integrated Intelligence (SysInt 2020, see www.sysint-conference.org). On the one hand, it will gather the top contributions presented at this event, and on the other hand, is an open call for outstanding submissions.

The conference itself provided a forum for academia and industry to present their latest research findings, innovations, and practices in the field of system-integrated intelligence. It focused on the integration of advanced functional capabilities into materials, systems, parts, and products as an enabling technology for established application scenarios, as well as new products and services. The perspectives are highly interdisciplinary. The technological basis extends from new sensor technologies via material-integrated sensing and intelligence to aspects of communication and data evaluation. It includes the implementation of such approaches in autonomous decision-making, self-optimization, and control in advanced engineering products and systems.

The conference further addressed wider fields of research, such as materials science and engineering, microsystems technology, mechatronic systems, and production engineering, as well as electronics and computer science. Specific application environments in the field of robotics, structural health monitoring, production, and logistics were highlighted in the program through the definition of dedicated symposia. Studies on implementation of system-integrated intelligence in additional scenarios beyond this scope are highly welcome.

Individual topics of interest include but are not limited to:

  1. Intelligent Systems: Enabling Technologies and Artificial Intelligence
    • Agent-based planning and reasoning
    • Applied machine learning and data mining
    • Self-* systems (*: adaptivity, awareness, configuration, connectivity, learning, coordination)
    • Knowledge-based systems
    • Cloud-based computing and manufacturing
  2. The Future of Manufacturing: Cyberphysical Production and Logistic Systems
  3. Pervasive and Ubiquitous Computing
    • Agent-based computing and agent-based simulation
    • Agent processing platforms
    • Distributed embedded and mobile systems
    • Ad-hoc and mobile networks
    • Sensor networks (large-scale, material-applied or material-integrated, low-power, smart dust)
    • Crowd and mobile sensing
    • Smart sensors
    • Smart cities
    • Smart energy management (in sensor networks)
    • Data mining from sensor data
  4. Structural Health Monitoring
    • Machine learning
    • Data mining
    • Sensor processing
  5. Systems Engineering of Smart Sensors, Sensor Networks, Devices, Machines, and IoT
  6. Soft Robotics and Human–Machine Interaction

Dr. Stefan Bosse
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Computers is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (1 paper)

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Research

Open AccessArticle
Systematic Design Approach for Functional Integration of Vehicular Wireless Power Transfers Modules
Computers 2021, 10(5), 61; https://doi.org/10.3390/computers10050061 - 07 May 2021
Viewed by 159
Abstract
This paper presents a systematic design approach to the development of functionally integrated mechanical-electrical lightweight systems. The development of these systems requires the end-to-end consideration of all product domains involved, aspects of lightweight design and their mutual interdependencies. To manage this complexity, a [...] Read more.
This paper presents a systematic design approach to the development of functionally integrated mechanical-electrical lightweight systems. The development of these systems requires the end-to-end consideration of all product domains involved, aspects of lightweight design and their mutual interdependencies. To manage this complexity, a specialized approach is developed, which extends the V-model of VDI 2206 problem-specific and purpose-oriented. In line with the proposed approach, this work presents the conception and evaluation of three functionally integrated on-board receiver units of automotive wireless power transfer systems for electric vehicles. These concepts provide a significant reduction of the vertical dimensions, which significantly increases the applicability and transferability of wireless power transfer systems. Full article
(This article belongs to the Special Issue System-Integrated Intelligence and Intelligent Systems 2020)
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