Coatings About Materials and Techniques for Electromagnetic Shielding

Dear Colleagues,

The Special Issue “Coatings About Materials and Techniques for Electromagnetic Shielding” will further explore the latest progress in the design of materials with superior electromagnetic interference shielding capabilities. The rapid development of mobile communication technology has led to the continuous emergence of new lightweight electronic devices; however, electromagnetic interference has brought many problems. This Special Issue will focus on innovative approaches to advanced coating designs to address electromagnetic interference. The Special Issue will include research on new composite coatings and breakthrough manufacturing technologies, demonstrating shielding materials with higher levels of absorption efficiency and versatility. By integrating material synthesis, structural design, characterization analysis techniques, and application evaluations, revealing transformational strategies to improve electromagnetic shielding will become an important resource for researchers and practitioners to understand and utilize cutting-edge shielding materials. The scope of this Special Issue includes, but is not limited to, the following:

1. Chemical, physical, and technological properties of coatings and related materials;
2. The latest technology for constructing multifunctional organic, inorganic, and hybrid coatings; including but not limited to electroless plating, electroplating, CVD, and plasma treatment;
3. Coatings that can be used to protect wood (organic polymers, metal coatings, and biomass such as cellulose coatings, etc.);
4. Multifunctional coatings for enhancement (electromagnetic shielding, hydrophobic, flame retardant, etc.);
5. Preparation of biomass-based multifunctional coatings; application reliability of high-performance coatings in extreme environments, such as high-temperature degradation, wear, corrosion, and UV aging.

Dr. Yanfei Pan
Prof. Dr. Jintian Huang
Prof. Dr. Xiaotao Zhang
Dr. Yu Wang
Guest Editors

Manuscript Submission Information

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