Special Issue "Structural Health Monitoring & Nondestructive Testing 2020"
Deadline for manuscript submissions: 30 November 2020.
Interests: infrared thermography; NonDestructive Evaluation (NDE) techniques and vision / digital systems for industrial inspection
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Interests: X-ray imaging, tomography, multi-energy, data fusion, defect detection and classification
Interests: NDE techniques, pattern recognition for industrial image processing
Interests: structural health monitoring, guided waves, piezoelectric transducers, optical fibers, probability of detection
Interests: infrared thermography; non-destructive testing, medical thermography, finite element modeling., hyperspectral imaging
Interests: Non-destructive Evbaluation, Infrared thermography, Terahertz Spectroscopy, Photo-thermal coherence tomography, Composite materials
The aim of the International Symposium on Structural Health Monitoring and Nondestructive Testing is to provide an overview of the latest breakthroughs in SHM and NDT and their interactions with various industrial sectors. Thanks to the success of the 2nd (2018, Saarbrücken, Germany) and of the 1st (2013, Lyon, France) symposia, it was decided to hold a third event with oral presentations, poster session and an industrial exhibition in Québec City, Canada on 14 and 15 of May 2020. SHM-NDT 2020 will be held back-to-back with the Annual General Meeting of the initiative, see www.ondutycanada.ca. Cross-fertilization between the two events is highly encouraged.
The Symposium is organized by Université Laval in partnership with the Canadian Institute for NonDestructive Evaluation (CINDE), the German Society for Nondestructive Testing (DGZfP e.V.), the French Society for Nondestructive Testing (Cofrend), INSA-Lyon, Fraunhofer IZFP, Fraunhofer EZRT.
This joint Special Issue is expected to select excellent papers in and out SHM-NDT 2020 in the following topics, but not limited to:
1) Structural health monitoring;
2) NDT sensors, detectors and sources: ultrasound, acoustical emission, X-ray, thermography, eddy currents, EMAT etc;
3) Modeling and simulation;
4) Reliability, probability of detection;
5) Sensor data fusion;
6) Reconstruction techniques;
7) Defect detection & localization methods;
8) Signal and image processing.
All papers (in and out SHM-NDT 2020) must be submitted by the deadline (see above). All selected and peer-reviewed papers will be organized as in a dedicated book with an ISBN number.
Prof. Xavier Maldague
Prof. Valérie Kaftandjian-Doudet
Prof. Ahmad Osman
Dr. Bastien Chapuis
Prof. dr. ir. Gunther Steenackers
Dr. Hai Zhang
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Structural health monitoring
- NDT sensors, detectors and sources: ultrasound, acoustical emission, X-ray, thermography, eddy currents, EMAT etc
- Modeling and simulation
- Reliability, probability of detection
- Sensor data fusion
- Reconstruction techniques
- Defect detection & localisation methods
- Signal and image processing…